Omron V-TS Teaching Manual.pdf.pdf - 第35页
Chapter 2 Inspection Programm ing 2-8 Component Types This s y s tem classif ies components under the follo wing categories. Component T ype Chip Resistor Chip Capacitor Other Chip Components Resistor Array (Micro- Lea…
2.1 Basics of Teaching
2-7
90°
0°
180°
270°
Chapter 2 Inspection Programming
2-8
Component Types
This system classifies components under the following categories.
Component Type
Chip Resistor
Chip Capacitor
Other Chip Components
Resistor Array
(Micro-Lead)
Resistor Array (Castellated
Electrode)
Other Arrays (Non-Lead)
MELF Component
2 Pin Mini Mold Package
Inward L-Lead Package
Electrolytic Capacitor
Transistor
Power Transistor
SOP
QFP
SOJ
QFJ
SON (Micro-Lead)
QFN (Micro-Lead)
SON (Non-Lead)
QFN (Non-Lead)
Connector
BGA/CSP
Other Non-Lead Packages
Other Bottom Surface
Electrode Components
Other Lead Packages
Insertion Component
2.1 Basics of Teaching
2-9
Electrode Types
This system provides inspection in a specific way depending on the defined electrode type.
The types of electrode that can be defined are determined according to the component types.
Electrode Type
Chip-Type Electrode
Chip Resistor
Chip Capacitor
Other Chip Components
MELF Component
Castellated Electrode
Resistor Array (Castellated
Electrode)
Gull-Wing Lead
2-Pin Mini-Mold Package
Transistor
Power Transistor
SOP, QFP
Connector
Other Lead Packages
Flat Lead
2-Pin Mini-Mold Package
Electrolytic Capacitor
Transistor
Power Transistor
Connector
Other Lead Packages
Micro-Lead
Resistor Array (Micro-Lead)
2-Pin Mini-Mold Package
Transistor
SON (Micro-Lead)
QFN (Micro-Lead)
Other Lead Packages
Non-Lead
Other Arrays (Non-Lead)
SON (Non-Lead)
QFN (Non-Lead)
Connector
Other Non-Lead Packages
Inward L-Lead
Inward L-Lead Package
J-Lead
SOJ
QFJ
Insertion Leads
Insertion Component