IPC-TM-650 EN 2022 试验方法.pdf - 第148页

1 Scope This is an electrogravimetric method for determin- ing the purity of copper foil or plating. 2 Applicable Documents None 3 Test Specimens Each copper specimen must weigh approximately five grams and be raw copper…

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5.2.1.3
Immerse
the specimens in a 10% solution of oxalic
acid in water at 16°C to 32°C for 15 to 20 minutes. Provide
gentle circulation of the oxalic acid solution during this period.
Flush the specimens with running tap water at 16°C to 32°C.
Caution: Oxalic acid is toxic.
5.2.1.4
Scrub
the specimens with Grade FFF pumice to
remove resist, or wipe off the resist with a lint-free cloth moist-
ened with a suitable solvent (i.e., methylethyl ketone, trichlor-
ethylene, or toluol). In cleaning the specimens, care must be
exercised to avoid abrading the adhesive layer with the pum-
ice or attacking the adhesive or laminate with the solvent.
Specimens not involving the use of resist need not be
scrubbed.
5.2.1.5
Scrub
the specimens with a plastic-bristled brush
under running tap water at 16°C to 32°C and rinse for 30
minutes.
5.2.1.6
Rinse
the specimen in distilled water.
5.2.1.7
Dry
the specimens for one hour in an oven at 80°C
± 3°C. If specimens are for electrical tests, handle only with
rubber or polyethylene gloves.
5.2.2
Method B
5.2.2.1
Remove
foil from the specimen using a solution
containing 298g±10perliter of ammonium persulfate and
15.5 mL ± 1.0 per liter of sulfuric acid, specific gravity 1.836
(66°Be). The temperature shall be 43°C ± 3°C.
5.2.2.2
Rinse
the specimens thoroughly in running water
and dry with a clean air blast.
5.2.2.3
Dry
the specimens in an oven at 80°C ± 3°C for one
hour and allow the specimens to cool.
5.3
Petrolatum Evaluation
5.3.1
Drill
1.5 mm holes in the pads of the 3 mm lines with
good fabricating practice.
5.3.2
Remove
the developed KPR by rubbing the pattern
lightly with cold trichlorethylene liquid. Rinse in water. Scrub
the specimens with FFF pumice and water with a strong
bristle brush.
5.3.3
Plate
per MIL-P-13949. Deoxidize by dipping in 10%
hydrochloric acid for two minutes and wash in running water
for five minutes. Dry 30 minutes, minimum, at 105°C to
110°C.
5.3.4 Coat
the etched copper surface with white petrola-
tum. Specimens shall be immersed horizontally in solder
6.5mm below the surface for 20 ± 1 seconds at 260°C +5°C/-
0°C) measured 25 mm below the surface.
5.3.5
Remove
the petrolatum from the surface of the speci-
men with a two minute scrub in cold trichlorethylene, followed
by a one minute rinse in hot trichlorethylene.
5.3.6
Inspect
the surface for weave exposure, measling,
crazing, resin loss, delamination and blistering.
5.3.7
Test
four 0.8 mm lines on the specimen for peel
strength and report the average value for the four lines. This
test shall be performed in accordance with Method 2.4.8.
5.4
Report
5.4.1
The
results of the testing by this test method shall be
reported in a written report, which contains the following as a
minimum:
1. Certification that the test was performed in accordance
with this test method
2. Identification of specimens tested
3. Test results for each of the specimens tested, including the
results of the visual inspections and peel tests
IPC-TM-650
Number
2.3.14
Subject
Print,
Etch, and Plate Test
Date
4/73
Revision
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1
Scope
This
is an electrogravimetric method for determin-
ing the purity of copper foil or plating.
2
Applicable Documents
None
3
Test Specimens
Each
copper specimen must weigh
approximately five grams and be raw copper foil or plating
without treatment.
4
Apparatus or Material
4.1 Electrodes for Electrogravimetric Analysis
A
plati-
num gauze cathode. A platinum gauze rotating anode or a
spiral platinum wire anode.
4.2
Reagents
4.2.1
Acid
mixture for dissolving sample: Add 300 ml of
concentrated H
2
SO
4
slowly
with stirring to 750 ml of water.
Cool and add 210 ml of HNO
3
.
4.2.2
For
cleaning the sample use 5% H
2
SO
4
.
For cleaning
of the interior of the glassware use diluted HNO
3
(one
part
acid plus three parts distilled or deionized water by volume).
4.2.3
For
final rinsing use absolute methanol or equivalent.
4.2.4
Distilled
or deionized water.
4.3
Other apparatus
4.3.1
Fume
hood for removing fumes from dissolution.
4.3.2
Hot
plate for heating the test solution to 80-90 °C
[176-194 °F].
4.3.3
Analytical
balance capable of weighing copper sample
and platinum cathode to the nearest 0.1 mg.
4.3.4
Oven
for drying the specimen and cathode at approxi-
mately 110 °C [230 °F].
4.3.5
Current
source capable of supplying a current density
based on the cathode area of at least 0.6 A/dm
2
[6
ASF].
4.3.6
Tall-form
180 ml to 300 ml lipless beaker provided
with a close-fitting split cover.
5
Procedure
5.1 Test
5.1.1
Clean
the copper foil by dipping in 5% H
2
SO
4
at
room
temperature, wash thoroughly in tap water, then distilled
water, rinse in absolute methanol or equivalent, dry for a few
minutes in hot air oven at 110 °C [230 °F] and cool in a des-
iccator. Weigh the copper test specimen to the nearest
0.1 mg and transfer to a tall-form 180 ml to 300 ml lipless
beaker provided with a close-fitting cover. Place the beaker
into a fume hood.
5.1.2
Add
45 ml of H
2
SO
4
-HNO
3
mixture
and allow to stand
covered for a few minutes until reaction has nearly ceased.
5.1.3
Heat
at a temperature of 80-90 °C [176-194 °F] until
dissolution is complete and brown fumes have been expelled.
Never boil.
5.1.4
Cool
slightly and carefully wash down the cover and
insides of the beaker with distilled water and dilute the solu-
tion sufficiently to cover the cathode cylinder. The purpose of
the wash is to make sure that any of the ionized copper that
may be on the cover or inside surface of the beaker is in the
solution from which the copper is to be reduced by electro-
plating onto the platinum cathode.
5.1.5
Allow
solution to cool to ambient conditions.
5.1.6 Weigh
the cathode to the nearest 0.1 mg.
5.1.7
Insert
the electrodes in the solution, cover to prevent
splashing or evaporation, and electrolyze at a current density
of 0.6 A/dm
2
[6
ASF]. (When a current density of 0.6 A/dm
2
is
used,
the electrolysis takes about 16 hours and is conve-
niently carried on overnight.)
5.1.8
When
the solution becomes colorless, reduce the cur-
rent density to about 0.3 A/dm
2
[3
ASF] and wash down the
cover glasses, electrode stems and the inside of the beaker.
2215
Sanders Road
Northbrook, IL 60062-6135
IPC-TM-650
TEST
METHODS MANUAL
Number
2.3.15
Subject
Purity,
Copper Foil or Plating
Date
05/04
Revision
D
Originating Task Group
Rigid Printed Board Performance Task Group
(D-33a)
Material
in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.
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5.1.9
Continue
the electrolysis until the deposition of the
copper is complete, as indicated by failure to plate on a new
surface of the electrode stem when the level of the solution is
raised by adding distilled water. (Metal added to solution by
washing glass and cover will typically plate in approximately
one hour.)
5.1.10
Without
interrupting the current, remove the elec-
trodes from the solution.
5.1.11 Remove
the cathode. Wash with distilled water. Dip
in absolute methanol or equivalent and dry rapidly in a hot air
oven at 110 °C [230 °F] (approximately five minutes). Cool to
ambient in a desiccator and weigh to the nearest 0.1 mg.
5.1.12
Shut
off current supply to just set up.
5.2
Calculations
5.2.1
Calculate
the percentage of copper by weight by the
following method:
Weight of copper recovered C
R
=
A-B
where:
A = weight of cathode plus deposited copper in grams.
B = initial weight of the cathode in grams
Copper, by weight (%) = (C
R
/C
I
)
X 100
where:
C
R
=
weight of copper recovered in grams
C
I
=
initial weight of copper test sample in grams
6 Notes
6.1
Interferences
In
this method any silver present in the
test sample is deposited with the copper, and is reported as
copper.
IPC-TM-650
Number
2.3.15
Subject
Purity,
Copper Foil or Plating
Date
05/04
Revision
D
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