IPC-TM-650 EN 2022 试验方法.pdf - 第102页

1.0 Scope This procedure determines the percent metal content for solder paste. 2.0 Applicable Documents None 3.0 Test Specimen 50 grams of solder paste 4.0 Equipment/Apparatus Balance Crucible or Beaker Heat Source Flux…

100%1 / 824
1.0
Scope
This
method is designed to determine dimen-
sional conformance to specification of production-cut panels
of laminate or prepreg for length, width, and perpendicularity.
2.0 Applicable Documents
IPC-PC-90
3.0
Test Specimens
3.1 Size
Production
cut panels in the dimensions intended
for shipment shall be used.
3.2
Sampling
Sampling
rates shall be in accordance with
the applicable specification. (Also see 6.1.)
4.0
Apparatus or Material
Unless
otherwise specified,
precision of measurement apparatus shall be in accordance
with the applicable specification.
4.1
Vernier
calipers capable of measuring up to 914 ± 6.4
mm [36.0 ± 0.25 in] or equivalent.
4.2
Tape
measure capable of measuring up to 1829 mm
[72.0 in]
4.3
Carpenters
square, or equivalent
4.4
Pin
gauges, dial indicators or equivalent
5.0
Procedure
5.1 Length
Measure
the length of the edges of the panel
that are parallel to the grain direction using a vernier caliper.
5.2
Width
Measure
the length of the edges of the panel
that are perpendicular to the grain direction using a vernier
caliper.
5.3
Perpendicularity
5.3.1 Method A: by diagonals
5.3.1.1
Measure
the diagonals of the panel using vernier
caliper or tape measure.
5.3.1.2
Calculate
perpendicularity as follows:
D = D1–D2 (Maximum allowable difference in diagonals)
Where:
D1
=
√
(L + T)
2
+ W
2
D2
=
√
(L − T)
2
+ W
2
L
= Nominal length of panel [ins]
W = Nominal width of panel [ins]
Tii = Tolerance in inches per inch for perpendicularity
shown in the procurement document.
T = Tii x W (Tolerance in inches)
5.3.1.3
Calculate
the actual difference in the diagonals from
the measurements taken.
5.3.1.4 Compare
the actual difference to the allowable
maximum.
5.3.2
Method B: By carpenters square (‘‘Right Angle’’
Square)
5.3.2.1
Place
the panel in the carpenters square, contacting
the square by at least two corners.
5.3.2.2
Using
suitable means (see 4.4) measure the dis-
tance of the panel’s corner that does not contact the square.
5.3.2.3
Calculate
the perpendicularity by dividing the dis-
tance by the length of the longest dimension of the panel.
5.4
Evaluation
Compare
the measurements with dimen-
sional requirements of the applicable specification. Record the
number of panels that do not comply. Record the number of
noncomplying panels for each dimension—length, width, and
perpendicularity.
5.5
Report
the number of panels, specifying which dimen-
sion, that do not comply with the applicable specification.
6.0 Notes
6.1
Sampling
may also be determined by IPC-PC-90 on
materials produced by continuous processing.
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062
IPC-TM-650
TEST
METHODS MANUAL
Number
2.2.19.1
Subject
Length,
Width and Perpendicularity of Laminate
and Prepreg Panels
Date
12/94
Revision
Originating Task Group
MIL-P-13949 Test Methods Task Group (7-11b)
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
age1of1
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1.0
Scope
This
procedure determines the percent metal
content for solder paste.
2.0
Applicable Documents
None
3.0
Test Specimen
50
grams of solder paste
4.0
Equipment/Apparatus
Balance
Crucible
or Beaker
Heat Source
Flux Solvent
5.0
Procedure
5.1 Preparation
5.1.1
Weigh
10 to 50 grams (to the nearest 0.01 gram) of
solder paste into a tared vessel suitable for melting the solder
paste.
5.2
Test
5.2.1
Melt
the solder at approximately 25°C above liquidus
of the alloy, remove from heat and allow solder to solidify.
5.2.2
Extract
melt from residual flux with a suitable solvent,
dry and weigh metal to within 0.01 grams to determine %
metal content.
5.3
Evaluation
Weight
of extracted metal
Weight
of original sample
x 100 = % Metal
Enter the results in Table 1 ‘‘Test Report on Solder Paste.’’
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062
IPC-TM-650
TEST
METHODS MANUAL
Number
2.2.20
Subject
Solder
Paste Metal Content by Weight
Date
1/95
Revision
Originating Task Group
Solder Paste Task Group (5-24b)
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
age1of2
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T
able 1 Test Report on Solder Paste
Enter appropriate information in top portion of report and complete report by entering the test results or checkmarks in the appropriate spaces.
Inspection Purpose: QPL I.D. Number:
__
Qualification Manufacturer’s Identification:
__ Quality Conformance A Manufacturer’s Batch Number:
__
Quality Conformance B Date of Manufacture:
__
Shelf-Life Extension Original Use-By Date:
__
Performance Revised Use-By Date:
Date
Inspection Completed:
Overall
Results: __ Pass __ Fail
Inspection Performed by:
W
itnessed by:
Inspections
User’s
Actual
Requirement Test Result P/F (*) Tested by & Date
Material
Visual
Metal Content
Viscosity
Solder Ball
Slump
Alloy
Flux
Powder Size
% In Top Screen
% In Next Screen
% In Bottom Screen
% In Receiver Bottom
Max. Powder Size
Powder Shape
Tack
Wetting
* P/F = PASS/FAIL; enter P if test results are within tolerance of actual requirement; otherwise, enter F
IPC-TM-650
Number
2.2.20
Subject
Solder
Paste Metal Content by Weight
Date
1/95
Revision
P
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