KJ-01.02.Instruction Manual.REV.02.pdf - 第27页
1 − 11 1.1.6 A pplicable components and packages (1) Applicable component sizes (For laser recognit ion) Com ponent heig ht : Min. 0.3 mm Max . 12mm Com ponent size : Min. 0.6 X 0.3 mm Max . 20 mm or 23.5 x 1 1 m m Lead …
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1.1.5 Electrical specifications
• Control Systems
Table 1.1.5.1
Item Control system Resolution
X-Y Closed loop by AC servo motor 0.010mm
Z Semi-closed loop by AC servo motor 0.00125mm
θ (When the machine
operates normally) (KJ/01/02)
Semi-closed loop by AC servo motor
0.02°
θ (When the machine uses a
VCS to recognize a component
and places it on a board)
(KJ/01/02)
Closed loop method with the AC servo motor
and the detailed resolution encoder.
0.005°
• Main CPU
32 bitcpu
• Display
Character display : 10" color
Graphics display : 9" monochrome
• Data and program input/output
A program which has been generated with an external programming device or
manually created from the keyboard can be input by means of a 3.5" floppy disk.
(2HD/1.44 MB type only)
• Printer interface
Centronics interface
• Number of placement points
Up to 2000 placement points can be defined per program.
For multi-matrix PWBs, up to 10000 points can be defined, which is the number of
circuits multiplied by the number of placement points.
• Power requirements
Voltage : single-phase, 200 V AC (220 V, 230 V, 240V)
Apparent power : 1.1 kVA
Frequency : 50/60 Hz
1 − 11
1.1.6 Applicable components and packages
(1) Applicable component sizes (For laser recognition)
Component height : Min. 0.3 mm
Max. 12mm
Component size : Min. 0.6 X 0.3 mm
Max. 20 mm or 23.5 x 11 mm
Lead pitch : Min. 0.65 mm
(2) Applicable component sizes
Table 1.1.6.1
Component Name and Type Package
Square chip resistor 1005, 1608, 2012, 3216, 3225 (5025, 6432), 0603
Network resistor (Excluding SOP, SOJ, PLCC types)
MELF resistor 1.6 X ø1.0, 2.0 X ø1.25, 3.5 X ø1.4, 5.9 X ø2.2 mm
Laminated ceramic capacitor 1005, 1608, 2012, 3216, 3225, 4532, 5750 (5632), 0603
Tantalum chip capacitor 3216, 3528, 6032, 7343
Aluminum electrolytic capacitor Height: 12.0 mm or less
Chip film capacitor
Variable trimmer capacitor, Chip potentiometer, trimmer
Chip ferrite beads
Chip inductor
Tape
SOT molded part 1608/2012, SOT-23, SOT-89, SOT-143, SOT-223
SOP 8, 14, 16, 18, 20, 24, 28 pin or 23.5 x 11mm or less
SOJ 16, 18, 20, 24, 26, 28 , 32pin
PLCC 18, 20, 22, 28 (Square), 28 (Rectangle), 32, 44 pins
QFP, BQFP Pitch 0.65/0.8/1.0mm 20 mm x 20 mm or less, 23.5 x 11mm or less
BGA 20 mm x 20 mm or less, 23.5 x 11mm or less
Connector
Pitch: 0.65 or more
Dimensions: 20 mm x 20 mm or less, or 23.5 mm x 11 mm or less
Recognizable with laser
IC socket
Pitch: 0.65 or more
Dimensions: 20 mm x 20 mm or less, or 23.5 mm x 11 mm or less
Recognizable with laser
Tape
Stick
Tray
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Note: For the shape of chip components to be mounted
(1) For the parts whose shape is cylindrical, there is no minimum shade when turned,
and chip recognition by laser align is therefore impossible.
(2) A poor pickup or placement accuracy could result if the top surface of the
component to be placed is curved, protruded, or dented. Avoid using such
components. (Some such components may, however, be handled by changing
the nozzle number.)
<Typical pickup failures>
MO
MO
<Typical poor placement accuracy>
Picku
p
nozzle
Slotted
g
roove
Embossed characters
Dented
Laser reco
g
nition