IPC-TM-650 EN 2022 试验方法.pdf - 第701页

1 Scope This test describes a procedure which may be conducted to determine if a printed wiring board is con- structed to withstand the dynamic vibrational stresses that may be encountered during field service. This test…

1.0

Scope

determine the resistance of the laminate to

thermal stress in both the etched and unetched state.

2.0

Applicable Documents

IPC-TM-650

Methods

2.3.6, 2.3.7, 2.3.7.1

3.0

Apparatus

3.1

Solder

pot capable of maintaining the temperature on

the applicable specification sheet for the material ± 2°F and

acceptinga2x2inch test specimen or equivalent.

3.2

Dow

Corning Fluid #704 or equivalent.

4.0

Test Specimens

4.1

One

(1) test specimen2x2inch will be cut from each

sample sheet for the unetched specimen.

4.2

One

(1) test specimen2x2inch from each sample

sheet for the etched specimen.

4.3

The

edges of the2x2inch specimen shall be sanded.

5.0 Procedure

5.1

Etch

specimen required for thermal stress etched

according to IPC-TM-650, Methods 2.3.6, 2.3.7, or 2.3.7.1.

5.2

Apply

silicon fluid to side of specimen that will be in

contact with solder.

5.3

Float

the specimen on the solder for the time and at the

temperature specified on the applicable specification sheet for

the material.

5.4

The

clad or unclad surface should show no evidence of

charring, loss of surface resin, softening delamination, blister-

ing, or weave exposure.

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.6.8.1

Subject

Thermal

Stress, Laminate

Date

9/91

Revision

—

Originating Task Group

N/A

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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Scope

This

test describes a procedure which may be

conducted to determine if a printed wiring board is con-

structed to withstand the dynamic vibrational stresses that

may be encountered during field service. This test method

provides specific parameters for one application in order to

present the proper procedures. Specific test conditions must

be agreed upon by the customer and the vendor.

Applicable Documents

IPC-6012

Qualification

and Performance Specification for

Rigid Printed Boards

Test Specimen

The

preproduction or production printed

wiring board.

Apparatus

4.1 Vibration

vibration system capable of producing an

input of 25 G’s over a frequency range from 20 Hz to 2000 Hz

to 20 Hz performed in 16 minutes.

4.2

Mounting Fixtures

4.3

The

test fixture must be designed such that resonant

vibration inherent in the fixture within the frequency range

specified for the test shall be minor. The magnitude of the

applied vibration should be monitored on the test fixture near

the specimen mounting points.

4.4

The

test specimen shall be restrained from movement

by fixturing at all four edges and with the flat surface of the

boards mounted perpendicular to the axis of vibration.

Test Procedures

5.1

The

boards shall successfully pass the interconnection

resistance test in accordance with IPC-6012 before and after

the vibration test.

5.2

The

boards shall be subjected to both a cycling and a

resonance dwell test.

5.2.1

The

cycling test shall consists of one sweep from 20

Hz to 2000 Hz to 20 Hz performed in 16 minutes. The input

acceleration (G’s) over the 20-2000-20 Hz frequency range

shall be maintained at 15 G’s.

5.2.2

The

boards shall be subjected to a 30-minute reso-

nance dwell with 25 G’s input or a maximum of 100 G’s out-

put measured at the geometric center of the board.

5.3

Evaluation

Examine

boards for warp or delamination

and interconnection resistance after exposure to the vibration

test.

6 Notes

None

2215

Sanders Road

Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.6.9

Subject

Vibration,

Rigid Printed Wiring

Date

05/04

Revision

Originating Task Group

Rigid Printed Board Performance Task Group

(D-33a)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.

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ASSOCIA

TION CONNECTING

ELECTRONICS INDUSTRIES

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1.0

Scope

The

purpose of this test method is to provide a consistent

procedure to test the sensitivity of electronic components to

ultrasonic energy. There has been a reluctance in the elec-

tronics industry to use ultrasonic energy for printed board

assemblies cleaning because of the possibility of damage to

wire bonds in active, hermetically sealed components or other

damage that might cause latent failures.

Recent work has shown that electronic components have a

low potential for damage from ultrasonics (See 6.1) under

conditions seen in most cleaning processes. In addition, MIL-

STD-2000 Rev. A and J-STD 001 now allow for the use of

ultrasonic cleaning, as does the proposal for IEC TC91 Inter-

national Standards based on an updated revision of the

J-STD-001.

1.1

Definitions

Ultrasound: All

sound in frequencies above the range of

human hearing. For the purpose of ultrasonic cleaning, fre-

quencies between 18-800 kHz are in commercial use. In the

lower frequency ranges, fluid cavitation is the primary agitation

method. In the higher frequency ranges, microstreaming (i.e.,

fluid pumping) is believed to be the form of mechanical

agitation.

Frequency: The number of periodic oscillations, vibrations of

waves per unit of time, usually expressed in cycles per sec-

ond.

Generator: An electronic system which converts the 50 or 60

Hz power line electricity into an ultrasonic frequency drive sig-

nal which powers the transducers in their resonant frequency

range.

Transducers: Convert electrical energy from the generator into

mechanical (vibratory) energy, producing high intensity sound

waves in a liquid and causing cavitation. Transducers are pri-

marily of two types.

Piezoelectric: Piezoelectric ceramics, which change dimen-

sions in the presence of an electric field. Thickness varies in

response to an applied voltage. Conversion efficiency =

70-90%

Magnetostrictive: Made of nickel or its alloys, it changes

length when placed in a magnetic field. Conversion efficiency

= 20-50%

Cavitation: The rapid formation and oscillation or violent col-

lapse of microscopic bubbles or cavities in a liquid, produced

by introducing high frequency (ultrasonic) sound waves into a

liquid. The agitation from countless implosions of these

bubbles create a highly effective scrubbing of both exposed

and hidden surfaces of parts immersed in the cleaning

solution.

Degas: The act of removing entrained gas from cleaning fluid.

Gas bubbles tend to absorb ultrasonic energy, thereby

decreasing the amount of energy available for cleaning.

2.0

Applicable Documents

2.1 Institute for Interconnecting and Packaging Elec-

tronic Circuits (IPC)

IPC-T-50

Terms

and Definitions for Interconnecting and

Packaging Electronic Assemblies

IPC-CH-65 Guidelines

for Cleaning of Printed Boards and

Assemblies

2.2

Joint Industry Standards

J-STD-001

Requirements

for Soldered Electrical and Elec-

tronic Assemblies

2.3

Military

MIL-STD-2000

Rev. A Standard Require-

ments for Soldered Electrical and Electronic Assemblies

2.4

Other Publications

IEC-TC-91

Proposed

International Standard (based on

J-STD-001) International Requirements for Soldered Electrical

and Electronic Assemblies Using Surface Mount and Related

Assembly Technologies

3.0

Test Specimens

The

board mounted components to be tested should be the

exact type and configuration the tester intends to use in pro-

duction. A statistically valid number of each type and package

style of component of interest should be tested. For example,

if actual production boards are used for testing and only one

of a particular component is contained on the board, then a

statistically valid number of boards will have to be tested. If,

instead of production boards, dummy boards are used, they

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.6.9.1

Subject

Test

to Determine Sensitivity of Electronic

Assemblies to Ultrasonic Energy

Date

1/95

Revision

Originating Task Group

Ultrasonic Cleaning Task Group (5-31e)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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