KE2010.Instruction Manual.Ver.2.01,Rev.08.pdf - 第17页
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12.4 Procedure for Mounting the Matrix Tray Holder on the Feeder Bank .......... 5
12.5 Installing the Matrix Tray Changer (MTC)........................................................ 12-6
12.5.1 Installing the Matrix Tray Changer (MTC) ........................................... 12-8
12.6 Handling the Feeder Position Indicator (FPI)................................................... 12-10
12.7 Handling Bad Mark Sensor.............................................................................. 12-11
12.8 Handling HMS.................................................................................................. 12-12
12.9 Replacing Overall feeder exchange trolley...................................................... 12-13
12.10 Handling the IC Collection Belt........................................................................ 12-15
12.11 Handling a Portable Type Tray Server (DTS).................................................. 12-18
12.12 Handling a Gripper Nozzle............................................................................... 12-19
CHAPTER 13 MAINTENANCE
13.1 Daily Routine Checks....................................................................................... 13-1
13.1.1 List of daily routine checks .................................................................. 13-1
13.2 Check............................................................................................................... 13-3
13.2.1 Air pressure......................................................................................... 13-3
13.2.2 Piping and joint.................................................................................... 13-4
13.2.3 Unit air cylinder.................................................................................... 13-4
13.2.4 Air filter (Head) .................................................................................... 13-7
13.2.5 Air filter (CAL block)............................................................................. 13-8
13.2.6 Transport belt ...................................................................................... 13-9
13.2.7 Transport pulley................................................................................... 13-10
13.2.8 Notice on Electricity............................................................................. 13-11
13.3 Cleaning........................................................................................................... 13-12
13.3.1 XY axis direct drive unit....................................................................... 13-12
13.3.2 Transport sensors ............................................................................... 13-14
13.3.3 Laser align sensor............................................................................... 13-15
13.3.4 Nozzle.................................................................................................. 13-16
13.3.5 Nozzle outer shaft................................................................................ 13-18
13.3.6 ATC bracket......................................................................................... 13-20
13.3.7 Feeder bank ........................................................................................ 13-21
13.3.8 Z slider shaft........................................................................................ 13-22
13.3.9 CVS (Component Verification System) (Option) ................................. 13-22
13.3.10 Overall feeder exchange trolley (optional)........................................... 13-23
13.3.11 OCC (Polarizing filter).......................................................................... 13-24
13.3.12 Trackball ............................................................................................. 13-25
13.4 Lubrication ....................................................................................................... 13-26
13.4.1 XY-shaft direct drive unit ..................................................................... 13-26
13.4.2 Transport screw shaft (Shaft).............................................................. 13-27
13.4.3 Transport guide shaft........................................................................... 13-27
13.4.4 PWB stopper part................................................................................ 13-27
13.4.5 Ball screws and Linear way (Head part).............................................. 13-28
13.4.6 Backup table........................................................................................ 13-29
13.4.7 Movable board transport table ball screw and LM guide..................... 13-29
13.4.8 Overall feeder exchange trolley (optional)........................................... 13-30
13.5 Replacing the UPS Battery with a New One.................................................... 13-31
13.5.1 Removing the UPS.............................................................................. 13-31
13.5.2 Replacing Batteries ............................................................................. 13-34
13.5.3 Recycling the Used Battery ................................................................. 13-35
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DATABASE
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ERROR MESSAGES TABLE
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SPECIFICATIONS FOR A CE MACHINE
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1 − 1
CHAPTER 1 GENERAL
1.1 Highlights and Specifications
This machine is an SMD chip shooter designed as one of the KE-2000 series products
which are successors of the KE-700 series chip placers, and features high-speed chip
placement.
A host line computer (HLC) controls a line consisting the KE-2000 series chip
placer/shooter, KE-700 series chip placer, JUKI dispenser and solder-paste printer as
well as a line consisting of KE-2000 series chip placers/shooters only. This feature
allows you to configure a line which realizes high productivity and is appropriate for
every applications.
For software, WindowsNT is adopted as the Operating System (OS) to increase the
operability of this machine.
1.1.1 Highlights
– Equipped with the newly developed laser alignment sensors (MNLA) each of which
allows four nozzles to recognize components simultaneously. These four nozzles
simultaneously pick up and mount components whose size is up to 10 mm x 10
mm after centering them without touching: this allows high-speed mounting of
components, 11,000 cph (this is rough estimate calculated on the assumption that
four components are simultaneously picked up, then one component is
alternatively placed on the almost entire area of a 330 mm x 250 mm board).
– An offset correction camera, a height measurement device (option), and a feeder
preparation function (option) can be installed to minimize the time required for the
machine halt for preparation, realizing high operating ratio.
– An offset camera correction uses its pattern matching function to recognize a
fiducial mark at high speed. Together with high-speed board transfer, it provides
you with an overall high-speed placement capability.
– Pick and placement reliability is remarkably improved through chip rise detection
performed during laser/align measurement.
– The board support section (for backing up a board) is driven by a motor to prevent
any vibration from occurring when a clamped board is released, then prevent a
placed component from being shifted from the regulated position, shortening the
time required to clamp or release a board.
– Using the offset correction camera and the height measurement device,
preparation is possible without opening the cover, provided as good safety
features.
– Newly attached LED indicators (optional) (Feeder Position Indicator: FPI) on the
feeder setting section notify an operator that components run out, and generates
the warning on the number of the remaining components to increase the
operability for replacing components.
– WindowsNT increases the operability of the machine greatly.