IPC-TM-650 EN 2022 试验方法.pdf - 第271页
IPC-2412-1 Figure 1 Suggested Dipping Device IPC-TM-650 Number 2.4.12 Subject Solderability, Edge Dip Method Date 6/91 Revision A P a g e2o f3 电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
1.0
Scope This method is used to determine the solderability
of copper foil, copper clad laminate, and printed boards. This
method does not specifically relate to the solderability of the inter-
nal plating in holes.
2.0 Applicable Documents
None
3.0
Test Specimen
Boards
Specimen
can be a scrap edge, a finished product
or a specially prepared specimen processed with a group of
production boards, as mutually determined between vendor
and user.
Copper
Foil
A
representative sample of copper foil that is 25
mm [1 in] wide and of sufficient length to dip approximately 50
mm [2 in] into the solder.
4.0
Apparatus
4.1 Solder Pot
An
electrically heated thermostatically con-
trolled pot of sufficient size to accommodate the specimen
containing no less than five pounds of solder.
4.2
Dipping Device
A
device as shown in Figure 1 shall be
used. A similar device may be used if:
1. the rate of immersion, dwell time and rate by withdrawal
are within the test limits described in the procedures;
2. the board and solder remain perpendicular within five
degrees and
3. wobble, vibration and other extraneous movements, are
eliminated.
4.3
Flux
Nonactivated
rosin flux having a nominal composi-
tion of 25% by weight of water white gum rosin in a solvent of
isopropyl alcohol 99%. The specific gravity of the flux shall be
0.843 ± 0.005 at 25°C (77°F), and free of additional activators.
4.4
10%
HCL by volume
5.0
Procedure
5.1 Preparation
5.1.1
The
specimen shall be checked in an ‘‘as received’’
condition from the vendor and care must be exercised to pre-
vent contamination (by grease, perspirants, etc.) of the sur-
face to be tested.
5.1.2
Preclean
the specimen using a 15 second immersion
in 10% HCL (by volume) followed by water rinsing. The HCL
shall be maintained at 60 ± 5°C [140 ± 10°F]. Dry the speci-
men quickly to avoid excess oxidation of the sample. Use of
an air blower or isopropyl alcohol to expedite the drying is
permitted.
5.1.3
Dip
the specimen into the described flux and allow to
drain for 60 seconds before proceeding with the solder dip.
5.2
Test
5.2.1
Stir,
and skim the surface of the molten solder with a
clean stainless steel paddle to assure that the solder is of a
uniform composition and a temperature of 245 ± 5°C (473 ±
9°F).
5.2.2
Immerse
the specimen edgewise into the molten sol-
der. The insertion and withdrawal rates shall be 1 ± 0.025
inches per second, with a dwell time of 4 seconds ± 0.5 sec-
onds.
5.2.3 Upon
withdrawal, the solder shall be allowed to solidify
by air cooling while the specimen is in the vertical position.
5.2.4
Thoroughly
remove the flux and examine.
5.3
Evaluation
5.3.1
Examine
specimen for a new uniform adhering coating
of solder.
5.3.2
An
area of 3.2mm [0.125 in] width, approximately,
from the edge of the specimen shall not be evaluated.
6.0 Notes
6.1
As
an aid to evaluation of the test results, see Figure 2.
This aid to be used primarily to illustrate types of defects
rather than percentage of area covered.
6.2
No
quenching or other means of accelerating cooling
shall be used.
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
IPC-TM-650
TEST
METHODS MANUAL
Number
2.4.12
Subject
Solderability,
Edge Dip Method
Date
6/91
Revision
A
Originating Task Group
N/A
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
age1of3
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
IPC-2412-1
Figure
1 Suggested Dipping Device
IPC-TM-650
Number
2.4.12
Subject
Solderability,
Edge Dip Method
Date
6/91
Revision
A
P
age2of3
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
Figure
2 Aid to Evaluation
IPC-2412-2a-d
IPC-TM-650
Number
2.4.12
Subject
Solderability,
Edge Dip Method
Date
6/91
Revision
A
P
age3of3
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ