IPC-TM-650 EN 2022 试验方法.pdf - 第497页

1 Scope This test method describes procedure for measur- ing dielectric permittivity and loss tangent of embedded pas- sive materials. The measurements are made in an APC-7 coaxial configuration where the test specimen r…

3330

!**** END CALIBRATION OF UNIT ****

3340 !

3400 !**** OPEN 16453A FIXTURE MEASUREMENT ****

3410 ON INTR Scode GOTO Open_end1

3420 OUTPUT @Hp4291;‘‘*CLS;*OPC?’’

3430 ENTER @Hp4291;Opc

3440 INPUT ‘‘CONNECT FIXTURE AND LOCK GAP OPEN,

THEN PRESS [RETURN OR x1]’’,A$

3460 ENABLE INTR Scode;2

3470 OUTPUT @Hp4291;‘‘SENS:CORR2:COLL STAN4’’

3480 Wait_open1:GOTO Wait_open1

3490 Open_end1:!

3500 !

3600 !**** 16453A FIXTURE SHORT MEASUREMENT ****

3610 ON INTR Scode GOTO Short_end1

3620 OUTPUT @Hp4291;‘‘*CLS;*OPC?’’

3630 ENTER @Hp4291;Opc

3640 INPUT ‘‘CLOSE AND SHORT FIXTURE GAP, THEN

PRESS [RETURN OR x1]’’,A$

3650 ENABLE INTR Scode;2

3660 OUTPUT @Hp4291;‘‘SENS:CORR2:COLL STAN5’’

3670 Wait_short1:GOTO Wait_short1

3680 Short_end1:!

3690 !

3800 !**** TEFLON LOAD IN 16453A MEASUREMENT ****

3810 ON INTR Scode GOTO Load_end1

3820 OUTPUT @Hp4291;‘‘*CLS;*OPC?’’

3830 ENTER @Hp4291;Opc

3840 INPUT ‘‘PLACE TEFLON STANDARD INTO FIXTURE,

THEN PRESS [RETURN OR x1]’’,A$

3850 ENABLE INTR Scode;2

3860 OUTPUT @Hp4291;‘‘SENS:CORR2:COLL STAN6’’

3870 Wait_load1:GOTO Wait_load1

3880 Load_end1:!

3890 !

4000 !**** SAVE FIXTURE COMPENSATION SETTINGS ****

4010 OUTPUT @Hp4291;‘‘SENS:CORR2:COLL:SAVE’’

4020 !

4030 !**** REPLACE PROGRAM DISK WITH DATA DISK ****

4040 INPUT ‘‘Replace Program with Data Disk, [RETURN OR

x1]’’,A$

4050!

4100 !**** PERMITTIVITY TEST LOOP ****

4110 Test_loop:!

4120 OUTPUT @Hp4291;‘‘INIT:CONT OFF’’

4130 Sweep1_Begin:!

4140 INPUT ‘‘Place Sample In Fixture, Enter Thickness In

mm, [RETURN OR x1]’’,A

4150 B=A/1000

4160 OUTPUT @Hp4291;‘‘CALC:MATH1:DIM1 ’’;B

4170 ON INTR Scode GOTO Sweep1_end

4180 OUTPUT @Hp4291;‘‘STAT:INST:ENAB 1’’

4190 OUTPUT @Hp4291;‘‘*SRE 4’’

4300 OUTPUT @Hp4291;‘‘*CLS;*OPC?’’

4310 ENTER @Hp4291;Opc

4320 OUTPUT @Hp4291;‘‘ABOR’’

4330 ENABLE INTR Scode;2

4340 OUTPUT @Hp4291;‘‘INIT’’

4350 Waiting:GOTO Waiting

4360 Sweep1_end:!

4370 !

4400 !**** SAVE DATA ROUTINE ****

4410 INPUT ‘‘SAVE DATA? [1] Yes; [0] No [RETURN OR

x1]’’,Ans$

4420 IF Ans$<>‘‘1’’ THEN GOTO Sweep1_Begin

4430 INPUT ‘‘Input Job Number [RETURN OR x1]:’’,Job$

4440 OUTPUT @Hp4291;‘‘MMEM:STOR:DINT:TRAC SEL,

‘‘‘‘‘‘;Job$;’’’’‘‘,’’‘‘DISK’’‘‘;’’

4450 GOTO Sweep1_Begin

4460 !**** END MEASUREMENT LOOP *****

4470 !

5000 END

IPC-TM-650

Number

2.5.5.9

Subject

Permittivity

and Loss Tangent, Parallel Plate,

1 MHz to 1.5 GHz

Date

11/98

Revision

age5of5

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Scope

This

test method describes procedure for measur-

ing dielectric permittivity and loss tangent of embedded pas-

sive materials. The measurements are made in an APC-7

coaxial configuration where the test specimen represents a

load terminating an air-filled coaxial transmission line. The

method is suitable for testing high dielectric constant (high-k)

polymer-composite materials having nominal thickness of

1 µm to 300 µm at frequencies of 100 MHz to 12 GHz. With

proper use and computation the frequency range can be

extended to 18 GHz. Existing measurement methods (see

Section 2) assume quasi-static conditions in the thin film

specimen, whereas this test method produces meaningful

results at frequencies greater than hundreds of megahertz

and where high-dielectric constant, thin film materials are to

be measured.

This test method is for qualification of filled and unfilled, dis-

tributed capacitance, thin film materials where the permittivity

in the frequency range of 100 MHz to 12 GHz is a critical

functional parameter. The method is also applicable to poly-

mer resist materials for embedded passive devices. This

method fills a test method gap within the IPC-TM-650 Test

Methods Manual for thin film, high-k dielectrics.

Applicable Documents

IPC-TM-650

Test

Method Manual

2.5.5.1 Permittivity (Dielectric Constant) and Loss Tangent

(Dissipation Factor) of Insulating Material at 1 MHz

(Contacting Electrode Systems)

2.5.5.4 Dielectric Constant and Dissipation Factor of Printed

Wiring Board Material-Micrometer Method

2.5.5.9 Permittivity and Loss Tangent, Parallel Plate, 1 MHz

to 1.5 GHz

ASTM

D 150

Standard

Test Methods for AC Loss Charac-

teristics & Permittivity (Dielectric Constant) of Solid Electrical

Insulating Materials

Terminology

3.1

Complex

Permittivity, ε*, ε*=ε

(ε’ - jε’’)

where ε

8.85419

-12

F/m

is the dielectric permittivity of air [1], ε’ is

the relative dielectric constant and ε’’ is the relative imaginary

dielectric constant (the dielectric loss).

3.2

Relative

Permittivity, ε

is a dimensionless ratio of com-

plex permittivity to the permittivity of air, ε

*=ε*/ε

= ε’ - jε’’.

3.3

Dielectric

Constant is the real part of the relative permit-

tivity. The symbol used in this document is ε’. Other symbols

such as K, k, K’,k’, ε

and ε

’ are

exchangeable symbols used

in the technical literature.

3.4

Dielectric

Loss Tangent, tan (δ), is a dimensionless ratio

of the dielectric loss to the dielectric constant, tan (δ)=ε’’/ε’.

3.5 APC-7,

Amphenol 7 mm 50 Ω Coaxial Connector; APC-

3.5 Amphenol 3.5 mm Precision 50 Ω Coaxial Connector.

3.6 Scattering

Coefficient, S

is a ratio of incoming and

outgoing power waves measured by a network analyzer

through Port 1. S

complex entity consisting of magnitude,

and phase, φ. In this document the circuit parameters

that are complex numbers are in bold font.

3.7

Input

Impedance, Z

a complex entity consisting of

magnitude and phase.

= Z

(1 + S

)/(1 − S

)

(1)

where

characteristic impedance of the APC-7 air-filled

coaxial line, Z

0Ω.

Test Specimen

The

test specimen consists of a circular

disk capacitor having the nominal diameter, a, of 3.0 mm with

metal electrodes on both sides. The dielectric thickness, d,

may be in the range of 1 µm to 300 µm (1 µm = 1 micro-

meter).

4.1

Preparation

Conducting

metal electrodes, thickness of

0.1 µm to 0.5 µm, shall be coated on both sides of the dielec-

tric. Sputtered copper or gold is recommended. To avoid

electrical shorting, the diameter of the top electrode, which

faces the Section B of the test fixture (Figure 1), may be

2.85 mm to 3.0 mm. The diameter of the bottom electrode

that faces the Section A (Figure 1), shall be within 3.0 mm to

3.05 mm, matching the diameter of the center conductor pin

(Figure 1). This is the diameter a of the specimen that along

with the specimen dielectric thickness, d, determines the

specimen geometrical capacitance, C

(see

Equation (3) in

3000

Lakeside Drive, Suite 309S

Bannockburn, IL 60015-1219

IPC-TM-650

TEST

METHODS MANUAL

Number

2.5.5.10

Subject

High

Frequency Testing to Determine Permittivity

and Loss Tangent of Embedded Passive Materials

Date

07/05

Revision

Originating Task Group

Embedded Devices Test Methods Subcommittee

(D-54)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.

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ELECTRONICS INDUSTRIES

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7.2).

The diameter of the dielectric should be equal to the

diameter of the bottom electrode.

4.1.1

Preparation of the Test Specimen from Metal Clad

Laminates

The

metal cladding should be removed from the

dielectric, unless the thickness of the conductor is already

within the recommended range of 0.1 µm to 0.5 µm. The sur-

faces of the bare dielectric should be cleaned from conduct-

ing contaminants such as traces of ions to avoid possible

corrosion of sputtered thin film metals, by rinsing in deionized

water, drying, and then remetalizing by sputtering with copper

or gold (see 4.1).

4.1.2

Thin Dielectric Films that are Not Free-Standing

and Require Support

The

supporting conductor can be

used as the bottom electrode of the specimen. The topside

conductor should be removed and then the top surface of the

dielectric should be recoated to make the top electrode (see

4.1). The thickness of the bottom conductor can be compen-

sated during measurements by adding an equivalent electrical

delay (see 6.3.1).

Test Fixture

The

test fixture consists of two Sections A

and B, where the specimen is placed in between, as shown in

Figure 1. The detailed drawings are given in Section 11. Sec-

tion A is an APC-7 to an APC-3.5 microwave adapter with

characteristic impedance of 50 Ω (Agilent 1250-1746). Sec-

tion B is an altered APC-7 short termination (Agilent 04191-

85300 or equivalent may be used), with a custom-machined

gap to accommodate a specimen of particular thickness.

When Sections A and B are assembled, the depth, d,ofthe

gap is equal to the specimen thickness. Specimens with dif-

ferent thickness will require separate Sections B. In the case

of a specimen thinner than 10 µm, the center conductor of the

APC-7 Section A may be replaced with a fixed 3.05 mm diam-

eter pin, machined precisely to achieve a flat and parallel con-

tact between the film specimen and the terminating Section B.

The diameter of the outer conductor, b, of Section A is

7.0 mm (see drawing in Section 11).

Measurement Procedure

6.1 Apparatus

The

measurement requires an automatic

vector network analyzer operating in the frequency range of

100 MHz to 18 GHz, for example an Agilent 8720D or equiva-

lent. The instrument should be equipped with a IEEE 488.2

I/O interface for transferring data between the network ana-

lyzer and a computing unit, e.g., a personal computer (PC)

with a General Purpose Input/Output Board (GPIB).

Connection between the test fixture (APC 3.5 adapter of Sec-

tion A) and the network analyzer shall be made using a phase

preserving coaxial cable, for example an Agilent 85131-60013

or equivalent.

6.2

Calibration Procedure

Set

the measurements range

to be between 100 MHz and 12 GHz. The number of data

points should be in the range of 800. The power level should

be set to 0 dBm with a dynamic range of at least - 40 dBm

(desirably to - 60 dBm ). Select the one Port S

measuring

mode

and Smith-Chart format. Connect the phase preserving

cable to the Port-1 of the network analyzer and to Section A

of the test fixture. Attach a calibration standard to Section A

of the test fixture. Perform an APC-7 Open, Load, Short cali-

bration using suitable calibration standards (Agilent 85050B

IPC-25510-1

Figure

1 Test ﬁxture with a test specimen between

Sections A and B

SECTION B

APC-7

Mount

SECTION A

APC-3.5 Port

to Network Analyzer, S

Short

Standard

with a Gap

Test

Specimen

Center

Conductor

IPC-TM-650

Number

2.5.5.10

Subject

High

Frequency Testing to Determine Permittivity and Loss

Tangent of Embedded Passive Materials

Date

07/05

Revision

age2of8

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