IPC-TM-650 EN 2022 试验方法.pdf - 第341页

1 Scope This test method is to determine the impact resis- tance of polymer film circuitry when exposed to a series of falling ball impingements. The method is used to evaluate the resistance to chipping, flaking, convol…

1 Scope This test method is used to determine the adhe-

sion quality of solder masks used on flexible circuits.

2 Applicable Documents

IPC-A-42-G-KIT

Double-Sided Artwork

3 Test Specimen The IPC-A-42-G-KIT artwork package

provides the electronic Gerber information necessary for the

fabrication of the IPC B-42 test board. IPC-B-42 flexible test

patterns H1, H2, and/or H3, or production test samples with

solder mask coating. Each flexible section shall be separated

and tested independently.

4 Apparatus 3.18 ± 0.1 mm [0.125 ± 0.004 in] diameter

mandrel (metal rod).

5 Procedures

5.1 Test

5.1.1

Bend the test specimen around the mandrel so that

the ends of the test specimens are on the same side of the

mandrel and nominally parallel to each other. (The test speci-

men forms a ‘‘U’’ shape around the mandrel.) Each cycle

must be at the same point on the flexible circuit.

5.1.2 Flip the test specimen so that its opposite surface is

against the metal rod and repeat 5.1.1.

5.1.3 Repeat 5.1.1 and 5.1.2 nine times (ten cycles total) for

each of the test specimens.

5.2 Evaluation Visually examine the flexible circuit test pat-

tern with corrected 20/20 vision without magnification for sol-

der mask delamination or cracks.

1. www.ipc.org/onlinestore

3000 Lakeside Drive, Suite 309S

Bannockburn, IL 60015-1249

IPC-TM-650

TEST METHODS MANUAL

Number

2.4.29

Subject

Solder Mask - Adhesion to Flexible Circuits

Date

03/07

Revision

Originating Task Group

Solder Mask Performance Task Group (5-33b)

Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.

Page1of1

ASSOCIATION CONNECTING

ELECTRONICS INDUSTRIES

Scope

This

test method is to determine the impact resis-

tance of polymer film circuitry when exposed to a series of

falling ball impingements. The method is used to evaluate the

resistance to chipping, flaking, convolution or other forms of

separation of the polymer film from either the conductor or

base laminate material surfaces.

Applicable documents

None

Test specimen

IPC-B-25

Multi-Purpose Test Board

Equipment/Apparatus

4.1

suitable electromagnetic apparatus to precisely con-

trol the height and the point of impact of the falling ball (see

Figure 1)

4.2

The

test ball shall be 25 mm diameter, 67 gram preci-

sion steel ball.

4.3

When

testing flexible circuits, the test specimen shall be

placed on a hard smooth surface. Use of at least 0.6 cm cold

rolled steel sheet stock.

Procedure

5.1 Preparation

5.1.1

Adjust

the fall height by setting the solenoid core at 53

cm ± 0.3 cm from the top surface of the test specimen.

5.2

Test

5.2.1

Place

the steel ball on the underside of the solenoid

core with the solenoid energized.

5.2.2

Place

the test specimen below the falling ball in such

a manner as to strike the center of feature (L) on test speci-

men IPC-B-25.

5.2.3

Release

the falling ball by de-energizing the solenoid

magnet.

5.2.4

is necessary to catch the ball immediately after

impact so as not to permit more than one blow at a time.

5.2.5

Repeat

this procedure for 10 cycles and observe the

test specimen after each blow.

5.2.6

Perform

the same test (also for l0 cycles)on any area

of the test specimen having no circuitry.

5.2.7

Repeat

the same test in such a manner as to strike

the edge of the feature (L) 10 times.

5.3

Evaluation

Visually

examine the test specimen for

chipping, flaking, convolution, or other forms of separation of

the polymer film.

6 Notes

6.1 The

test apparatus shown in Figure 1 can easily be

assembled using a standard laboratory stand and clamps, a

12 volt DC Solenoid, and a 12 Volt battery.

IPC-2-4-30-1

Figure

1 Falling Ball Impact Test Apparatus

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.30

Subject

Impact

Resistance, Polymer Film

Date

10/86

Revision

Originating Task Group

N/A

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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1.0

Scope

The

test specifies a standard procedure for

determining the viscosity of solder paste in the range of

300,000 to 1,600,000 centipoise.

2.0

Applicable Documents

None

3.0

Test Specimen

Paste

to be tested shall be stabilized

at 25° ± 1°C for a minimum of 24 hr. prior to testing. The

paste volume shall be sufficient to fill a test container having a

minimum diameter of 5 cm and a minimum depth of 5 cm.

4.0

Equipment/Apparatus

The

equipment used shall be a

spindle type viscometer (Brookfield RVTD or equivalent) with a

reversible helipath stand and pen recorder. A TF spindle shall

be used for tests and operated at 5 rpm. Other equipment

may be used provided the results can be empirically corre-

lated as mutually agreed upon with the following test. Addi-

tional shear rates may be specified by the user or supplier

provided one data point is based as specified below.

5.0

Procedure

5.1 Preparation

5.1.1

Open

the supply container(s); remove any internal cov-

er(s), scrape off paste adhering to the lid(s), internal covers,

and the container walls; and add this material to the paste in

the supply container(s).

5.1.2

Using

a spatula, stir the paste gently for 1 to 2 minutes

to homogenize it; taking care to avoid the introduction of air.

5.1.3

necessary, gently transfer the paste to the test con-

tainer having the specified volume; without introducing air.

Note:

the supply container meets the volume and size

requirements a separate test container is not needed.

5.1.4

The

test container shall be placed in a constant tem-

perature environment at 25 ± 0.25°C. The solder paste shall

remain stationary for a minimum of two hours to reach tem-

perature and rheological equilibrium. For freshly manufactured

products, products which require significant adjustment with

thinner (greater than 1/2% by weight), or products having

rheological characteristics requiring longer time to stabilize,

the stabilization time shall be increased to four hours or as

mutually agreed upon by user and supplier.

5.1.5 Set

the bottom stop for helipath travel to position the

T spindle at 2.8 cm below the surface of the solder paste in

the test container. The bottom stop of the spindle shall be a

minimum of 1 cm above the bottom of the container. Set the

upper stop to position the spindle at 0.3 cm below the surface

of the solder paste.

5.2

Test

5.2.1

Immerse

the spindle in the solder paste and record

data for 10 minutes (5 cycles). The temperature of the solder

paste during the test shall be maintained at 25 ± 0.25°C.

5.3

Evaluation

Viscosity

is to be expressed at the value

calculated from the average of the peak and valley of the last

two cycles. If the average for the first two cycles is more than

10% higher than the last two cycles, the test is invalid and

additional equilibrium time is required. Record data and enter

in Table 1, ‘‘Test Report on Solder Paste.’’

6.0 Notes

6.1

Test Equipment Sources

The

equipment sources

described below represent those currently known to the

industry. Users of this test method are urged to submit addi-

tional source names as they become available, so that this list

can be kept as current as possible.

6.1.1

Spindle Type Viscometer Equipment

Brookfield

Engineering Laboratories, Inc.

240 Cushing Street

Stoughton, MA 02072

(617) 344-4310

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.34

Subject

Solder

Paste Viscosity—T-Bar Spin Spindle Method

(Applicable for 300,000 to 1,600,000 Centipoise)

Date

1/95

Revision

Originating Task Group

Solder Paste Task Group (5-24b)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

age1of2

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