KE2010.Instruction Manual.Ver.2.01,Rev.08.pdf - 第356页

5 − 3 The detailed t eaching item s are shown in T able 5.2 below . Table 5.2 Teaching items Mode during teaching Input data item Data origin Corrected by Boc alignment Corrected by Feeder bank recognition Reference pin …

5 − 2

5.2 Functions

(1) Coordinates teaching

The device names which can be taught and the teaching items are shown in Table

5.1 below. Note that the device names which are options not installed and those

designated as “Not to be used” on the Machine Setup menu cannot be selected.

Table 5.1 Teaching device and teaching items

Teaching coordinates (

○

): can be taught

Teaching device

X/Y

coordinates

Z coordinates

θ coordinates

Mark recognition

parameter

MNLA Head

○

FMLA Head

○

Bad mark sensor

○

OCC camera

○

OCC2 camera

○

HMS

○

The 1 POINT, 2 POINT, and 3 POINT device keys on the HOD become effective

when OCC camera is selected as the teaching devices. The 1 POINT key is the

default key when a device is selected.

When any other device key on the HOD is pressed while the machine is teaching

coordinates, the newly selected device moves to the coordinates defined by the

currently selected device, thus switching the device to be taught.

5 − 3

The detailed teaching items are shown in Table 5.2 below.

Table 5.2 Teaching items

Mode during

teaching

Input data item Data origin

Corrected by

Boc

alignment

Corrected by

Feeder bank

recognition

Reference pin position XY coordinates origin

Follower pin position XY coordinates origin

Shape clamp position XY coordinates origin

MTC shuttle pick position XY coordinates origin

Component discard position XY coordinates origin

Vacuum value without nozzle

Machine

setup

Head waiting position XY coordinates origin

Hole reference position Board reference position ○

PWB layout offset Board reference position ○

Circuit position reference Board reference position ○

BOC mark position

Board reference position or

circuit reference position

*1 ○

BOC mark recognition

parameter

Bad mark position Circuit reference position ○

PWB height

PWB

PWB thickness

Placement position

Board reference position or

circuit reference position

*2 ○

Placement

data

IC mark position

Board reference position or

circuit reference position

*2 ○

Pick position XY

XY coordinates origin or rear

origin

*3 ○

Production

program

Pick data

Pick position Z

Z-axis origin (Top side of a

board)

Placement position XY

Board reference position or

circuit reference position

*2 ○

Pick position XY

XY coordinates origin or rear

origin

*3 ○

Production

Pick position Z

Z-axis origin (Top side of a

board)

* 1 For single pattern boards, the board reference position is used as the origin.

For matrix and non-matrix multiple pattern boards, when “PWB mark is used” is

selected as the BOC type board reference position is used as the origin, and when

“circuit mark is used” is selected as the BOC type the circuit reference position is

used as the origin.

* 2 For single pattern boards, the board reference position is used as the origin.

For matrix and non-matrix multiple pattern boards, the circuit reference position is

used as the origin.

* 3 For pick position of the component feeding devices installed on the front of the

machine, XY coordinates origin is used as the origin. For those installed on the

rear of the machine, the rear origin is used as the origin.

5 − 4

CAUTION

If the feeder bank is never recognized (since the machine is zeroing, or

the bank moves down then up), it may be recognized automatically

before the machine moves to the pick position. Since the head moves

across the feeding device while the bank mark is being recognized, do

not place your hand in the machine, nor move your face or head close

to the machine. Especially, take care when the feeder bank is

recognized not from the menu but while the machine is teaching or

tracking a pick position.

(2) Teaching recognition

The data obtainable by teaching recognition is shown below.

①

BOC mark shape, mark size, data required for projection data recognition, and

area window for balance detection

②

IC mark shape, mark size, data required for projection data recognition, and

area window for balance detection

Notes: 1) During recognition teaching, the device is set for a camera only, and it

cannot be changed.

2) When Zeroing has not been performed yet or the machine is in servo

free state, recognition teaching cannot be performed.

3) XY coordinates for the mark shall be entered beforehand.