IPC-TM-650 EN 2022 试验方法.pdf - 第379页
5.2.3.2 Place the substrate on the hot plate. As soon as the solder has melted, withdraw the substrate from the hot plate maintaining a horizontal position. The reflow shall occur within 20 seconds after the specimen is …
1.0
Scope
This
test is carried out to determine the reflow
properties of the solder paste. The ability of the prealloyed
solder particles in the paste to reflow into a sphere on a non-
wettable substrate is determined under defined test condi-
tions.
2.0
Applicable Documents
None
3.0
Test Specimen
Frosted
glass microscope slide, alu-
mina substrate or glass/epoxy printed circuit board with a
thickness of 0.60 to 0.80 mm and a minimum length and
width dimension of 76 mm and 25 mm, respectively.
4.0
Equipment/Apparatus
4.1
Metal
Stencils
4.1.1
Stencil for Type 1-4
Stencil
76 mm x 25 mm x 0.2
mm provided with at least 3 round holes of 6.5 mm diameter
apertures with a minimum distance between centers of 10
mm.
4.1.2
Stencil for Type 5-6
Stencil
76 mm x 25 mm x 0.1
mm provided with at least 3 round holes of 1.5 mm diameter
apertures with a minimum distance between centers of 10
mm.
4.2
Spatula
4.3
Solder
bath not less than 100 mm x 100 mm x 75 mm
deep containing solder suitable to maintain a temperature of
25°C above the liquidus temperature of the solder paste being
evaluated.
4.4
Flat
hot plate
4.5
Surface
temperature thermometer
4.6 Magnifying
glass with a 10 to 20 times magnification.
5.0
Procedure
5.1 Preparation
5.1.1
Set
the temperature of the solder bath or hot plate at
a temperature of 25°C +/–3°C above the liquidus temperature
of the solder alloy.
5.1.2 Homogenize
the solder paste by hand stirring with a
spatula.
5.1.3
Condition
the paste to uniform temperature of 25° C
+/–2°C.
5.1.4
Prepare
two test specimens with either/or both sten-
cils listed above (4.1.1 and 4.1.2). The solder paste should be
squeeged with the spatula to fill and level each hole.
5.2
Test
5.2.1 Test Conditions
5.2.1.1
Test
one specimen within 15 +/–5 minutes after
placement of solder paste on test coupon.
5.2.1.2
Test
the second specimen 4 hours +/–15 minutes
after placement of solder paste on test coupon. Storage for 4
hours shall be at 25°C +/–3°C and 50 +/–10% RH.
5.2.2
Conditioning Heating Equipment
5.2.2.1
Clean
the surface of the solder bath with the
scraper.
5.2.2.2 Remove
all foreign material from the surface of the
hot plate to ensure proper control.
5.2.3
Solder Reflow
Reflow
specimens by one of the fol-
lowing two methods.
5.2.3.1
Lower
the substrate, in a horizontal position with the
paste deposit on top, into the solder bath at a speed of 25 +/–
2 mm/second until the substrate is 50% submerged. It is
important that good thermal contact is achieved between the
molten solder and the substrate. As soon as the solder has
melted, withdraw the substrate from the solder bath maintain-
ing it in a horizontal position. The total time on the solder bath
shall not exceed 20 seconds.
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
IPC-TM-650
TEST
METHODS MANUAL
Number
2.4.43
Subject
Solder
Paste—Solder Ball Test
Date
1/95
Revision
Originating Task Group
Solder Paste Task Group (5-24b)
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
age1of3
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5.2.3.2
Place
the substrate on the hot plate. As soon as the
solder has melted, withdraw the substrate from the hot plate
maintaining a horizontal position. The reflow shall occur within
20 seconds after the specimen is placed in contact with the
hot plate.
5.3 Evaluation
5.3.1
Examine
the reflowed specimens under 10X to 20X
magnification.
5.3.2
Solder
ball size and number should be compared with
Figure 1.
5.3.3
Record
the degree of reflow in comparison with Figure
1 for the 6.5 cm and 1.5 cm acceptance/reject conditions,
respectively.
IPC-TM-650
Number
2.4.43
Subject
Solder
Paste—Solder Ball Test
Date
1/95
Revision
P
age2of3
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
Figure
1 Solder ball test standards
Preferred Acceptable
Unacceptable;
Clusters
Unacceptable
IPC-TM-650
Number
2.4.43
Subject
Solder
Paste—Solder Ball Test
Date
1/95
Revision
P
age3of3
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ