IPC-TM-650 EN 2022 试验方法.pdf - 第103页

T able 1 T est Report on Solder Paste Enter appropriate information in top portion of report and complete report by entering the test results or checkmarks in the appropriate spaces. Inspection Purpose: QPL I.D. Number: …

1.0

Scope

This

procedure determines the percent metal

content for solder paste.

2.0

Applicable Documents

None

3.0

Test Specimen

grams of solder paste

4.0

Equipment/Apparatus

Balance

Crucible

or Beaker

Heat Source

Flux Solvent

5.0

Procedure

5.1 Preparation

5.1.1

Weigh

10 to 50 grams (to the nearest 0.01 gram) of

solder paste into a tared vessel suitable for melting the solder

paste.

5.2

Test

5.2.1

Melt

the solder at approximately 25°C above liquidus

of the alloy, remove from heat and allow solder to solidify.

5.2.2

Extract

melt from residual flux with a suitable solvent,

dry and weigh metal to within 0.01 grams to determine %

metal content.

5.3

Evaluation

Weight

of extracted metal

Weight

of original sample

x 100 = % Metal

Enter the results in Table 1 ‘‘Test Report on Solder Paste.’’

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062

IPC-TM-650

TEST

METHODS MANUAL

Number

2.2.20

Subject

Solder

Paste Metal Content by Weight

Date

1/95

Revision

Originating Task Group

Solder Paste Task Group (5-24b)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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able 1 Test Report on Solder Paste

Enter appropriate information in top portion of report and complete report by entering the test results or checkmarks in the appropriate spaces.

Inspection Purpose: QPL I.D. Number:

Qualiﬁcation Manufacturer’s Identiﬁcation:

__ Quality Conformance A Manufacturer’s Batch Number:

Quality Conformance B Date of Manufacture:

Shelf-Life Extension Original Use-By Date:

Performance Revised Use-By Date:

Date

Inspection Completed:

Overall

Results: __ Pass __ Fail

Inspection Performed by:

itnessed by:

Inspections

User’s

Actual

Requirement Test Result P/F (*) Tested by & Date

Material

Visual

Metal Content

Viscosity

Solder Ball

Slump

Alloy

Flux

Powder Size

% In Top Screen

% In Next Screen

% In Bottom Screen

% In Receiver Bottom

Max. Powder Size

Powder Shape

Tack

Wetting

* P/F = PASS/FAIL; enter P if test results are within tolerance of actual requirement; otherwise, enter F

IPC-TM-650

Number

2.2.20

Subject

Solder

Paste Metal Content by Weight

Date

1/95

Revision

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Scope

The

object of a planarity measurement is to deter-

mine the effectiveness of a polymer thin film in smoothing

topological features created by underlying layers of circuitry or

etch patterns. In this case, the polymer thin film is a dielectric

material for use in High Density Interconnect (HDI) and

microvia technologies.

1.1

Test Structure

Schematics

given in Figure 1 (end view)

and Figure 2 (top view) depict the essential features of a rec-

ommended test structure for measuring the planarity as a

function of feature size.

In the finished test structure, ‘‘d’’ is the step height over the

circuit trace after the polymer has been deposited and cured.

The planarity is dependent on the trace height, ‘‘b,’’ the poly-

mer coating thickness, ‘‘c,’’ and the trace width, ‘‘a.’’ Rather

than fully characterizing this relationship for each polymer

coating, it is best to use simplified standard procedures for

measurement and for comparing different types of coatings.

Planarity is also affected by the proximity of the line feature

being used for measurement to any neighboring topological

feature in the test structure. Planarity is generally much lower

for isolated features. Therefore, in order to consider the

‘‘worst case’’ conditions, isolated lines are preferred in the

test structure. To satisfy this requirement, no neighboring fea-

tures can be within fewer than 15 line widths of the line in

question.

The test pattern in Figure 2 is recommended as one that pro-

vides planarity characterization over a broad range of feature

sizes. All lines are isolated in accord with the above guideline.

It is recommended planarity be determined over the complete

range of these widths (but the specific nominal values within

that range are not important). Normally, one finds the planar-

ity is high over narrow lines, but it progressively rolls off in pro-

ceeding toward wider ones. The roll-off rate is important, and

it varies from polymer to polymer. Thus any report of planarity

must include the line width measured and, preferably, a plot of

planarity versus line width should be reported.

Applicable Documents

IPC-DD-135

Qualification

for Deposited Organic Interlayer

Dielectric Materials for Multi-Chip Modules

Test Specimens

3.1 Prepare Test Coupons

Prepare

the surface of the test

structure for polymer deposition in accordance with the pro-

cedure recommended by the manufacturer of the dielectric

coating (follow all procedures for cleaning the surface and for

deposition of a coupling agent if one is recommended). Coat

the polymer resin in accordance with the manufacturer’s rec-

ommended procedure to provide an average film thickness of

63.5 µm (± 10%) for 18 µm copper over the substrate surface

when the cure is completed. Cure the polymer thin film using

IPC-2-2-21-1

Figure 1 Cross-Section Planarization Diagram

IPC-2-2-21-2

Figure

2 Top View of Planarization Structure

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062

IPC-TM-650

TEST

METHODS MANUAL

Number

2.2.21

Subject

Planarity

of Dielectrics for High Density

Interconnection (HDI)/Microvia Technology

Date

11/98

Revision

Originating Task Group

HDI Test Methods Task Group (D-42a)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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