KJ-01.02.Instruction Manual.REV.02.pdf - 第16页
v CHA PTER 13 HA NDLING TH E FEEDERS A ND OPTIONS 13.1 Replacem ent of the T ape Feeder .................................................................... 13-1 13.1.1 Replacem ent of the tape f eeder (8 m m , 12 mm , 1…
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8.3 Errors Occurring During Production................................................................. 8-33
8.4.1 Run-out of components stock.............................................................. 8-33
8.3.2 Mark recognition error.......................................................................... 8-34
8.3.3 Cover was open................................................................................... 8-35
8.3.4 Detect feeder sensor ........................................................................... 8-35
8.3.5 Production continues ........................................................................... 8-37
8.4 Trial Run........................................................................................................... 8-38
8.4.1 Starting the trial run.............................................................................. 8-40
8.4.2 Display of the production status........................................................... 8-40
8.4.3 Placement tracking.............................................................................. 8-41
8.5 Blank Run......................................................................................................... 8-44
8.5.1 Starting the blank run........................................................................... 8-45
8.5.2 Display of the production status........................................................... 8-46
8.5.3 Placement tracking.............................................................................. 8-46
8.6 Production Options........................................................................................... 8-49
CHAPTER 9 FILE MAINTENANCE
9.1 Copying a File .................................................................................................. 9-1
9.2 Deleting a File .................................................................................................. 9-4
9.3 Renaming a File............................................................................................... 9-5
9.4 Creating a Directory......................................................................................... 9-6
9.5 Deleting a Directory.......................................................................................... 9-6
9.6 Formatting a Disk............................................................................................. 9-7
9.7 Deleting Template Data ................................................................................... 9-7
9.8 Setting the Time and Date ............................................................................... 9-8
CHAPTER 10 I/O MANUAL CONTROL
10.1 I/O Manual Control ............................................................................................ 10-1
10.2 List of I/O Manual Control Setting Items .......................................................... 10-2
10.3 Overview of I/O Manual Control Menu Configuration....................................... 10-3
10.4 Operations........................................................................................................ 10-7
10.4.1 Moving the axes................................................................................... 10-7
10.4.2 Head control......................................................................................... 10-11
10.4.3 Conveyor control.................................................................................. 10-13
10.4.4 Laser control........................................................................................ 10-14
10.4.5 Vision................................................................................................... 10-15
10.4.6 Others.................................................................................................. 10-16
Chapter 11 PRINTING
11.1 Overview of Printing Operations ...................................................................... 11-1
11.1.1 Printing................................................................................................. 11-1
11.1.2 List of printable data............................................................................. 11-1
11.2.1 Operations ........................................................................................... 11-3
CHAPTER 12 OTHER FUNCTIONS
12.1 Emergency Stop............................................................................................... 12-1
12.2 Idle Mode.......................................................................................................... 12-2
12.3 Warming Up..................................................................................................... 12-4

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CHAPTER 13 HANDLING THE FEEDERS AND OPTIONS
13.1 Replacement of the Tape Feeder.................................................................... 13-1
13.1.1 Replacement of the tape feeder
(8 mm, 12 mm, 16 mm, 24 mm, and 32 mm) ..................................... 13-1
13.1.2 Replacement of 32-mm adhesive tape feeder .................................... 13-2
13.2 Replacement of the Bulk Feeder..................................................................... 13-3
13.3 Replacement of the Stick Feeder .................................................................... 13-4
13.4 Procedure for Mounting the Matrix Tray Holder on the Feeder ....................... 13-5
13.5 Handling the Bad Mark Sensor........................................................................ 13-6
CHAPTER 14 MAINTENANCE
14.1 Daily Routine Checks....................................................................................... 14-1
14.1.1 List of daily routine checks .................................................................. 14-1
14.2 Check............................................................................................................... 14-2
14.2.1 Air pressure......................................................................................... 14-2
14.2.2 Piping and joint.................................................................................... 14-3
14.2.3 Unit air cylinder.................................................................................... 14-3
14.2.4 Air filter (Head).................................................................................. 14-5
14.2.5 Transport belt ...................................................................................... 14-6
14.2.6 Transport pulley................................................................................... 14-7
14.2.7 Notice on Electricity............................................................................. 14-8
14.3 Cleaning........................................................................................................... 14-9
14.3.1 XY axis direct drive unit....................................................................... 14-9
14.3.2 Transport sensors ............................................................................... 14-11
14.3.3 Laser align sensor (MNLA/FMLA head).............................................. 14-12
14.3.4 Nozzle.................................................................................................. 14-13
14.3.5 ATC ..................................................................................................... 14-17
14.3.6 Feeder bank ........................................................................................ 14-18
14.3.7 Z slider shaft........................................................................................ 14-18
14.3.8 OCC (Polarizing filter).......................................................................... 14-19
14.3.9 Glass of VCS (only for a KJ-02) .......................................................... 14-20
14.3.10 Trackball.............................................................................................. 14-21
14.4 Lubrication ....................................................................................................... 14-22
14.4.1 XY-shaft direct drive unit ..................................................................... 14-22
14.4.2 Transport guide shaft........................................................................... 14-23
14.4.3 PWB stopper part................................................................................ 14-23
14.4.4 Ball screws and Linear way (Head part) (KJ-02)................................. 14-24
14.4.5 Backup table........................................................................................ 14-25
ERROR MESSAGES TABLE
........................................................................................ 1
1 − 1
CHAPTER 1 GENERAL
1.1 Features and Specifications
This machine is an SMD chip mounter of compact design: its main unit dimensions
are 700 mm × 375 mm × 1300 mm (width/depth/height). Its two centering methods
that do not have to touch any component, by laser beam and the Visual Centering
System (VCS), allow components such as a chip and fine-pitch IC to be placed on a
board highly precisely.
1.1.1 Features
− Equipped with a laser alignment head (LAHD) as a standard device that allows
components from a 0603 chip to a 20 mm × 20 mm or 23.5 mm × 11 mm
component to be placed on a board in 0.9 seconds per component (when optimal)
highly precisely.
− Equipped with a VCS as a standard device also that has the fixed type of side light,
which allows the machine to center the maximum 24 mm × 24 mm components
such as a 0.3-mm pitch QFP, BGA and FBGA: this realizes the highly-precise
placement of components in 2 seconds per component when optimal.
− Equipped with an offset correction camera as a standard device, which allows the
machine to recognize a PWB pattern with the pattern matching function or
recognize various types of board marks.
− Frames of high rigidity are adopted for the XY unit, and the full-closed loop control
with the magnetic scale enables highly precise placement of components that is
available with a KE-series chip mounter.
− The standard device, automatic PWB transport device, which can handle up to 8”
×6” (203.2 mm × 152.4 mm) board, allows you to set a board without putting your
hand inside the machine.
− With succeeding the operability of a KE-750/760, a track ball is provided as an
optional device.