IPC-TM-650 EN 2022 试验方法.pdf - 第690页
1 Scope This test method is to determine the physical endurance of applied conformal coating to sudden changes of high and low temperature excursions that cause physical fatigue. 2 Applicable Documents IPC-CC-830 Qualifi…
6.1.1
Unless
otherwise specified by the applicable perfor-
mance specification, the following base material types/
temperature ratings are recommended.
6.2
Suggested sources for capable test equipment:
Cambridge
Technology
Model 510A Micro-Ohmmeter
23 Elm Street
Watertown, MA 02172
(617) 923-1181
Hewlett-Packard
Model 4338A Milliohmmeter
9800 Muirlands Avenue
Irvine, CA 92718
(714) 472-3000
Keithly Instruments
Model 580
Micro-ohmmeter
28775 Aurora Road
Cleveland, OH 44139
(800) 552-1115
T
able 1
Step
T
est Condition A Test Condition B Test Condition C
Temperature Time Temperature Time Temperature Time
1
2
3
4
0, +0/-5
25, +10/-5
+70, +5/-0
25, +10/-5
15
0
15
0
-40, +0/-5
25, +10/-5
+85, +5/-0
25, +10/-5
15
0
15
0
-55, +0/-5
25, +10/-5
+105, +5/-0
25, +10/-5
15
0
15
0
Step
Test Condition D Test Condition E Test Condition F
Temperature Time Temperature Time Temperature Time
1
2
3
4
-55, +0/-5
25, +10/-5
+125, +5/-0
25, +10/-5
15
0
15
0
-65, +0/-5
25, +10/-5
+150, +5/-0
25, +10/-5
15
0
15
0
-65, +0/-5
25, +10/-5
+170, +5/-0
25, +10/-5
15
0
15
0
T
olerance shall be +2 and -0 minutes.
T
able 2
Rigid
Type NEMA Test Condition
A
GP, GT, GX, GY B
GE C
AF, BF, BI, CF, GF, GB D
GH, GM E
AI, GI, QI F
IPC-TM-650
Number
2.6.7
Subject
Thermal
Shock & Continuity, Printed Board
Date
8/97
Revision
A
P
age2of2
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
1
Scope
This
test method is to determine the physical
endurance of applied conformal coating to sudden changes of
high and low temperature excursions that cause physical
fatigue.
2
Applicable Documents
IPC-CC-830
Qualification
and Performance of Electrical Insu-
lating Compound for Printed Board Assemblies
3
Test Specimens
Five
IPC-B-25A boards (see Figure 1)
coated with conformal coating per coating supplier’s recom-
mendations.
4
Apparatus
Test
chamber - automatically controlled dual
temperature environmental test equipment or two separate
chambers capable of maintaining -65° ± 5°C [-85° ± 9°F] and
250° ± 5°C [482° ± 9°F] respectively. Please note, while most
requests state 125° ± 5°C [257° ± 9°F] on the high side, there
are cases (such as polyimide board applications) where a
higher temperature will be required. Test conditions, if not
otherwise stated as below, shall be -65°C [-85°F] and 125°C
[257°F].
Class
Low Temperature High Temperature
1
N/A N/A
2 -40°C [-40°F] 125°C [257°F]
3 -65°C [-85°F] 125°C [257°F]
4 -65°C [-85°F] 250°C [482°F]
5 Procedure
5.1 Specimen Preparation
Operate
the chamber(s) to
high and low temperatures and stabilize. Clamp or suspend
the five conformal coated IPC-B-25A boards in the thermal
shock chamber.
5.1.1 Set
the cold portion of chamber at -65°C [-85°F] and
the hot portion of chamber at 125°C [257°F].
5.1.2
Set
the dwell time for 15 minutes.
5.1.3
Set
the temperature recovery time for less than two
minutes.
5.1.4
Set
the chamber for 100 cycles.
5.1.5
Activate
the test chamber and begin testing.
5.2
Evaluation
5.2.1
Upon
completion of the thermal shock test, the speci-
mens shall meet the requirements of appearance and dielec-
tric withstanding voltage in accordance with IPC-CC-830.
IPC-2671-1
Figure
1 IPC-B-25A Test Board
2215
Sanders Road
Northbrook, IL 60062-6135
IPC-TM-650
TEST
METHODS MANUAL
Number
2.6.7.1
(Supersedes
2.6.7.1 for Conformal Coating Tests)
Subject
Thermal Shock - Conformal Coating
Date
07/00
Revision
A
Originating Task Group
Conformal Coating Task Group (5-33a)
Material
in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.
P
age1of1
ASSOCIA
TION CONNECTING
ELECTRONICS INDUSTRIES
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
1 Scope and Purpose
1.1 Scope
This method subjects unpopulated test speci-
mens (samples) to sudden, extreme changes in temperature
in order to evaluate the quality of interconnects formed during
the manufacturing processes.
1.2 Purpose This method shall be used to simulate the
thermodynamic effects of extreme temperature variations. The
use of this method is intended to be able to capture ‘‘infant
mortality’’ types of manufacturing defects.
1.2.1 This method may provide for qualification, quality con-
formance testing and lot acceptance.
2 Applicable Documents
IPC-T-50
Terms and Definitions
IPC-2221 Generic Standard on Printed Board Design
IPC-A-600 Acceptability of Printed Boards
IPC-1601 Standard for Printed Board Handling and Storage
IPC-4101 Specification for Base Materials for Rigid and Mul-
tilayer Printed Boards
IPC-4103 Specification for Base Materials for High Speed/
High Frequency Applications
IPC-6012 Qualification and Performance Specification for
Rigid Printed Boards
IPC-6013 Qualification and Performance Specification for
Flexible Printed Boards
IPC-6018 Qualification and Performance Specification for
High Frequency (Microwave) Printed Boards
IPC-9241 Guidelines for Microsection Preparation
IPC-TM-650 Test Methods Manual
1
2.1.1 Microsectioning - Microsectioning, Manual and Semi
or Automatic Method
2.6.27 Assembly Simulation - Thermal Stress, Convection
Reflow Assembly Simulation
3 Terms and Definitions
3.1 Thermal Shock (Unpopulated Printed Board)
A tem-
perature cycle with a change rate of 1 °C or more per second
as measured on the surface of the test specimen, for at least
the center 60% of each transition, during the heating and
cooling portions.
3.2 Thermal Cycle (Unpopulated Printed Board) A tem-
perature cycle that has a sample change rate of less than 1 °C
per second as measured on the surface of the test specimen,
for at least the center 60% of each transition, during the heat-
ing and cooling portions. While no minimum temperature
change rate is specified, a change rate of at least 10 °C per
minute is expected for qualification testing.
4 Test Specimen
4.1 Design/Construction Criteria
4.1.1
The test specimen shall be the D coupon in accor-
dance with the requirements of IPC-2221 Appendix A, or
alternate coupon(s) AABUS.
4.1.2 The test specimen(s) shall be constructed with holes
contained in the printed board it represents as follows:
• Through holes: D coupons shall be constructed with both
the largest plated-through holes (PTHs) and the smallest
plated-through vias.
• Propagated structures: D coupons shall be constructed
with and represent all applicable blind, buried, or filled
through hole (propagated) via structures as defined in IPC-
2221 Appendix A. D coupons contain two nets (structures).
Multiple D coupons are used for designs with more than two
structures.
4.1.2.1 The test specimen(s) shall contain the representa-
tive ground and power planes of the printed board design.
4.1.3 The test specimen(s) shall allow for microsection
evaluation of all the applicable, representative PTHs and vias
defined in 4.1.2 after exposure to the conditions of this Test
Method. IPC-9241 provides guidance on the proper prepara-
tion of a metallographic sample (microsection) of a printed
board.
3000 Lakeside Drive, Suite 105N
Bannockburn, IL 60015-1249
IPC-TM-650
TEST METHODS MANUAL
Number
2.6.7.2
Subject
Thermal Shock, Thermal Cycle and Continuity
Date
3/2020
Revision
C
Originating Task Group
Thermal Stress Test Methodology Subcommittee
(D-32)
Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.
Page1of5