IPC-TM-650 EN 2022 试验方法.pdf - 第623页

IPC-2-5-30-3 Figure 3 Unbalanced Attenuation Equipment Setup T racking Generator Spectrum Analyzer Coaxial Cable Coaxial Cab le R 1 R 2 R 1 R 2 31 m Cab le Resistor Matc hing Networks IPC-TM-650 Number 2.5.30 Subject Bal…

IPC-2-5-30-2

Figure

2 Balanced Attenuation Equipment Setup

racking Generator

Spectrum Analyzer

Cable

Matching Transformers

31 m

Coaxial Cab

IPC-TM-650

Number

2.5.30

Subject

Balanced

and Unbalanced Cable Attenuation Measurements

Date

12/87

Revision

age3of4

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IPC-2-5-30-3

Figure

3 Unbalanced Attenuation Equipment Setup

racking Generator

Spectrum Analyzer

Coaxial Cable

Coaxial Cab

31 m

Cab

Resistor Matc

hing Networks

IPC-TM-650

Number

2.5.30

Subject

Balanced

and Unbalanced Cable Attenuation Measurements

Date

12/87

Revision

age4of4

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Scope

EOS

and electrostatic discharge (ESD) have been

proven to damage and degrade electronic components and

assemblies. This test method consists of a series of individual

test procedures to test soldering and desoldering hand tools

with grounded working surfaces for electrical grounds, tran-

sient voltages, and current leakage.

This series of test methods attempts to identify those bench-

top systems, which might contribute to premature assembly

failure from EOS/ESD related failure mechanisms. Test results

may be erroneous or skewed if they are incorrectly performed,

influenced by outside forces (e.g., air conditioning discharge

over the unit under test), or if incorrect test equipment is

selected.

Test equipment selected for equipment qualification must be

capable of measuring the low voltages and current emitted by

the unit under test (UUT). Additionally, the equipment must be

capable of reading pulses and frequencies emitted by the

UUT, which may be oscillator or microprocessor controlled.

As faster and more capable oscillator and microprocessor

controlled equipment is introduced by equipment manufactur-

ers, it may become necessary to select test equipment with a

broader bandwidth than that currently specified in this proce-

dure. Failure to do so is likely to qualify equipment that might

otherwise be disqualified.

Several of these tests can be falsely influenced by radio fre-

quency interference and electromagnetic interference from

lighting and equipment found in the workplace and testing

area. To avoid these influences the leakage and transient tests

should be performed in a screen room. In lieu of a screen

room, a separate test procedure (see Test Method 2.5.33.4)

has been provided to make a low cost shielded enclosure

which should provide adequate shielding for the performance

of these test procedures.

Warning:

These

are laboratory test procedures that may of

necessity expose terminals that carry line voltages. All stan-

dard laboratory safety procedures regarding the setup and

performance of tests with line voltage equipment must be

observed at all times.

Caution:

These

tests are performed with soldering systems

at their normal operating temperature. Test personnel must

take adequate precautionary steps to protect themselves and

others from potential burns.

1.1

Purpose

The

purpose of the electrical overstress (EOS)

test methods is to provide standardized test procedures for

the qualification of equipment to Appendix A of ANSI/J-STD-

001. Users may utilize Appendix A as part of an equipment

qualification procedure or may be referred to Appendix A

when the process has been determined to be out of control

(see ANSI/J-STD-001).

Applicable Documents.

ANSI/J-STD-001

Requirements

for Soldered Electrical and

Electronic Assemblies

IPC-TM-650 Test

Methods Manual

2.5.33.1 Measurement of Electrical Overstress of Hand Sol-

dering Tools - Ground Measurements

2.5.33.2 Measurement of Electrical Overstress of Hand Sol-

dering Tools - Transient Measurements

2.5.33.3 Measurement of Electrical Overstress of Hand Sol-

dering Tools - Current Leakage Measurements

2.5.33.4 Measurement of Electrical Overstress of Hand Sol-

dering Tools - Shielded Enclosure

Test Specimens

The

tests that make up this test

method call for the use of a locally produced sacrificial test

electrode. The test electrode shall be a piece of single or

double-sided 69 µm (15 mm thick) copper clad FR-4. The

electrode size shall be of a uniform size 45 mm x 23 mm ± 6.4

mm. The size may be adjusted to accommodate any locally

produced test fixtures.

The size of the electrode area is designed so that it is not so

big that it cools the temperature of the UUT below solder melt

and not so small that the temperature of the UUT causes

rapid oxidation or solder slagging. This electrode is designed

to be replaceable since it will deteriorate after repeated test-

ing.

Equipment/Apparatus

The

apparatuses utilized by the

procedures that make up this test method are given in 4.1

through 4.19.

4.1

Test

Electrode (see Section 3)

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062

IPC-TM-650

TEST

METHODS MANUAL

Number

2.5.33

Subject

Measurement

of Electrical Overstress from

Soldering Hand Tools

Date

11/98

Revision

Originating Task Group

Manual Soldering Task Group (5-22c)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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