IPC-TM-650 EN 2022 试验方法.pdf - 第157页
1 Scope This test is to measure the flow properties of cast adhesive freefilms or coverfilms used in the manufacture of flexible circuitry. The test also provides a measure of the squeeze out, which might be expected to …

5.2.8
Weigh
the circular specimen on the analytical balance
to the nearest 0.005 gram. Record this as the disc weight, or
W
D
.
5.3
Calculation
The
resin flow is calculated as follows:
Resin Flow, Percent =
(
W
O
− 2W
D
W
O
)
x
100
W
o
=
Original weight of the specimen
W
D
=
Disc weight of the specimen (cut from the specimen
after pressing)
5.4
Report
The
resin flow, percent, for each specimen
tested and the average of all specimens tested shall be
reported.
6.0 Notes
None
6.1
Other
resins may require different temperature settings
to achieve flow. Pressure may also be dependent on the resin
chemistry. Agreement of temperature and pressure by sup-
plier and user other than as specified should be included in
the report, see 5.4.
6.2
Desiccator Conditions
The
Test Methods Task Group
determined that a great majority of test laboratories are unable
to consistently hold the Relative Humidity in a desiccator to
less than 20%. Based on data from participating company lab
management, the lowest practically feasible RH for use with
the affected IPC Test Methods is 30% maximum.
IPC-TM-650
Number
2.3.17
Subject
Resin
Flow Percent of Prepreg
Date
8/97
Revision
D
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1
Scope
This
test is to measure the flow properties of cast
adhesive freefilms or coverfilms used in the manufacture of
flexible circuitry. The test also provides a measure of the
squeeze out, which might be expected to occur around termi-
nal pads or other boundary spaces.
1.1
Limitations
It
is not possible to define a universal set of
laminating conditions that suit all of the various adhesive
types. This test is dependent on sample preparation, which is
consistent with good industry practice and in accordance with
the suppliers’ suggested laminating procedures.
2
Applicable Documents
None
3
Test Equipment
3.1 Copper foil
Foil
may be treated one side or untreated.
3.2
A
laminating press in good working order with platen
surfaces of 30.5 cm x 30.5 cm minimum. Platens must be
sufficiently flat and parallel to allow uniform lamination.
3.3
Paper
punches with circular punch sizes of 1.6 mm, 3.2
mm, 4.8 mm, and 6.4 mm.
3.4
A
suitable instrument for measuring thickness of the
adhesive.
4
Test Procedure
4.1 Layup for Adhesives Cast on Coverfilms
With
the
release film intact, punch seven graduating holes across the
coverfilm (see Figure 1), then remove release. Alternative
punched hole diameters may be agreed upon between user
and vendor.
4.2
Layup of Freefilm Adhesive
The
freefilm must be
transferred to a suitably thick polyimide or polyester film. This
effectively creates a coverfilm, which may be laid up per 4.1.
A 0.005 mm polyimide film shall be used as a referee in the
event of conflict.
4.3
Lamination
To
be accomplished by time, temperature,
press pad, and pressure parameters as agreed upon between
supplier and user. A prebake may be used to simulate
extended storage conditions. Prebake conditions must be
agreed upon by supplier and user.
4.4
Evaluation
4.4.1 Squeezeout Characteristics
Measuring
squeeze-
out on specimen punched holes at 90° intervals around the
circumference of the holes; averaging the four readings for
each hole to arrive at an average squeezeout.
Calculation:
average
adhesive
thickness
= microns/micron
5 Notes
5.1
Fill
and squeezeout properties of cast adhesive films are
a complex variable. Different adhesives will exhibit different
abilities to flow. The amount of retained solvent, adhesive
thickness, shelf aging, and substrate thickness will cause the
flow properties to vary within any one adhesive. The uniformity
of lamination, press pad, and thermal excursion is critical in
obtaining test repeatability.
IPC-23171-1
Figure
1 Punched Holes (mm)
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
IPC-TM-650
TEST
METHODS MANUAL
Number
2.3.17.1
Subject
Resin
Flow of Adhesive Coated Films and
Unsupported Adhesive Films
Date
5/98
Revision
B
Originating Task Group
Flex Peel Strength Test Methods Task
Group (D-13A)
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
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1.0
Scope
This
test method is designed to measure the
Resin Flow of ‘‘no flow’’ prepreg used for bonding and adhe-
sion without formation of resin bead as caused by flow of the
resin.
2.0
Applicable Documents
None
3.0
Test Specimens
3.1 Size and Configuration
A
specimen shall consist of
multiple plies of prepreg cut approximately 102 mm [4.0 in] x
102 mm [4.0 in]. If the reinforcement is a continuous fiber
woven fabric, the sides shall be cut on a bias to the fabric
weave. Unless otherwise specified, the test specimen shall
have three plies.
3.2
Quantity and Sampling
Unless
otherwise specified,
the number of specimens tested shall be as follows: For quali-
fication testing, 3 specimens shall be tested, with the pieces
for each taken from areas of the prepreg that represents the
center and both edges of the material as impregnated. For lot
testing, one specimen shall be tested, with the pieces ran-
domly taken from the prepreg. Pieces shall be taken no less
than 25.4 mm [1.0 in] from the impregnated edge.
4.0
Apparatus or Material
4.1 Laminating Press
Unless
otherwise specified, a lami-
nating press capable of maintaining at a temperature of 171 ±
2.8°C [340 ± 5°F] and capable of providing a pressure of 1380
± 70 kPa [200 ± 10 psi] on the test sample, see 6.1
4.2
Hole Punch
Hole
cutting tool, such as a hole punch or
die set capable of cutting a 25.4 ± 1.3 mm [1.0 ± 0.05 in] hole.
4.3
Materials
4.3.1
Release
material shall be Tedlar type (polyvinyl fluo-
ride, PVF), or equivalent, of 0.05 mm [0.002 in] thickness,
maximum, at least as large as the size of the caul plates.
4.3.2
Any
copper-clad laminate of thickness between 0.25
mm [0.010 in] and 0.38 mm [0.0151 in] shall be cut to
approximately 152 mm x 152 mm [6.0 in x 6.0 in].
4.3.3
Conformal
press pad material equivalent to 0.5 mm
[0.020 in] cotton linter paper, and cut to approximately 152
mm x 152 mm [6.0 in x 6.0 in].
4.4
Measuring Microscope
Bausch
and Lomb, model
SUB–73 stereozoom microscope with 31–16–08 micrometer
disc, Carl Zeiss Stage Micrometer, or equivalent.
4.5
Caul Plates
Caul
plates shall be 3.2 mm [0.125 in]
thick and 152 mm [6.0 in] square and made from type 304
steel, or equivalent.
4.6
Desiccator
Desiccation
chamber capable of maintain-
ing an atmosphere of less than 30% RH, at 23°C [73°F].
5.0
Procedure
5.1 Specimen Preparation
5.1.1
The
prepreg shall be cut to conform with the speci-
men size and configuration as per 3.1.
5.1.2
If
testing is to be performed more than 10 minutes
after the prepreg has been manufactured, specimens shall be
desiccated for 4 ± 1/4 hrs. prior to testing.
5.1.3
Cleaning of Copper Cladding
When
applicable for
referee purposes, clean the metallic cladding on the copper
clad laminate by wiping the copper cladding with isopropyl
alcohol. The copper clad laminate shall be immersed in suit-
able container containing 22-23° BAUME 20 percent by vol-
ume solution of hydrochloric acid, technical grade, maintained
at 21°C ± 5.6°C [170°F ± 10°F] for a period of 15 seconds.
After removal of the copper clad laminate from the hydrochlo-
ric acid, the copper cladding then shall be rinsed with a cold
water spray rinse for 5 seconds and blown dry with filtered, oil
free, compressed air.
5.2 Measurement
5.2.1
A
specimen shall be formed by stacking three plies of
prepreg with the grain of the reinforcement aligned in the
same direction. Only if necessary to prevent ply slippage, tack
the three plies together using a standard soldering iron within
one quarter inch from one or more corners so that the plies
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
IPC-TM-650
TEST
METHODS MANUAL
Number
2.3.17.2
Subject
Resin
Flow of ‘‘No Flow’’ Prepreg
Date
8/97
Revision
B
Originating Task Group
MIL-P-13949 Test Methods Task Group (7-11b)
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
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