IPC-TM-650 EN 2022 试验方法.pdf - 第738页

5 Data Reporting 5.1 Report both percent values calculated in sections 3.6.1 and 4.4.1. The Service Temperature value, in units of °C, shall be based upon the lesser of the two reported percent values calculated in secti…

3.6.2 Report the results of the visual examination evaluation

in 3.4.9.

Dielectric Strength Using ASTM D-149 Test Procedure

4.1 Specimen Preparation

4.1.1

Prepare a specimen of the metal-clad flexible base

material large enough [approximately 400 mm x 500 mm

[approx. 16 in x 20 in]] to prepare at least twelve test speci-

mens each of 80 mm x 80 mm [approx. 3.0 in x 3.0 in]. Cover

materials shall be prepared per 3.2. Adhesive bonding films

shall be prepared per 3.3 where copper foil is used on both

sides of the adhesive bonding film.

4.1.2 Remove (etch) all metal from both surfaces of the

400 mm x 500 mm [approx. 16 in x 20 in] specimen by stan-

dard industry practice. Rinse the etched material thoroughly.

Cut the minimum of twelve test specimens to their nominal

size of 80 mm x 80 mm [approx. 3.0 in x 3.0 in].

4.2 Conditioning and Aging Procedure

4.2.1

After generating the minimum of twelve specimens as

described in 4.1.1, all specimens shall be subjected to a sta-

bilization period of a minimum of 24 hours at 23 °C±2°C

[73.4 °F ± 3.6 °F] and 50% RH ± 5% RH.

4.2.2 Examine at least twelve specimens using normal or

corrected 20/20 (also termed 6/6 or 1.0) vision, and record

any presence of any wrinkles, cracks or blisters. Discard those

specimens showing the presence of any wrinkles, cracks or

blisters.

4.2.3 Six specimens examined in 4.2.2 shall be placed into

an air-circulating oven at the desired Service Temperature

value. The oven temperature shall be held at a tolerance of ±

3 °C [± 5.4 °F]. The specimens are to continuously remain in

the oven for 1000 hours, -0 hours / +12 hours.

4.2.4 After being oven-conditioned as described in 4.2.3,

the test specimens shall be cooled to room temperature at

standard ambient laboratory conditions. After being cooled to

room temperature, the oven-conditioned specimens shall be

subjected to a stabilization period of a minimum of 24 hours

at 23 °C ± 2° C [73.4 °F ± 3.6 °F] and 50% ± 5% RH.

4.2.5 After the stabilization period in 4.2.4, examine the six

specimens that had been subjected to the oven- conditioning

using normal or corrected 20/20 (also termed 6/6 or 1.0)

vision, and record the presence of any wrinkles, cracks or

blisters.

4.3 Measurement of Dielectric Strength

4.3.1

The six specimens that were not subjected to the

oven-conditioning in 4.2.3 shall be subjected to the dielectric

strength test per ASTM D-149. (These measurements shall

be considered the ‘‘as-received’’ dielectric strength values.)

4.3.2 The ‘‘thermally aged’’ (oven-conditioned) specimens

examined in 4.2.5 shall be tested for dielectric strength

according to the conditions outlined in 4.3.1. (These measure-

ments shall be considered the ‘‘thermally-aged’’ dielectric

strength values.)

4.4 Evaluation of Results

4.4.1

Calculate the average dielectric strength of the six

‘‘as-received’’ specimens as measured in 4.3.1. Calculate the

average dielectric strength of the six ‘‘thermally aged’’ speci-

mens as measured in 4.3.2. Calculate the ratio of the average

value of the ‘‘thermally aged’’ dielectric strength divided by

the average value of the ‘‘as-received’’ dielectric strength to

determine the percentage retention of dielectric strength.

Record this number to ± 1% accuracy.

[Ave. of Six (6) Diel. Strengths of ‘‘Thermally Aged’’ Specimens]

[Ave. of Six (6) Diel. Strengths of ‘‘As Received’’ Specimens

x100=%ofDielectric Strength Retained

IPC-TM-650

Number

2.6.21

Subject

Service Temperature of Metal-Clad Flexible Laminate, Cover

Material and Adhesive Bonding Films

Date

6/11

Revision

Page4of5

5 Data Reporting

5.1

Report both percent values calculated in sections 3.6.1

and 4.4.1. The Service Temperature value, in units of °C,

shall be based upon the lesser of the two reported percent

values calculated in sections 3.6.1 and 4.4.1.

6 Notes

6.1

For specimen preparation, test results may vary

between specimens where the copper remains and those that

have had the copper removed from the nontest side. If the

flexible base material is supplied as single-clad and double-

clad, both must be tested.

6.2 For specimen preparation, test results may vary for the

same flexible base material, depending whether it is tested as

single- or double-clad.

6.3 Suitable procedures must be used to ensure that solder

does not remain on the test specimens after solder float.

6.4 For flexible base materials other than polyimide, the tem-

perature of the solder pot may be other than 288 °C [550 °F],

AABUS.

IPC-TM-650

Number

2.6.21

Subject

Service Temperature of Metal-Clad Flexible Laminate, Cover

Material and Adhesive Bonding Films

Date

6/11

Revision

Page5of5

1.0

Scope

This

test procedure measures the temperature

repeatability inside steam agers used to condition compo-

nents prior to solderability testing. It should be applied at

installation and after any modification to the equipment and/or

its location.

2.0

Applicable Documents

IPC-PC-90

General Requirements for Implementation

of Statistical Control

MIL-STD-202 Test methods for Electronics and Electrical

Components Parts

MIL-STD-750 Test Methods for Semiconductor Devices

MIL-STD-883 Test Methods of Microelectronics

MIL-STD-45662 Calibration Systems Requirements

ANSI/ASQC Z1.1 Guide for Quality Control Charts

ANSI/ASQC Z1.2 Control Chart Method of Analyzing Data

ANSI/ASQC Z1.3 Control Chart Method of Controlling Quality

During Production

ANSI/J-STD-002 Solderability Tests for Components Leads,

Terminations, Lugs, Terminals and Wires

3.0

Test Specimens

None

required

4.0

Apparatus

The

following test equipment shall be used

during the tests:

4.1

Type

T copper-constantan thermocouple wire, 24 AWG,

±0.5°C[±0.09°F] accuracy minimum, premium grade.

Note:

PTFE

insulation is preferred.

4.2 Thermocouple

Temperature Indicator, with an accuracy

of ±0.5°C[±0.9°F] minimum, with capability for type T thermo-

couples, and be calibrated in accordance with MIL-STD-

45662 or the equivalent.

It is recommended that the thermocouple indicator have

capability to log data and be able to take all readings within 2

minutes.

Since readings must be taken periodically, it is recommended

that the indicator have capability for pre-settable time delay

between measurements.

Note:

Although

the specific equipment used to develop this

method was as specified above, other thermocouple types

and temperature indicators may be used provided the require-

ments of 5.1 are met.

4.3

Hot

plate with 500 ml glass beaker

4.4

The

steam ager as used to perform component solder-

ability testing per MIL-STD-202, Method 208; MIL-STD-883,

Method 2003; or MIL-STD-750, Method 2026; or ANSI/J-

STD-002 as applicable.

5.0

Test Procedure

5.1 Thermocouple Calibration

All

thermocouples to be

used during the steam ager test shall first be checked.

Loosely bundle the thermocouples and place in a 500 ml

glass beaker of vigorously boiling water, heated by a hot plate.

Measure the temperature indicated by each thermocouple. All

thermocouples should indicate the same temperature ±0.5°C

[±0.9°F] to the local boiling point of water. If any thermocouple

differs by more this amount, the weld bead shall be reworked

(and all thermocouples reverified), or the thermocouple shall

be discarded for the purpose of this test.

5.2

Install Thermocouples

Install

the thermocouples in

the ager at the component level. All thermocouple weld beads

shall be at the same height ±6.35 mm [±0.25 in]. The distance

from the weld to the water shall be measured prior to the test.

All thermocouples shall be at least 25.4 mm [1 in] away from

any wall or bulkhead. The thermocouples should be distrib-

uted evenly around the normal working area inside the ager,

and the location shall be recorded. Ten thermocouples shall

be used in larger agers, eight in smaller agers. For example, if

the ager uses five small drawers, a thermocouple centered in

the front and back halves of the drawer would be sufficient. If

no drawers are used, the thermocouples should be distrib-

uted around the areas where parts are usually placed.

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.6.23

Subject

Test

Procedure for Steam Ager Temperature

Repeatability

Date

7/93

Revision

Originating Task Group

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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