KE2010.Instruction Manual.Ver.2.01,Rev.08.pdf - 第27页

1 − 10 Description of abbreviations ATC : Aut omatic T ool Changer OCC : Off set Corre ction C amera EPU : Exter nal Prog ramm ing Unit HLC : Host Line Computer HOD : Handheld O perating Device MTC : Matrix Tr ay Changer…

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1.1.3 System configuration
Color liquid-crystal display (LCD)
Keyboard
Track ball
FDD
HDD
100 Base/10 Base Ethernet board T
Rear side operation unit
Area sensor
Signal tower
Emergency stop button
Optional
Spare feeder exchange trolley function
UPS
Placing head
Laser recognition head (MNLA)
Offset correction camera
Automatic tool changer (ATC)
Feeder float detecting function
Pneumatic piping system
Vision Centering System (VCS)
Overall feeder exchange trolley function
Support for a 20-mm component
Feeder bank driver
Vision monitor
Feeder table
Pin reference
PWB conveyor unit
Placement station
Power unit
CPU board
I/O control CPU
Motor control unit
Cabinet
X-Y positioning unit
Verification function
Feeder position indicator function
Automatic tape cutter
Bulk feeder
Tape feeder
IC collection belt
Stick feeder
Stack stick feeder
Non-stop operation function
Tray holder
DTS
TR4SN
TR5SN/TR5DN
Host Line Computer (HLC)
KE-2010M /KE-2010L/KE-2010E
*1
*1
*1
*1
*1
*1
*1
*1
*1
Signal tower with the buzzer
Bad mark reader
Height Measurement System (HMS)
Shape clamp
Automatic PWB transportation width adjustment device
External Programming Unit (EPU)
Support for a 20-mm component
Support for a 20-mm component
*1
SOT Direction Check Function
Board Viewer
Note:
Options marked with an asterisk "*" are to be installed onto the main
unit at the factory.
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Description of abbreviations
ATC : Automatic Tool Changer
OCC : Offset Correction Camera
EPU : External Programming Unit
HLC : Host Line Computer
HOD : Handheld Operating Device
MTC : Matrix Tray Changer
PWB : Printed Wiring Board
VCS : Visual Centering System
HMS : Height Measurement System
CVS : Component Verification System
FPI : Feeder Position Indicator
MNLA : Multi Nozzle laser Align
DTS : Double Tray Server
MTS : Matrix Tray Server
MTC : Matrix Tray Changer
BMR : Bad Mark Reader
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1.1.4 Mechanical specifications
(1) Placement accuracy
The following table lists the placement accuracy data for different types of
components. A poorer accuracy results depending on the components that may
have an edge or plastic mold burrs at the area detected with the laser align
function, and that may have a moving part to be detected with respect to the pick
port.
Table 1.1.4.1
Unit: mm
Component type KE-2010
MNLA heads (Laser recognition correction)
Component size 20 or less
Square chip ± 0.08
MELF ± 0.1
SOT ± 0.15
Aluminum electrolytic capacitor ± 0.3
SOP ± 0.15 in the right angle direction against
the lead (Burr on one side: 0.15 or less)
±0.2 in the direction parallel to the lead
PLCC, SOJ ± 0.2
QFP, TSOP (Pitch: 0.8 or more) ± 0.12
QFP, TSOP (Pitch: 0.65 or more) ± 0.09
BGA ± 0.2
Other large-size components ± 0.3
(2) Placement cycle time
The optimized placement cycle time is shown below. The cycle time required
when a component is placed on a board actually varies depending on the board
size or how many times a nozzle is replaced.
When Five nozzles pick up and place components simultaneously and center
them with laser
Small chip component
11,000 components/hour 0.33 seconds/component)
The value above is a rough estimate calculated on the assumption that five
components are simultaneously picked up and one component are
simultaneously placed on the almost entire area of a 330 mm x 250 mm
board.
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Definition
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