KE2010.Instruction Manual.Ver.2.01,Rev.08.pdf - 第19页

1 − 2 1.1.2 Centering sy stem Instead of using conventional mechanical cent ering system , this machine uses touchless centering system where laser align sensor is used to read the posit ion and angle of components. This…

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CHAPTER 1 GENERAL

1.1 Highlights and Specifications

This machine is an SMD chip shooter designed as one of the KE-2000 series products

which are successors of the KE-700 series chip placers, and features high-speed chip

placement.

A host line computer (HLC) controls a line consisting the KE-2000 series chip

placer/shooter, KE-700 series chip placer, JUKI dispenser and solder-paste printer as

well as a line consisting of KE-2000 series chip placers/shooters only. This feature

allows you to configure a line which realizes high productivity and is appropriate for

every applications.

For software, WindowsNT is adopted as the Operating System (OS) to increase the

operability of this machine.

1.1.1 Highlights

– Equipped with the newly developed laser alignment sensors (MNLA) each of which

allows four nozzles to recognize components simultaneously. These four nozzles

simultaneously pick up and mount components whose size is up to 10 mm x 10

mm after centering them without touching: this allows high-speed mounting of

components, 11,000 cph (this is rough estimate calculated on the assumption that

four components are simultaneously picked up, then one component is

alternatively placed on the almost entire area of a 330 mm x 250 mm board).

– An offset correction camera, a height measurement device (option), and a feeder

preparation function (option) can be installed to minimize the time required for the

machine halt for preparation, realizing high operating ratio.

– An offset camera correction uses its pattern matching function to recognize a

fiducial mark at high speed. Together with high-speed board transfer, it provides

you with an overall high-speed placement capability.

– Pick and placement reliability is remarkably improved through chip rise detection

performed during laser/align measurement.

– The board support section (for backing up a board) is driven by a motor to prevent

any vibration from occurring when a clamped board is released, then prevent a

placed component from being shifted from the regulated position, shortening the

time required to clamp or release a board.

– Using the offset correction camera and the height measurement device,

preparation is possible without opening the cover, provided as good safety

features.

– Newly attached LED indicators (optional) (Feeder Position Indicator: FPI) on the

feeder setting section notify an operator that components run out, and generates

the warning on the number of the remaining components to increase the

operability for replacing components.

– WindowsNT increases the operability of the machine greatly.

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1.1.2 Centering system

Instead of using conventional mechanical centering system, this machine uses

touchless centering system where laser align sensor is used to read the position and

angle of components. This can be achieved by detecting the shade of the

components created by the laser rays applied horizontally to the components.

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Figure 1.1.2.1

By moving Z-axis up and down, a component is picked with vacuum, and the laser is

applied to the component. A shade is made where the laser is obstructed by the

component. By turning the component along q-axis, the shade changes.

According to the change of the shade, offsets of the position and angle of the picked

component are calculated. These offsets are corrected when mounting.

The laser align sensor conforms to IEC825 Class 1 and CDRH Class 1 regulations.

The laser align sensor can be used safely as far as it is used by following the

instructions described in this manual.

CAUTION

Any operation of controls and adjustments which is not described in

this manual can cause an excessive exposure of laser lays which

may be dangerous to human bodies.

Laser align sensor

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(1) Flow of laser align centering

ABCDE

(-) Rotation

(preload)

(+) Rotation

Correction

Part attracting

Placement

Correction Preload

d Yd X

Rotate in (-) direction along

θ-axis. (Preload)

Pick the component by driving

Z-axis, and adjust the

component at laser align height.

Rotate in (+) direction along

θ-axis, and start measurement

with laser align.

Placement is performed by

correcting position offset (dX,

dY) and angle offset (dθ).

While measuring the shade, find two

positions and where the shade

is minimum.

Because the nozzle center is a known

factor, according to the difference

between the nozzle center and the

component center, offset in Y direction

(dX) and that in X direction (dY) can

also be known. By referring to the

encoder output of the θ motor at or

, offset angle dθ can also be known.

(Compo-

nent

center)

(Nozzle

center)

Laser align measurement

Figure 1.1.2.2

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