IPC-TM-650 EN 2022 试验方法.pdf - 第734页

1 Scope This test method describes the procedure for establishing the service temperature for metal-clad flexible base material (laminate) as described in IPC-4204 as well as cover materials and adhesive bonding films (u…

1.0

Scope

This

test method defines the procedure for

determining the low temperature flexibility of flexible printed

wiring materials by flexing while immersed in a solution mixed

from dry ice (solid carbon dioxide) and isopropyl alcohol.

2.0

Applicable Documents

None

3.0

Test Specimen

The

test specimen shall consist of an

etched conductor pattern in accordance with Figure 1.

4.0

Test Equipment

4.1

Flexing

fixture similar to Photo 1, with 1 inch diameter

mandrel.

4.2

Insulated

container, approximately 20 quart capacity.

4.3 Two lbs. dry ice (solid carbon dioxide).

4.4 Three

gallons reagent grade isopropyl alcohol.

4.5 Thermometer

capable of measuring at least -65°C.

4.6 Safety

gloves.

5.0

Procedure

5.1

Prepared

a minimum of two test specimens per Figure 1

using good commercial practices.

5.2

Prepare

a bath by mixing two lbs. of solid carbon diox-

ide with three gallons of isopropyl alcohol. Caution: use

adequate safety precautions, as bath will produce extreme

cold (approximately -65°C).

5.3

Mount

the test specimen in the test fixture such that it is

wrapped 180° around the 1 inch diameter mandrel.

5.4

Submerge

the test specimen end of the flexing fixture

into the cold bath and flex 5 times.

5.5

Remove

the specimen from the bath and examine for

cracking, delaminations, splits, and/or any other viable defect.

6.0 Notes

6.1

All

safety precautions must be exercised when working

with a mixture of dry ice and alcohol.

6.1.1

Dry

ice has a temperature of -110°F, passes directly

to the gaseous state, and is used as a refrigerant. Therefore,

it is dangerous if not handled carefully.

6.1.2

Isopropyl

alcohol is flammable and toxic; should not

be ingested, and should also be handled properly.

6.2

Detailed

drawings of the suggested flexing fixture are

available from the IPC office.

IPC-2618-1

Figure

1 Low Temperature Flexibility Test Pattern. Note:

Conductors are 0.060 inch wide on 0.100 inch centers.)

IPC-2.6.18_p1

Photo

1 Low Temperature Flexibility Flexing Fixture.

(Note: Fixture Drawing available from IPC.)

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.6.18

Subject

Low

Temperature Flexibility, Flexible Printed Wiring

Materials

Date

7/85

Revision

Originating Task Group

N/A

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

age1of1

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1 Scope This test method describes the procedure for

establishing the service temperature for metal-clad flexible

base material (laminate) as described in IPC-4204 as well as

cover materials and adhesive bonding films (unsupported

adhesive and supported bond plies) as described in IPC-

4203. For purposes of this test method, cover material shall

consist of coverlay and coverfilm but shall not include cover-

coat materials. Properties evaluated after thermal aging in this

test are: visual, peel strength and dielectric strength.

2 Applicable Documents

2.1 IPC

IPC-T-50 Terms and Definitions for Interconnecting and

Packaging Electronic Circuits

IPC-TM-650 Test Methods Manual

2.4.9 Peel Strength, Flexible Dielectric Materials

2.4.13 Solder Float Resistance Flexible Printed Wiring

Materials

IPC-4203 Adhesive Coated Dielectric Films for Use as Cover

Sheets for Flexible Printed Circuitry and Flexible Adhesive

Bonding Films

IPC-4562 Metal Foil for Printed Board Applications

2.2 ASTM International

ASTM D-149 Standard Test Method for Dielectric Break-

down Voltage and Dielectric Strength of Solid Electrical Insu-

lating Materials at Commercial Power Frequencies

3 Bond Strength Test Procedure

3.1 Specimen Preparation for Metal-Clad Flexible Base

Material (Laminate)

3.1.1

Prepare twelve specimens according to the procedure

outlined for method A of IPC TM-650, method 2.4.9, using

appropriate photolithographic processes. Etch four conduc-

tors 3.2 mm [0.126 in] wide, 5.7 mm [0.224 in] pitch, 230 -

250 mm [9 - 10 in] long on a nominal 25 mm [1 in] wide strip

of flexible base dielectric (see Figure 1).

Single-clad or double-clad flexible base material shall be

tested in the format supplied. If the flexible base material

under test is double-clad, prepare a separate set of speci-

mens for each side. It is permissible to leave the unetched

copper on the non-test side (see Notes 6.1 and 6.2).

3.2 Specimen Preparation for Cover Material

3.2.1

Single-clad base material shall be produced from

specimens of the cover materials. Cover material shall be

bonded to the shiny side of 34.3 µm [1.35 mil] copper foil,

type CU-E1-1S or CU-E7-1S per IPC-4562 (CU-E1-1S shall

be the referee material). Copper foil cleaning shall be per the

manufacturer’s normal cleaning procedure. The referee clean-

ing procedure shall be per Table 1.

3.2.2 Prepare twelve specimens according to the procedure

outlined for method A of IPC TM-650, method 2.4.9, using

appropriate photolithographic processes. Etch four conduc-

tors 3.2 mm [0.126 in] wide, 5.7 mm [0.224 in] pitch, 230 -

250 mm [9 - 10 in] long on a nominal 25 mm [1 in] wide strip

of flexible base dielectric (see Figure 1).

3.3 Specimen Preparation for Adhesive Bonding Film

3.3.1

Metal-clad flexible base material shall be produced

from specimens of the adhesive bonding film being evaluated.

Adhesive bonding film shall be bonded to the shiny side of

34.3 µm [1350 µin] ED copper foil, type CU-E1-1S or RA

copper foil, CU-E7-1S per IPC-4562 (CU-E1-1S shall be the

referee material). Adhesive bonding film shall be bonded

between the copper foil and CU-E1-1S as support material as

illustrated in Figure 2. Copper foil cleaning shall be per the

manufacturer’s normal cleaning procedure. The referee clean-

ing procedure shall be per Table 1, the same as detailed in

IPC-4203.

Prepare specimens according to the procedure outlined for

method A of IPC TM-650, method 2.4.9, using appropriate

1. www.ipc.org

2. Current and revised IPC Test Methods are available on the IPC Web site (www.ipc.org/html/testmethods.htm)

3. www.astm.org

3000 Lakeside Drive, Suite 309S

Bannockburn, IL 60015-1249

IPC-TM-650

TEST METHODS MANUAL

Number

2.6.21

Subject

Service Temperature of Metal-Clad Flexible Laminate,

Cover Material and Adhesive Bonding Films

Date

6/11

Revision

Originating Task Group

Flexible Circuits Test Methods Subcommittee

(D-15)

Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.

Page1of5

photolithographic processes such that a minimum of twelve

good specimens are yielded at the end of 3.4.5. On the ‘‘Test

Surface,’’ etch four conductors 3.2 mm [0.126 in] wide,

5.7 mm [0.224 in] pitch, 230 - 250 mm [9 - 10 in] long on a

nominal 25 mm [1 in] wide strip of flexible base dielectric (see

Figures 1 and 2).

3.4 Conditioning and Aging Procedure

3.4.1

Twelve specimens, as described in section 3, shall be

subjected to a stabilization period of a minimum of 24 hours

at23°C±2°C[73.4 °F ± 3.6 °F] and 50% ± 5% RH.

IPC-2-6-21a

Figure 1 Construction of Specimens for Peel Strength Testing

Metal Conductor (4 each)

3.2 mm

[0.126 in]

25 mm [1 in]

(nom.)

230–250 mm [9–10 in]

5.7 mm

[0.224 in]

Table 1 Cleaning Process for Shiny Copper

Step Process Material Temperature Time

1 Soak Clean

Use commercially available acid or alkaline

cleaners

Per supplier recommended

temperature

Per supplier recommended

time

2 Rinse Running tap water Room Temperature 3 - 5 minutes

3 Microetch

Sodium persulfate: Two liters of deionized

water, 280 grams of sodium persulfate,

25 cc sulfuric acid

Room Temperature 1 - 2 minutes

4 Rinse Running tap water Room Temperature 1 minute

5 Acid Dip

Sulfuric acid 10% by volume, dilution 1.8

liters deionized water, 200 cc sulfuric acid

96% assay

Room Temperature 45 seconds

6 Rinse Running tap water Room Temperature 1 minute

7 Rinse Deionized water Room Temperature 1 minute

8 Dry Force air dry or blot with paper towels Room Temperature 1 - 3 minutes

9 Bake Bake in clean air-circulating oven 110±5°C[230.0 ± 9.0 °F] 10 to 15 minutes

10 Lamination

*Maximum delay between bake and

lamination shall be 30 minutes

*Lamination conditions (e.g., pressure, temperature, time, etc.) shall conform to suppliers’ recommendations.

IPC-TM-650

Number

2.6.21

Subject

Service Temperature of Metal-Clad Flexible Laminate, Cover

Material and Adhesive Bonding Films

Date

6/11

Revision

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