IPC-TM-650 EN 2022 试验方法.pdf - 第61页
1 Scope After selective chemical removal of the glass- epoxy from around the through hole and its associated cir- cuitry, an examination can be made with a microscope of the plated-through hole (PTH), pad, and conductor …
1.0
Scope
A
method for determining the presence of pin-
holes in metal foil by visual examination after applying a dye
penetrant.
2.0
Applicable Documents
None
3.0
Test Specimen
Specimen
must be a minimum of 12 in.
long by the full width of the roll or sheet to perform the dye
penetration test.
4.0
Apparatus
4.1
Magnaflux
Cleaner SKC-HF and penetrant SKL-HF and
suitable brush or roller for application. (See note below.)
4.2
Microscope
and suitable magnification device having a
reticle capable of measuring an area of 0.005 in. diameter.
5.0
Procedure
5.1 Cleaning
Clean the untreated side of the metal foil with
Magnaflux Spot Check Cleaner SKC-NF followed by a thor-
ough wiping action.
5.2
Dye Application
Apply
Magnaflux Penetrant SKL-HF
to the cleaned side of the metal.
5.3
Pinhole Evaluation
This
test is performed by counting
the number of dye spots on the treated side of the metal foil
which indicates passage of the dye penetrant through the
metal foil and measuring the size of pinholes.
6.0 Notes
The Magnaflux Chemicals may be obtained from
the Magnaflux Corporation, 7300 W. Lawrence Avenue,
Chicago, Illinois 60656.
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
IPC-TM-650
TEST METHODS MANUAL
Number
2.1.2
Subject
Pinhole
Evaluation, Dye Penetration Method
Date
3/76
Revision
A
Originating Task Group
N/A
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
age1of1
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
1
Scope
After
selective chemical removal of the glass-
epoxy from around the through hole and its associated cir-
cuitry, an examination can be made with a microscope of the
plated-through hole (PTH), pad, and conductor at any angle.
2
Applicable Documents
None
3
Test Specimen
The
specimen is a part of a glass-epoxy
multilayer or double-sided PCB, which contains a PTH and its
associated interconnected circuitry, which is selected for
closer examination.
4
Apparatus
4.1
A
fume hood is to be used, due to the corrosive chemi-
cals used for this evaluation.
4.2
A
microscope, capable to examine the specimen at
magnifications of 50X to 100X
4.3
A
stirring hot plate, capable of maintaining a temperature
at 50°C.
4.4
Equipment
The
following equipment is needed to per-
form this test:
• Goggles
• Face mask
• Acid resistant apron or coat
• Acid resistant respirator
• Polyethylene beaker
• Polyvinyl chloride gloves
• Pyrex (glass) beaker
• Sodium dichromate sulfuric acid (Sp. Gr. 1.84)
• Support stand
• Hydrofluoric acid (48%)
• Thermometer
• Utility clamp
• Thermometer clamp
5
Procedure
Caution: Hydrofluoric and fluosulfonic acids and their vapors
are extremely toxic and corrosive. They should never be
opened or handled except with full protective clothing and
under a fume hood.
5.1
Reagents
For
the sulfuric chromic solution, take 35 ml
of a saturated sodium dichromate (Na
2
Cr
2
O
7
)
solution and
add 1 liter of concentrated sulfuric acid (H
2
SO
4
)
in a Pyrex
vessel immersed in a cold water bath. In a polyethylene bea-
ker, make a fluosulfonic acid mixture using one part by weight
of sulfuric acid (H
2
SO
4
)
and three parts by weight of hydrof-
luoric acid (H.F. 48%).
5.2
Immersion
In
a Pyrex beaker of predetermined size,
add enough sulfuric chromic solution to completely immerse
the specimen. Heat the solution to 50°C on a hot plate and
immerse the specimen. After the reaction is completed (the
disappearance of small bubbles), remove the specimen and
rinse in distilled water. Remove excess water with a tissue and
immerse the specimen in a fluosulfonic acid mixture at room
temperature. After two minutes, remove the specimen from
the fluosulfonic acid mixture, rinse in distilled water, and
remove excess water with a tissue. Repeat this process until
the desired amount of exposed circuitry is obtained.
5.3
Test Evaluation
Examine
the specimen under the
microscope and observe the structure and condition of the
PTH, interconnections, and layer-to-layer registration.
6 Notes
Fluosulfonic
acid must always be contained in a
polyethylene beaker.
2215
Sanders Road
Northbrook, IL 60062-6135
IPC-TM-650
TEST
METHODS MANUAL
Number
2.1.3
Subject
Plated-Through
Hole Structure Evaluation
Date
8/76
Revision
A
Originating Task Group
N/A
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
age1of1
ASSOCIA
TION CONNECTING
ELECTRONICS INDUSTRIES
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
1.0
Scope
This
test method identifies the major areas of
concern during a visual examination and describes the recom-
mended procedures.
2.0
Application Documents
None.
3.0
Test Specimen
Any
representative clad or unclad
sample of printed wiring material.
4.0
Equipment/Apparatus
Magnifier
or microscope
capable of up to 30X magnification, having a reticle capable of
measuring to the nearest 0.001 in.
5.0
Procedures
5.1 Pinholes
Pinholes
are predetermined by visual exami-
nation using not less than 10X magnification on the specimen.
Copper surfaces should be prepared by cleaning or light etch-
ing.
5.2
Pits and Dents
The
maximum total point count for pits
and dents, per square foot of panel inspected is determined
as follows:
Longest Dimension (inch) ..................................... Point Value
0.000 to 0.010 inclusive....................................................... 1
0. 011 to 0.020 inclusive ..................................................... 2
0.021 to 0.030 inclusive....................................................... 4
0.031 to 0.040 inclusive....................................................... 7
over 0.040 ......................................................................... 30
Pits and dents should be determined visually using not less
than 10X magnification on the specimen.
5.3
Scratches
Scratches
can be measured with the use of
a microscope (30X maximum).
5.4
Wrinkles
Wrinkles
should be viewed by normal or cor-
rected 20/20 vision.
5.5
Inclusions
Inclusions
should be measured using 18X
to 30X magnification.
6.0 Notes
For
additional reference see:
IPC-CF-150: Copper Foil
IPC-A-600: Acceptability of Printed Boards
MIL-P-13949: Laminate Materials
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
IPC-TM-650
TEST
METHODS MANUAL
Number
2.1.5
Subject
Surface
Examination, Unclad and Metal-Clad
Material
Date
12/82
Revision
A
Originating Task Group
N/A
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
age1of1
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ