IPC-TM-650 EN 2022 试验方法.pdf - 第79页

1.0 Scope To measure the inside diameter of plated through holes in printed wiring boards. 2.0 Applicable documents None. 3.0 Test Specimen Production board or test pattern, number and design of holes shall be determined…

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1.0
Scope
To
measure the inside diameter of drilled
through-holes in printed wiring boards, either in process or
end product.
2.0
Applicable Documents
IPC-D-300
Dimensions
and Tolerances, Printed Wiring
Boards, Single and Two-Sided Rigid Boards.
IPC-A-600 Acceptability
of Printed Wiring Boards.
3.0
Test Specimen
Sample
board or production printed
wiring board; in either case, the specimen shall have identical
drilling or punching characteristics without through-hole
punching.
4.0
Apparatus
Stereoscopic
Microscope with 10x magnifi-
cation, micrometer scale eye piece, and illuminator or equal.
5.0
Procedure
5.1 Measurement
Set
the microscope on 10x magnifica-
tion and measure the inside diameter of the hole from one
side of the hole to the other side at the widest part of the hole.
5.2
Evaluation of Test
Record
measurements of drilling
and punching characteristics.
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062
IPC-TM-650
TEST
METHODS MANUAL
Number
2.2.6
Subject
Hole
Size Measurement, Drilled
Date
8/97
Revision
A
Originating Task Group
N/A
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
age1of1
电子技术应用　　　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
1.0
Scope
To
measure the inside diameter of plated
through holes in printed wiring boards.
2.0
Applicable documents
None.
3.0
Test Specimen
Production
board or test pattern,
number and design of holes shall be determined by agree-
ment between vendor and customer or applicable drawings.
4.0
Apparatus
4.1 Stereoscopic microscope
With
20x magnification
micrometer scale eye piece and illuminator.
5.0
Procedure
5.1 Measurement
Set
the microscope on 20x magnifica-
tion and measure the inside diameter of the hole from one
side to the other side at the largest point.
5.2
Evaluation of test
Record
measurements and note if
voids and nodules were present.
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062
IPC-TM-650
TEST
METHODS MANUAL
Number
2.2.7
Subject
Hole
Size Measurement, Plated
Date
5/86
Revision
A
Originating Task Group
Printed Board Test Methods Task Group (7-11d)
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
age1of1
电子技术应用　　　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
1.0
Scope
This
method of test covers the procedure for
determining weight (average thickness - by weight measure-
ment) of copper foil for printed circuits.
2.0
Applicable Documents
None.
3.0
Test Specimen
Use
template described below to cut
three samples of copper. Samples should be taken from near
the left and right edges and the center across the width of the
roll.
4.0
Apparatus
4.1
Balance
capable of weighing accurately to ±0.1 grams.
4.2
Knife
suitable for cutting copper.
4.3
Template
precut to 254 sq. in. (0.164 sq. meters) [12 in
±1/32 in by 21-3/16 in ±1/32 in] (304.8mm by 538.2
+0.079mm).
5.0
Procedure
5.1
Identify
the samples (left, center and right); weigh sec-
tions singly and record values.
5.2
Evaluation
(1)
One ounce copper foil (nominal 0.0014 in.) should weigh
50 grams ±5.
(2) Two ounce copper foil (nominal 0.0028 in.) should weigh
100 grams ±10.
(3) ‘‘X’’ ounce copper foil should weigh 50X grams ±10%.
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062
IPC-TM-650
TEST
METHODS MANUAL
Number
2.2.12
Subject
Thickness
of Copper By Weight
Date
3/76
Revision
A
Originating Task Group
N/A
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
age1of1
电子技术应用　　　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ