KJ-01.02.Instruction Manual.REV.02.pdf - 第166页

5 − 70 ⑭ Laser algorit hm Select t he algorit hm f or laser r ecognition in t he float ing menu. Figure of Laser algorithm setti ng ⑮ Release check Using t he f loating menu, set whether to check to see if a component is…

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⑦ Picking Z up

Using this floating menu, set the acceleration (for preventing the

components from dropping) of Z-axis up movement at pick position. The

items to be selected are the same as those of the XY speed above.

⑧ Placing Z down

Using this floating menu, set the acceleration (for preventing the

components from unsteady placement) of Z-axis down movement at pick

position. The items to be selected are the same as those of the XY speed

above.

For very small chips fed from a tape feeder, designate Mid. or Slow if

components are not steady placed.

This can also be used for stress adjustment of the components in vertical

direction.

⑨ Placing Z up

Using this floating menu, set the acceleration (for preventing the

components from being picked up) of Z-axis up movement at placement

position. The items to be selected are the same as those of the XY speed

above.

⑩ Theta speed

Using the floating menu, set the θ rotation speed (for preventing the

component from being shifted) of all rotating operations except rotation for

the LA measurement while the head is waiting for a component. The items to

be selected are the same as those of the XY speed above.

⑪ Compo abandonment

Using the floating menu, set where to discard a component.

− Trash Box : Discards a component into the trash box.

− Trash conveyor : Discards a component onto the IC collection belt.

Select this setting mainly for the IC component type.

Figure of Compo abandonment setting

⑫ Placing offset (X, Y)

Using the formula bar, enter the placement offset for unsymmetric

components whose center of the dimensions differ from the pick point of the

nozzle.

⑬ Laser height

Enter the offset from the surface of the component to the laser using the

formula bar.

This shall be adjusted for the components of not ordinary shape.

For details, see Chapter 1 “GENERAL”.

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⑭ Laser algorithm

Select the algorithm for laser recognition in the floating menu.

Figure of Laser algorithm setting

⑮ Release check

Using the floating menu, set whether to check to see if a component is stuck

even after it is placed with an LA when an LA centering component is

placed.

Figure of Release check setting

⑯ Tombstone detection

Using the floating menu, select whether to detect chip rise. When you select

“Yes”, the reference value is calculated from the dimensions of a component,

then the default reference value is automatically set. If you change the

dimensions of a component, the default reference value is recalculated.

Figure of Tombstone detection setting

A) Reference value (Width)

Using the formula bar, you can change the dimensions (width and length)

which are used to decide whether a component rise occurs. The entry

range is from 0 to the width/length/height multiplied with 2.

B) Reference value (Length)

Using the formula bar, you can change the dimensions (width and length)

which are used to decide whether a component rise occurs. The entry

range is from 0 to the width/length/height multiplied with 2.

C) Reference value (Height)

Using the formula bar, you can change the dimensions (height) which is

used to decide whether a component rise occurs. The entry range is from

0 to the width/length/height multiplied with 2.

Figure of Reference value setting

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⑰ Dimension check

(* The current version of the machine (1.00) cannot use this function.)

Using the floating menu, select whether to check the dimensions of a

component. When you select “Yes”, the dimensions of a component are

automatically set as the standard dimensions, then the default value. If you

change the dimensions of a component, the default value of the standard

size is reset.

Figure of Dimension check setting

− This inspection is available only if one of the following conditions is

satisfied:

- Components are square chips, Melf, or SOTs.

− Inspection standards

The dimensions limits (upper and lower) of a component (width and

length) are internally calculated with using the following parameters.

When the dimensions exceed the upper limit or lower limit at recognition,

the component error occurs because of a different size of component.

A) Standard size (Width and Length)

Using the formula bar, you can change the component dimensions (width

and length) which is used to decide whether the component dimensions

are appropriate. The entry range is from 0 to the actual dimensions.

B) W. Judge (Max, Min)

Using the formula bar, you can change the ratio to the standard width (Std.

Size W.) in the range from 1 % to 100 %. The smaller value you enter,

the stricter check the machine performs.

C) L. Judge (Max, Min)

Using the formula bar, you can change the ratio to the standard size in

the range from 1 to 100%. Smaller this value is, the stricter inspection is

performed.

Figure of Inspection standards setting