IPC-TM-650 EN 2022 试验方法.pdf - 第392页
1.0 Scope This test method defines the procedure for determining the Thermal Conductivity of polymer coatings on inorganic substrates, such as polyimide on a silicon wafer. 2.0 Applicable Documents ASTM D 2766 Standard T…
5.3.2
Using
a suitable solvent, remove the flux residues from
the three coupons sufficient to clearly see the solidified solder
pool and the remaining brass coupon surface.
5.3.3
Visually
examine the thickness of the solder pool edge
on the surface test coupons for any evidence of non-wetting
or de-wetting.
5.3.4 The
fluxed solder and/or the solder from which the flux
was extracted shall fail this solder pool test if there is any evi-
dence of non-wetting, de-wetting, or flux spattering or if the
solder pool does not feather out to a thin edge.
Note:
Irregularly
shaped solder pools do not necessarily
indicate de-wetting or non-wetting.
6.0
Safety
Observe
all appropriate safety precautions.
Consult MSDS sheets for safety precautions for chemicals
involved in this test method.
IPC-TM-650
Number
2.4.49
Subject
Solder
Pool Test
Date
1/95
Revision
P
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1.0
Scope
This
test method defines the procedure for
determining the Thermal Conductivity of polymer coatings on
inorganic substrates, such as polyimide on a silicon wafer.
2.0
Applicable Documents
ASTM D 2766
Standard
Test Method for Specific Heat of
Liquid and Solids
3.0
Test Specimen
See
Sample Preparation 5.1.
4.0
Apparatus
4.1
CO
2
Laser
capable of 5 Joules per pulse.
4.2
Mercury/Cadmium/Tellurium
(MCT) Infrared Detector or
equivalent.
5.0
Procedure
5.1 Sample Preparation
Samples
are prepared by form-
ing a structure on a silicon wafer consisting of 2 µm of sput-
tered carbon, 2 µm of sputtered Al metal, 25 µm of polymer
dielectric, and 2 µm of sputtered Al on wafer according to
manufacturer’s recommendations.
5.2
Test Procedure
Sample
is placed between the laser
and the detector according to Figure 1.
5.3
Test Analysis
Heat
rise is fit to the equation:
T = 1 −
4
π
Σ
α
n = 0
(−1)
n
2n+1
e
−{(2n+1)
2
π
2
Lt/4}
where
T is the normalized temperature rise and t is the time in
seconds and L is the fitting parameter. The thermal divusivity
k is given by:
k = (L)(l)
2
where
l is the sample thickness. The thermal condutivity, K, is
given by the equation:
K=kC
p
P
where
C
p
is
the heat capacity (as determined by ASTM D
2766) and p is the density.
2.4.50-01
Figure
1 Laser is flashed and the heat rise is measured
on the back Al by the detector
Sputtered Al
Sputtered Carbon
Polymer
Dielectri
c
Silicon
DetectorLaser
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
IPC-TM-650
TEST
METHODS MANUAL
Number
2.4.50
Subject
Thermal
Conductivity, Polymer Films
Date
7/95
Revision
Originating Task Group
Deposited Dielectric Task Group (C-13a)
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
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1.0
Purpose
To
determine dispersion of glass microbeads
in Self Shimming Thermally Conductive Adhesives, thus
ensuring the proper self-induced gap.
It is important for the beads to be well dispersed throughout
the batch, since this adhesive is designed for bonding of elec-
trical components to printed circuit boards where electrical
isolation, provided by a consistent gap, is required. The test-
ing is performed by measuring the gap induced by the adhe-
sive placed between two flat metal surfaces.
2.0
Applicable Documents
None
3.0
Test Specimen
Two
steel blocks; one with dimensions 1″x1″x
5
⁄
16
″,
the sec-
ond must be machined to equal the area of a TO-220 transis-
tor (.605″x.405″x0.060″) on the center top of the block
4.0
Apparatus and Reagents
4.1 Apparatus
4.1.1
Two
steel blocks; one with dimensions 1″x1″x
5
⁄
16
″,
the
second must be machined to equal the area of a TO-220
transistor (.605″x.405″x0.060″) on the center top of the block.
Both surfaces contacting the adhesive during the test must be
highly polished. (See Figure 1).
4.1.2
Micrometer,
accurate to the nearest 0.001″
4.1.3
Spatula
4.1.4
Clamp,
Hargrave #1
5.0
Test Procedure
5.1 Preparation
5.1.1
Accurately
measure to the nearest 0.001″ the thick-
ness of the two sandwiched steel blocks. Record.
5.1.2
Apply
sufficient adhesive to ensure coverage of the
T0-220 machines area.
5.1.3
Assemble
blocks without twisting.
5.2 Test
5.2.1
Clamp
blocks to induce vertical force.
5.2.2 Wipe
off excess adhesive, if any.
5.2.3 Remove
clamp.
5.2.4
Measure
thickness of the sandwiched blocks with the
adhesive in between. Record.
5.3
Evaluation
5.3.1
Gap
Induced = Thickness measured in 5.2.4 − thick-
ness measured in 5.1.1.
5.3.2
Report
the average of three determinations.
Note: A hargrave #1 clamp produces approximately 20 lbs of
clamping force.
IPC-2.4.51-001
Figure
1
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
IPC-TM-650
TEST
METHODS MANUAL
Number
2.4.51
Subject
Self
Shimming Thermally Conductive Adhesives
Date
1/95
Revision
Originating Task Group
SMT Mounting Adhesives Task Group (5-11c)
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
age1of1
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