IPC-TM-650 EN 2022 试验方法.pdf - 第700页

1.0 Scope To determine the resistance of the laminate to thermal stress in both the etched and unetched state. 2.0 Applicable Documents IPC-TM-650 Methods 2.3.6, 2.3.7, 2.3.7.1 3.0 Apparatus 3.1 Solder pot capable of mai…

5.7.1

After

cleaning, microsection the specimen as defined

in IPC-TM-650, Method 2.1.1 or Method 2.1.1.2.

5.7.2

Examine the microsection for compliance of the

plated-through holes to the applicable performance specifica-

tion requirements. Any nonconformities shall be noted.

6. Notes

6.1

Performance

specifications should specify the test con-

dition and any deviations to this test method. If no test condi-

tion is specified, use Test Condition A.

6.2

The

test specimen is not to be held against the surface

of the molten solder.

6.3

not physically shock specimen while the solder in the

plated-through holes is still liquid.

IPC-TM-650

Number

2.6.8

Subject

Thermal

Stress, Plated-Through Holes

Date

05/04

Revision

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1.0

Scope

determine the resistance of the laminate to

thermal stress in both the etched and unetched state.

2.0

Applicable Documents

IPC-TM-650

Methods

2.3.6, 2.3.7, 2.3.7.1

3.0

Apparatus

3.1

Solder

pot capable of maintaining the temperature on

the applicable specification sheet for the material ± 2°F and

acceptinga2x2inch test specimen or equivalent.

3.2

Dow

Corning Fluid #704 or equivalent.

4.0

Test Specimens

4.1

One

(1) test specimen2x2inch will be cut from each

sample sheet for the unetched specimen.

4.2

One

(1) test specimen2x2inch from each sample

sheet for the etched specimen.

4.3

The

edges of the2x2inch specimen shall be sanded.

5.0 Procedure

5.1

Etch

specimen required for thermal stress etched

according to IPC-TM-650, Methods 2.3.6, 2.3.7, or 2.3.7.1.

5.2

Apply

silicon fluid to side of specimen that will be in

contact with solder.

5.3

Float

the specimen on the solder for the time and at the

temperature specified on the applicable specification sheet for

the material.

5.4

The

clad or unclad surface should show no evidence of

charring, loss of surface resin, softening delamination, blister-

ing, or weave exposure.

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.6.8.1

Subject

Thermal

Stress, Laminate

Date

9/91

Revision

—

Originating Task Group

N/A

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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Scope

This

test describes a procedure which may be

conducted to determine if a printed wiring board is con-

structed to withstand the dynamic vibrational stresses that

may be encountered during field service. This test method

provides specific parameters for one application in order to

present the proper procedures. Specific test conditions must

be agreed upon by the customer and the vendor.

Applicable Documents

IPC-6012

Qualification

and Performance Specification for

Rigid Printed Boards

Test Specimen

The

preproduction or production printed

wiring board.

Apparatus

4.1 Vibration

vibration system capable of producing an

input of 25 G’s over a frequency range from 20 Hz to 2000 Hz

to 20 Hz performed in 16 minutes.

4.2

Mounting Fixtures

4.3

The

test fixture must be designed such that resonant

vibration inherent in the fixture within the frequency range

specified for the test shall be minor. The magnitude of the

applied vibration should be monitored on the test fixture near

the specimen mounting points.

4.4

The

test specimen shall be restrained from movement

by fixturing at all four edges and with the flat surface of the

boards mounted perpendicular to the axis of vibration.

Test Procedures

5.1

The

boards shall successfully pass the interconnection

resistance test in accordance with IPC-6012 before and after

the vibration test.

5.2

The

boards shall be subjected to both a cycling and a

resonance dwell test.

5.2.1

The

cycling test shall consists of one sweep from 20

Hz to 2000 Hz to 20 Hz performed in 16 minutes. The input

acceleration (G’s) over the 20-2000-20 Hz frequency range

shall be maintained at 15 G’s.

5.2.2

The

boards shall be subjected to a 30-minute reso-

nance dwell with 25 G’s input or a maximum of 100 G’s out-

put measured at the geometric center of the board.

5.3

Evaluation

Examine

boards for warp or delamination

and interconnection resistance after exposure to the vibration

test.

6 Notes

None

2215

Sanders Road

Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.6.9

Subject

Vibration,

Rigid Printed Wiring

Date

05/04

Revision

Originating Task Group

Rigid Printed Board Performance Task Group

(D-33a)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.

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ASSOCIA

TION CONNECTING

ELECTRONICS INDUSTRIES

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