IPC-TM-650 EN 2022 试验方法.pdf - 第383页

1 Scope This test method will give an indication of activity of wave solder fluxes, core solder fluxes, and solder paste. 2 Applicable Documents ASTM B-36 Brass Plate, Sheet, Strip, and Rolled Bar IPC J-STD-004 Requireme…

1.0

Scope

Determine

the ability of a solder paste to wet an

oxidized copper surface and to qualitatively examine the

amount of spatter of the solder paste during reflow.

2.0

Applicable Documents

None

IPC-TM-650

Test Methods Manual

2.4.43

Solder Paste—Solder Ball Test

3.0

Test Specimen

7.6

cm x 2.5 cm x 0.8 mm specimen of 1 ounce oxygen-free

high conductivity (OFHC) copper.

4.0

Equipment/Materials/Apparatus

Flat

hot plate

Specimen tongs

Beaker 400 cc

Magnifying glass with 10 times magnification

Liquid copper cleaner

Deionized water

Isopropyl alcohol

Solvent for residual flux removal

4.1 Stencil

76 mm x 25 mm x 0.2 mm provided with at least

3 round holes or 6.5 mm diameter aperature with a minimum

between centers of 10 mm.

5.0

Procedure

5.1 Preparation

5.1.1

The

specimen shall be cleaned with a liquid copper

cleaner, washed thoroughly with water, rinsed with isopropyl

alcohol, dried and then placed in boiling deionized water for

10 minutes and air dried

5.2 Test

5.2.1

Place

stencil on test specimen and print solder paste

test pattern.

5.2.2

Reflow

using the procedure outlined in paragraph

5.2.3.2 of IPC-TM-650, Test Method 2.4.43.

5.2.3

After

reflow, the residual flux shall be removed with a

suitable solvent.

5.3

Evaluation

When

examined visually at 10X, the solder

shall uniformly wet the copper and there should be no evi-

dence of dewetting or non-wetting of the copper and there

shall be no solder spatter around the printed dots.

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.45

Subject

Solder

Paste—Wetting Test

Date

1/95

Revision

Originating Task Group

Solder Paste Task Group (5-24b)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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Scope

This

test method will give an indication of activity

of wave solder fluxes, core solder fluxes, and solder paste.

Applicable Documents

ASTM B-36

Brass

Plate, Sheet, Strip, and Rolled Bar

IPC

J-STD-004

Requirements

for Soldering Fluxes

IPC/EIA

J-STD-006

Requirements

for Electronic Grade sol-

der Alloys and Fluxed and Non-Fluxed Solid Solders for Elec-

tronic Soldering Applications

Test Specimen

3.1

minimum of 10 ml of first article or production speci-

men of liquid flux.

3.2

For

solid or paste flux, 10 ml of a 35% by weight solu-

tion of the flux in reagent grade 2-propanol (or other solvent

recommended by the manufacturer) (see J-STD-004).

3.3 For

solder paste, 10 ml of a 25% by weight solution

of the reflowed solder paste flux in reagent grade 2-propanol

(or other solvent recommended by the manufacturer) (see

J-STD-004).

3.4

For

cored wire, 10 ml of a 10% by weight solution of

reflowed cored solder flux in reagent grade 2-propanol (or

other solvent recommended by the manufacturer). For low

solids, no clean fluxes a 5% solution shall be used (see

J-STD-004).

3.5

For

preform, 10 ml of a 10% by weight solution of

reflowed preform flux in reagent grade 2-propanol (or other

solvent recommended by the manufacturer). For low solids,

no clean fluxes a 5% solution shall be used (see J-STD-004).

Apparatus and Reagents

4.1

Five

(5) replicates, approximately 40 x 75 mm [1.575 x

2.953 in], of 0.25 mm [0.00984 in] thick 70/30 brass, per

ASTM-B-36 C2600 HO2.

4.2 Degreased

steel wool #00.

4.3

Sn60

1.5 mm [0.0591 in] diameter Type S solid wire

solder per J-STD-006.

4.4

Solder

pot containing at least 2 kg of solder and no less

than 25 mm [0.984 in] in depth.

4.5

Reagent

grade isopropyl alcohol (IPA).

4.6

3.0

mm [0.118 in] diameter mandrel.

Test

5.1 Specimen Preparation

5.1.1

Clean

the five (5) brass coupons with steel wool.

5.1.2

Using

a flat strip of brass as a guide, put a 90° bend

in opposite ends of each test coupon to stiffen and flatten the

coupon.

5.1.3

Cut

a 30 ± 0.5 mm [1.181 ± 0.020 in] length of solid

wire solder.

5.1.4

Wrap

the cut length of solder around a 3.0 mm [0.118

in] mandrel.

5.1.5

Slide

the perform (coil) off of the mandrel. Make a total

of five solder performs in this manner.

5.2

Procedures

5.2.1

Maintain

solder pot at 260 ± 10 °C [500 ± 18 °F].

5.2.2

Place

a preformed solder circle in the center of a test

coupon (on the surface which faces up when the bent ends

point up).

5.2.3

Place

one drop (0.05 ml) of flux in the center of the

perform and allow to dry to minimize spattering.

5.2.4

Carefully

place the coupon on the surface of the sol-

der bath for 15 seconds. If the solder has not melted in 15

seconds, leave the coupon on the solder bath until the per-

form melts.

2215

Sanders Road

Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.46

Subject

Spread

Test, Liquid, Paste or Solid Flux,

or Flux Extracted from Solder Paste, Cored

Wires or Preforms

Date

06/04

Revision

Originating Task Group

Flux Specifications Task Group, (5-24a)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.

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ASSOCIA

TION CONNECTING

ELECTRONICS INDUSTRIES

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5.2.5

Remove

the coupon in a horizontal position and place

on a flat surface, allowing the melted solder to solidify undis-

turbed.

5.2.6

Repeat

steps 5.2.2 through 5.2.5 to test four addi-

tional specimens.

5.2.7

Use

a suitable solvent to remove all flux residue from

the test coupons.

5.3

Evaluation

5.3.1

Measure

each solder spread area by comparing to

circles (predrawn) with areas similar to those listed in Table 1.

Report the mean of the spread (area in mm

)

of the five tested

specimens.

Table 1 is intended as an aid in defining areas in mm

able 1 Typical Spread Areas Deﬁned in mm

Diameter

in mm Area in mm

10.00

78.54

10.70 90.00

11.28 100.00

6 Notes

6.1 Safety

Observe

all appropriate precautions on MSDS

for chemicals involved in this test method.

IPC-TM-650

Number

2.4.46

Subject

Spread

Test, Liquid, Paste or Solid Flux,

or Flux Extracted from Solder Paste, Cored

Wires or Preforms

Date

06/04

Revision

age2of2

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