YV180X_Ope_E.pdf - 第4页

iv Contents E PD8013110 13.2 Data replace ............................................................. 5-153 13.2.1 Data replace in mount information ............... 5-153 13.2.2 Data replace in component information ..…

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iii
E
PD8013110
Contents
4. Creating the mark information............................................ 5-72
4.1 Creating procedure ..................................................... 5-74
4.2 Various parameter settings .......................................... 5-76
4.3 Adjust Assistant commands ........................................ 5-82
5. Clamping the PCB ............................................................... 5-86
6. Creating the PCB information ............................................. 5-89
6.1 Creating procedure ..................................................... 5-91
6.2 PCB origin .................................................................. 5-96
6.2.1 Normal PCB origin position setting ................. 5-97
6.2.2 Setting the PCB origin at a position other than the
locate pin ........................................................ 5-98
6.2.3 Setting the PCB origin for multi-block PCB ...... 5-99
7. Creating the mount information ....................................... 5-100
8. Checking the data ............................................................. 5-106
8.1 Checking the component information ...................... 5-106
8.2 Checking the mount information .............................. 5-107
9. Data optimization ..............................................................5-111
9.1 Selecting the data ......................................................5-112
9.2 Setting optimization conditions .................................5-113
9.3 Optimizing the data ..................................................5-116
10. Mounting test and data correction .................................... 5-117
10.1 Making setups for mounting test ................................5-118
10.2 Starting the test mount .............................................. 5-121
10.3 Error countermeasures during mounting test ............. 5-124
10.3.1 PCB data error............................................... 5-125
10.3.2 Fiducial mark recognition error ..................... 5-126
10.3.3 Component pickup error ............................... 5-128
10.3.4 Component recognition error ........................ 5-130
10.3.5 Component mount error................................ 5-131
10.4 Correcting the data after mounting test ..................... 5-133
11. Data backup...................................................................... 5-136
11.1 Creating a PCB data disk .......................................... 5-137
11.2 Data backup ............................................................. 5-139
12. Teaching and trace ............................................................ 5-140
12.1 Trace ........................................................................ 5-140
12.2 Teaching ................................................................... 5-142
12.2.1 Point teaching ............................................... 5-142
12.2.2 Vision cursor teaching ................................... 5-143
12.3 Automatic trace ........................................................ 5-147
13. Data editing for production PCB....................................... 5-148
13.1 Data editing ............................................................. 5-148
13.1.1 Copying the specified range .......................... 5-148
13.1.2 Deleting the specified range .......................... 5-150
13.1.3 Inserting one line .......................................... 5-151
13.1.4 Deleting one line .......................................... 5-152
iv
Contents
E
PD8013110
13.2 Data replace ............................................................. 5-153
13.2.1 Data replace in mount information ............... 5-153
13.2.2 Data replace in component information ........ 5-156
13.3 Data sort .................................................................. 5-159
Chapter 6 Using various functions
1. Overview .............................................................................. 6-3
2. Using the block repeat function ............................................ 6-4
2.1 Creating the block repeat data ...................................... 6-5
2.2 Block conversion .......................................................... 6-9
2.2.1 Executing the block conversion ....................... 6-10
2.2.2 Reconverting to the block repeat data ............. 6-12
3. Creating the user database .................................................. 6-14
3.1 Copying from the component or mark information ..... 6-15
3.2 Copying from the YAMAHA database ......................... 6-17
4. Static component information ............................................ 6-20
4.1 Registering the static component information ............. 6-21
4.2 Static component matching ........................................ 6-22
5. Using the fiducial functions ................................................ 6-24
5.1 PCB fiducial and block fiducial functions ................... 6-25
5.2 Local fiducial functions .............................................. 6-27
5.2.1 Point fiducial and local fiducial functions ....... 6-29
5.2.2 4-point fiducial ............................................... 6-32
6. Using the badmark functions .............................................. 6-36
6.1 PCB badmark and block badmark .............................. 6-37
6.1.1 Operation flow................................................ 6-38
6.1.2 Registering the badmark information ............... 6-39
6.2 Local badmark ........................................................... 6-40
6.3 Creating the badmark information .............................. 6-43
7. Self production control ....................................................... 6-47
8. Alternative component function ......................................... 6-51
8.1 Multiplying the component data ................................. 6-52
8.2 Optimizing the feeder set positions ............................ 6-54
8.3 Alternative component number .................................. 6-55
8.4 Component switching flow ......................................... 6-56
9. Pattern matching................................................................. 6-57
9.1 Pattern registration ..................................................... 6-58
9.2 Using the pattern matching data ................................. 6-65
Supplement
1. Nozzle table...........................................................................S-3
Index
Safety and warranty
1. Safety ...................................................................................... 3
2. Warranty ................................................................................. 4
This section describes caution items you must observe to ensure safe
and correct use of the machine, and also explains basic warranty
rules. Be sure to read them carefully and follow the instructions
provided before using this machine.