IPC-TM-650 EN 2022 试验方法.pdf - 第126页

1.0 Scope To determine the quality of the dielectric mate- rial after etching with ferric chloride. 2.0 Applicable Documents None. 3.0 Test Specimen Specimen 2 in. x 2 in. X thickness of one ounce or two ounces copper cl…

1.0

Scope

determine the quality of the dielectric mate-

rial after etching with ammonium persulfate.

2.0

Applicable Document

None.

3.0

Test Specimen

Specimen

2 in. x 2 in. X thickness of

one ounce or two ounces copper clad.

4.0

Apparatus

4.1 Heated Electrical Equipment

for

etching the speci-

men.

4.2

Air Circulating Chamber

capable

of maintaining 80°C ±

3°C (176°F).

4.3

Equipment and Chemicals

needed

to perform this test

are as follows: Rubber or polyethylene gloves, lint-free cloth,

grade FFF pumice and plastic scrubbing brushes, distilled

water, 10% solution oxalic acid, ammonium persulfate solu-

tion, methylethyl ketone, toluol, and trichlorethylene.

5.0

Procedure

5.1 Preparation of Specimen

Remove

rough edges from

the specimen by sanding or other suitable means.

5.2

Etching

Etch

specimen with vigorous agitation for the

minimum time in 66° BAUME ammonium persulfate solution

monitored at 43°C ± 3° (109.4°F). After removal of the copper,

immediately wash the specimen with running tap water for 2

to 5 minutes and keep the specimen from drying until the

specimen is placed in the chamber. Immerse the specimens

in a 10% solution of oxalic acid in distilled water 25°C ± 8°

(77°F) for 15 to 20 minutes providing gentle circulation of the

oxalic acid solution during this period. Flush the specimen

with tap water for 2 to 5 minutes, then scrub the specimens

with pumice to remove resist. Wipe the resist off with a lint free

cloth moistened with a suitable solvent. Scrub the specimen

with a plastic bristled brush under running tap water for 2 to 5

minutes. Rinse the specimen again in distilled water.

5.3

Condition

Dry

the specimens for 1 hour in a chamber

maintained at 80°C (176°F). If specimens are for electrical

tests, handle only with rubber or polyethylene gloves.

5.4

Evaluation of Test

Examine

specimens for white

deposits or other surface contaminants, loss of surface resin,

softness, delaminations, blistering or measling. Clad speci-

mens also should be evaluated for blisters or delamination of

the copper foil.

6.0 Notes

6.1

the etching time exceeds 15 minutes for 1 ounce cop-

per or 30 minutes for 2 ounces copper, renew the etching

solution.

6.2

Oxalic

acid is very toxic and extreme care should be

exercised.

6.3

The

time to produce a clean pattern with a minimum of

undercutting is approximately 7 minutes for 1 ounce copper

and 15 minutes for 2 ounces copper, using fresh solution.

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.3.6

Subject

Etching

Ammonium Persulfate Method

Date

7/75

Revision

Originating Task Group

N/A

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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1.0

Scope

determine the quality of the dielectric mate-

rial after etching with ferric chloride.

2.0

Applicable Documents

None.

3.0

Test Specimen

Specimen

2 in. x 2 in. X thickness of

one ounce or two ounces copper clad.

4.0

Apparatus

4.1 Heated Electrical Equipment

for

etching the speci-

men.

4.2

Air Circulating Chamber

capable

of maintaining 80°C

± 3° (176°F).

4.3

Equipment and Chemicals

needed

to perform this test

are as follows: Rubber or polyethylene gloves, lint free cloth,

grade FFF pumice and plastic scrubbing brushes, distilled

water, 10% solution oxalic acid, ferric chloride solution, meth-

ylethyl ketone, toluol, and trichlorethylene.

5.0

Procedure

5.1 Preparation of Specimen

Remove

rough edges from

the specimen by sanding or other suitable means.

5.2

Etching

Etch

specimens with vigorous agitation for the

minimum time in 42° BAUME ferric chloride solution moni-

tored at 30°C ± 6° (86°F). After removal of the copper, imme-

diately wash the specimen with running tap water for 2 to 5

minutes and keep the specimen from drying until the speci-

men is placed in the chamber. Immerse specimens in a 10%

solution of oxalic acid in distilled water at 25°C ± 8° (77°F) for

15 to 20 minutes providing gentle circulation of the oxalic acid

solution during this period. Flush the specimens with tap

water for 2 to 5 minutes, then scrub the specimens with pum-

ice to remove resist. Wipe the resist off with a lint free cloth

moistened with a suitable solvent. Scrub the specimen with a

plastic bristled brush under running tap water for 2 to 5 min-

utes, then rinse for 30 minutes. Rinse the specimen again in

distilled water.

5.3

Condition

Dry

the specimens for 1 hour in a chamber

maintained at 80°C (176°F). If specimens are for electrical

tests, handle only with rubber or polyethylene gloves.

5.4

Evaluation of Test

Examine

specimens for white

deposits or other surface contaminants, loss of surface resin

softness, delamination, blistering or measling. Clad specimens

also should be evaluated for blisters or delamination of the

copper foil.

6.0 Notes

6.1

the etching time exceeds 15 minutes for 1 ounce cop-

per or 30 minutes for 2 ounces copper, renew the etching

solution.

6.2

Oxalic

acid is very toxic and extreme caution should be

exercised.

6.3

The

time to produce a clean pattern with a minimum

undercutting is approximately 7 minutes for 1 ounce copper,

and 15 minutes for 2 ounce copper using a fresh solution.

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.3.7

Subject

Etching,

Ferric Chloride Method

Date

7/75

Revision

Originating Task Group

N/A

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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1.0

Scope

This

method is a means for preparation of test

specimens for determination of bare dielectric material quality

and properties, using cupric chloride as the etching solution

for removal of copper cladding.

2.0

Applicable Documents

IPC-TM-650

Method

2.3.1.1, Chemical Cleaning of Metal Clad Laminate

3.0

Test Specimens

The

size of lot samples or test speci-

mens shall be determined by the inspections or tests to be

performed after etching and the capabilities of the etching

equipment.

4.0

Apparatus or Material

4.1

Standard

chemical etching chamber or laboratory

equipment suitable to the etchant chemistry.

4.2

Air

circulating oven capable of maintaining the specified

temperatures and tolerances.

4.3

Personal

safety equipment shall include: rubber or poly-

ethylene gloves, plastic or coated apron and safety goggles.

4.4

Chemicals

Chemical Concentration

Cupric Chloride, CuCl

-2H

0.54 kg/l 4.5 lb/gal

Hydrochloric Acid, HCl 9.3% by weight (3N)

25% by volume

Distilled/Deionized Water As required

Sodium Hydroxide, NaOH 10% by weight

Reagent grade isopropyl alcohol

(IPA) As required

4.5

Pattern Developing Materials

Etch

resist system or

materials capable of producing the applicable conductor pat-

terns.

5.0

Procedure

5.1 Preparation of Specimen

5.1.1

Shear

the material to the appropriate sample or speci-

men size and if necessary remove the rough edges from the

specimen by sanding or other suitable means. Specimens

may be chemically cleaned in accordance with IPC-TM-650,

Method 2.3.1.1. Specimens may also be mechanically

cleaned.

5.1.2

a conductor pattern is required, prepare the material

by applying etch resist according to standard industry prac-

tices.

5.2

Etching

5.2.1

Remove

the metal cladding by etching in a spray

chamber or other suitable container containing 30-32*

BAUME cupric chloride solution maintained at 51.7 ± 5.6°C

[125 ± 10°F]. Etching time shall be minimized to prevent over-

exposure of the bare laminate material to the etching solution

and yet allow for complete removal of the exposed metal clad-

ding. If the specimens are etched in a laboratory environment,

vigorous agitation may be required.

5.2.2

Rinse

the specimens thoroughly.

5.2.3

For

referee purposes, neutralize any residual etchant

by quickly dipping in a 10% solution of NaOH solution and

then rinse thoroughly with distilled or deionized water. Note: If

this step is not followed, undercutting of the circuitry is pos-

sible, which in time could lead to inaccurate test data, such as

low peel strength.

5.3

Cleaning

5.3.1

etch resist has been used, samples shall have the

resist or tape removed by standard industry practices.

5.3.2

When

electrical testing is required on the material, do

not allow the etched specimens to dry before they go through

the cleaning process. For general testing, scrubbing with a

soft natural bristle brush under running tap water and rinsing

with distilled water or deionized water may be adequate. For

critical testing and for referee testing, laminates shall be

soaked for 10 minutes in reagent grade IPA followed immedi-

ately by a 10 minute rinse in flowing 16 megaohm deionized

water.

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.3.7.1

Subject

Cupric

Chloride Etching Method

Date

12/94

Revision

Originating Task Group

MIL-P-13949 Test Methods Task Group (7-11b)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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