IPC-TM-650 EN 2022 试验方法.pdf - 第339页

5.1.2 For preproduction qualification, test specimens are to be cleaned using cleaning methods as recommended by the solder resist manufacturer and standard production methods for comparison purposes prior to solder resi…

1 Scope This test method defines the procedure for deter-

mining the adhesion of solder resists (masks) used over melt-

ing metals, (such as solder plated and reflowed solder printed

boards both prior to and after soldering), nonmelting metals,

and printed board substrates.

2 Applicable Documents

J-STD-003

Solderability Test Methods for Printed Boards.

IPC-2221 Design Standard for Rigid Printed Boards.

3 Test Specimens The test specimen used shall be the

test coupon shown in Figure 1, which has the plated metal

surface that is applicable, and coated with solder resist.

4 Apparatus or Material

4.1 Tape

A roll of pressure sensitive self-adhesive film tape

1.3 cm [0.5 in] wide exhibiting an adhesive strength of at least

44 N/100 mm [40 oz-force/in] but no more than 66 N/100 mm

[60 oz-force/in] as tested per ASTM D3330, as amended. If

the tape has an advertised expiration date or shelf life it shall

not be used after the expiration date. If no such date exists,

the product may be used up to one year from date of pur-

chase. A noncomprehensive list of tapes meeting this require-

ment can be found at ‘‘Pull Test Tapes’’ under ‘‘Technical

Resources’’ at the IPC web site: www.ipc.org.

5 Procedure

5.1 Preparation

5.1.1

For qualification testing, test specimens are to be pre-

pared by processing 34.0 µm [1,339 µin], double clad epoxy

glass laminate through the standard plating process for the

metal coatings that are applicable. For production testing, the

coupons shall be representative of the board.

IPC-24281-1

Figure 1 Test Coupon G of IPC-2221, mm [in]

3000 Lakeside Drive, Suite 309S

Bannockburn, IL 60015-1249

IPC-TM-650

TEST METHODS MANUAL

Number

2.4.28.1

Subject

Solder Mask Adhesion - Tape Test Method

Date

3/07

Revision

Originating Task Group

Solder Mask Performance Task Group (5-33B)

Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.

Page1of2

ASSOCIATION CONNECTING

ELECTRONICS INDUSTRIES

5.1.2 For preproduction qualification, test specimens are to

be cleaned using cleaning methods as recommended by the

solder resist manufacturer and standard production methods

for comparison purposes prior to solder resist application.

5.1.3 Test specimens are to be coated and cured by the

standard production method.

5.1.4 Testing is to be conducted on specimens before and

after soldering in accordance with J-STD-003, Methods A, B,

C, or D with no accelerated aging.

5.2 Test

5.2.1

Press a strip of pressure sensitive tape, 50 mm

[1.97 in] minimum in length, firmly across the surface of the

test area removing all air entrapment. The time between appli-

cation and removal of tape shall be less than one minute.

Remove the tape by a rapid pull force applied approximately

perpendicular (right angle) to the test area. An unused strip of

tape must be used for each test.

5.3 Evaluation

5.3.1

Visually examine the tape and test area for evidence of

any portion of the material tested having been removed from

the specimen.

5.3.2 The report should note any evidence of material

removed by this test.

6 Notes

6.1

Figure 1 illustrates the coupon that is used for testing.

The black squares indicate metal. The white squares indicate

the base material. Solder mask is applied over the entire con-

ductor pattern.

6.2 If foreign material (oil, grease, etc.) is present on the test

surface the results may be affected.

6.3 Certification of 3M Brand 600 1/2 inch tape to CID-A-A-

113 is not required. The 3M Brand 600 1/2 inch tape is avail-

able through most office supply stores.

IPC-TM-650

Number

2.4.28.1

Subject

Solder Mask Adhesion - Tape Test Method

Date

03/07

Revision

Page2of2

1 Scope This test method is used to determine the adhe-

sion quality of solder masks used on flexible circuits.

2 Applicable Documents

IPC-A-42-G-KIT

Double-Sided Artwork

3 Test Specimen The IPC-A-42-G-KIT artwork package

provides the electronic Gerber information necessary for the

fabrication of the IPC B-42 test board. IPC-B-42 flexible test

patterns H1, H2, and/or H3, or production test samples with

solder mask coating. Each flexible section shall be separated

and tested independently.

4 Apparatus 3.18 ± 0.1 mm [0.125 ± 0.004 in] diameter

mandrel (metal rod).

5 Procedures

5.1 Test

5.1.1

Bend the test specimen around the mandrel so that

the ends of the test specimens are on the same side of the

mandrel and nominally parallel to each other. (The test speci-

men forms a ‘‘U’’ shape around the mandrel.) Each cycle

must be at the same point on the flexible circuit.

5.1.2 Flip the test specimen so that its opposite surface is

against the metal rod and repeat 5.1.1.

5.1.3 Repeat 5.1.1 and 5.1.2 nine times (ten cycles total) for

each of the test specimens.

5.2 Evaluation Visually examine the flexible circuit test pat-

tern with corrected 20/20 vision without magnification for sol-

der mask delamination or cracks.

1. www.ipc.org/onlinestore

3000 Lakeside Drive, Suite 309S

Bannockburn, IL 60015-1249

IPC-TM-650

TEST METHODS MANUAL

Number

2.4.29

Subject

Solder Mask - Adhesion to Flexible Circuits

Date

03/07

Revision

Originating Task Group

Solder Mask Performance Task Group (5-33b)

Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.

Page1of1

ASSOCIATION CONNECTING

ELECTRONICS INDUSTRIES