IPC-TM-650 EN 2022 试验方法.pdf - 第730页

IPC-2616-3 CONDITION 3 IPC-2616-4 CONDITION 4 IPC-2616-5 CONDITION 5 IPC-TM-650 Number 2.6.16 Subject Pressure Vessel Method for Glass Epoxy Laminate Integrity Date 7/85 Revision P a g e3o f3 电子技术应用ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ

seconds.

Immersion and withdrawal rates should not exceed

2 seconds. Do not allow test coupons to touch bottom of sol-

der bath.

Note:

Other

solder bath temperatures maybe agreed upon by

user and vendor.

6.3 Evaluation

6.3.1

not evaluate areas within 1/8 inch from all edges,

including solder line.

6.3.2

Grading

Grade

specimens on the evaluation scale of

5 through 1 (below) according to degree of severity of the

attack. In order for the grading to be more meaningful, the

tester should also provide comments on the overall specimen

appearance. For additional description and illustrations of

measles, blisters, weave texture, delamination, etc., refer to

IPC-A-600, Acceptability Guidelines for Printed Wiring.

alue Condition

The samples have no measles, blisters, or sur-

face erosion.

4 Occasional minute (1/32 inch or less) measles.

3 Minute measles scattered across the speci-

men.

2 Occasional minor blisters (two to four adjacent

weave intersections).

1 Large blisters, delamination, or convolution.

If five test coupons are evaluated, the test may use a total

performance points-rating (e.g.,5x5=25).

7.0 Notes

7.1

This

test method is developed for 1/16 inch thick mate-

rial. Different results are to be expected for other thicknesses.

Therefore, the time of exposure and grading values may

change for different thicknesses and must be agreed upon

between user and vendor.

7.2

Warning

Pressure

vessel must always be opened with

extreme caution to be certain pressure has been released.

7.3

Warning

Samples

could retain some moisture. There-

fore, care should be taken in immersing the sample in the sol-

der bath. It is recommended that the operator work behind a

suitable protective screen and use a glove to protect the hand

holding the sample. The wet specimens will react violently

during the immersion into the solder pot, splaying and sput-

tering bits of molten solder about the fume hood. Proper pre-

cautionary measures must be taken.

IPC-2616-1

CONDITION

IPC-2616-2

CONDITION

IPC-TM-650

Number

2.6.16

Subject

Pressure

Vessel Method for Glass Epoxy Laminate Integrity

Date

7/85

Revision

age2of3

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IPC-2616-3

CONDITION

IPC-2616-4

CONDITION

IPC-2616-5

CONDITION

IPC-TM-650

Number

2.6.16

Subject

Pressure

Vessel Method for Glass Epoxy Laminate Integrity

Date

7/85

Revision

age3of3

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Scope

This

test method is designed to determine the

capability of HDI materials and other dielectrics to withstand

moisture induced stress as applied by extended time in a

pressure vessel. For laminated constructions, the results may

be affected by the process conditions.

Applicable Documents

IPC-A-600

Acceptability

of Printed Boards

IPC-TM-650

Test Methods Manual

2.1.1

Microsectioning

2.1.1.2 Microsectioning—Semi or Automatic Technique

Microsection Equipment (Alternate)

2.3.6 Etching, Ammonium Persulfate Method

2.3.7 Etching, Ferric Chloride Method

2.3.7.1 Cupric Chloride Etching Method

2.3.7.2 Alkaline Etching Method

Test Specimen

3.1

Samples

shall be prepared as appropriate for the type of

material. All samples shall be 10 cm x 10 cm ± 0.5 cm, with

the thickness determined by the type of material (see 3.1.1 to

3.1.3). Three samples shall be prepared. Control samples are

required for all samples where the dielectric layer is applied to

an etched laminate. One control sample of the etched lami-

nate (with no added dielectric) is required for samples pre-

pared according to 3.1.2.2 or 3.1.3.

3.1.1

Copper-Clad Laminate

The

laminate shall have all

copper removed in accordance with IPC-TM-650, Method

2.3.6, 2.3.7, 2.3.7.1 or 2.3.7.2, then cut to dimensions of 10

cm x 10 cm ± 0.65 cm.

3.1.2

Semi-Cured Prepreg

The

prepreg shall be lami-

nated to a cured sheet configuration, with 35 micron copper

foil, using the supplier’s recommended lamination cycle. The

laminate shall be etched of all copper, then cut to dimensions

of 10 cm x 10 cm ± 0.65 cm.

3.1.2.1

Semi-Cured Prepreg or Dielectric Material,

Method A

Sufficient

plies of prepreg shall be used to result

in a composite base thickness of 0.4 mm ± 0.1 mm. If the

prepreg is of a nature that does not allow for lamination of a

single sample of the thickness specified, then a thinner

sample shall be laminated, noting the thickness as part of the

report, see 5.5.

3.1.2.2

Semi-Cured Prepreg or Dielectric Material,

Alternate Method B

The

prepreg or dielectric layer shall be

laminated to both sides of an etched laminate that has a thick-

ness of 0.4 mm ± 0.1 mm. The prepreg or dielectric layer shall

be applied, laminated and cured according to the manufactur-

er’s recommendations. Unless otherwise specified, the result-

ing prepreg or dielectric layer thickness shall be a nominal of

0.05 mm on each side of the core laminate. Optionally, the

actual thickness may be measured by mechanical or cross-

sectional methods and reported, see 5.5. Control samples

shall be the etched laminate core with no prepreg or dielectric

layer.

3.1.3

Coated Dielectrics

The

coated dielectrics (i.e., res-

ins, adhesives, dry films) shall be applied to both sides of an

etched laminate that has a thickness of 0.4 mm ± 0.1 mm.

The coated dielectrics shall be applied and cured according to

the manufacturer’s recommendations. Unless otherwise

specified, the resulting coated dielectric thickness shall be a

nominal of 0.05 mm on each side of the core laminate.

Optionally, the actual thickness may be measured by

mechanical or cross-sectional methods and reported, see 5.5.

Control samples shall be the etched laminate core with no

coated dielectric.

Test Equipment

4.1

Pressure

vessel capable of maintaining a constant pres-

sure of 2 ATM (14 psig), and a temperature of 121°C ± 2°C,

with water content maintained for a minimum of six hours

before needing replenishment.

4.2

Oven,

air circulating, capable of holding a temperature of

105°C ± 2°C

4.3

Microsectioning

equipment, including slug cutter,

mounting, grinding, and polishing equipment (see IPC-TM-

650, Method 2.1.1 or 2.1.1.2)

4.4 Microscope

capable of 200X magnification, with optional

photographic equipment

2215

Sanders Road

Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.6.16.1

Subject

Moisture

Resistance of High Density

Interconnection (HDI) Materials Under High

Temperature and Pressure (Pressure Vessel)

Date

8/98

Revision

Originating Task Group

HDI Test Methods Task Group (D-42A)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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