IPC-TM-650 EN 2022 试验方法.pdf - 第362页

1 Scope This method is used to determine the inner layer bond strength of either a metal conductor or an individual dielectric. 2 Applicable Documents None 3 Test Specimen Laminate dielectric with or without cop- per foi…

CHECKLIST

1. Is the specimen size 300 mm x 280 mm

[12 in x 11 in]?......................................................... ____

2. Is the warp direction properly identified? ................. ____

3. Were the four location points prepared by either

drilling or scribing?................................................... ____

4. Were the measured points located approximately

12 mm [0.5 in] from each edge of the fill direction

and approximately 25 mm [1.0 in] from each edge

of the warp direction?.............................................. ____

5. Were the measurements taken from the same

feature location, i.e., edge of the hole, center,

scribe mark, etc?..................................................... ____

6. Were specimens processed without mechanical

or chemical pre-cleaning?........................................ ____

7. Was cupric chloride etching with spray used to

remove the copper? ................................................ ____

8. Was the temperature of the etching less than

50°C? ...................................................................... ____

9. The specimens were not exposed to resist

stripping solution?.................................................... ____

10. Were specimens racked after removal from

etching cycle?.......................................................... ____

11. Is the oven used for baking capable of ± 2°C

control and has a recovery time of less than

15 minutes?............................................................. ____

12. Were specimens subjected to the bake cycle

within 4 hours after etching?.................................... ____

13. Were the specimens baked at 105°C ± 5°C for

4 hours and vertically racked? ................................. ____

14. Was the stabilization chamber capable of

maintaining 20% RH maximum at 21 ± 2°C? .......... ____

15. Was each specimen removed from stabilization

after 1 hour + 1/2 hour -0 hours and were all

measurements taken within 5 minutes?................... ____

16. Were samples stored in stabilization chamber

between after bake and after thermal stress

measurements if immediate processing not

feasible?................................................................... ____

17. Were specimens thermal stressed at 150°C

± 5°C for two hours and vertically racked?.............. ____

18. Was each specimen removed from stabilization

after 1 hour + 1/2 hour -0 hours and were all

measurements taken within 5 minutes?................... ____

Note:

When

using the above checklist, all answers should be

affirmative. The technician performing the test should sign the

report, record the date and times of all actions taken, and

report any deviations on the procedure.

able 1 Calculation Procedure

Subgroup

Size

Apparent Outlier

is Largest Value

If Apparent Outlier

is Smallest Value

= 3-7

D =

Largest Value −

2nd Largest Value

Largest

Value −

Smallest Value

D =

2nd Smallest Value −

Smallest Value

Largest

Value −

Smallest Value

n = 8-10

D =

Largest Value −

2nd Largest Value

Largest

Value −

2nd Smallest Value

D =

2nd Smallest Value −

Smallest Value

2nd

Largest Value −

Smallest Value

Table 2 Extreme Value Table

D (Conﬁdence Level 95%)

0.941

4 0.765

5 0.642

6 0.560

7 0.507

8 0.554

9 0.512

10 0.433

IPC-TM-650

Number

2.4.39

Subject

Dimensional

Stability, Glass Reinforced Thin Laminates

Date

2/86

Revision

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Scope

This

method is used to determine the inner layer

bond strength of either a metal conductor or an individual

dielectric.

Applicable Documents

None

Test Specimen

Laminate

dielectric with or without cop-

per foil, prepared in accordance with Figure 1.

Equipment/Apparatus

4.1

Unite-O-Matic

tensile tester Model #FM 10 or equivalent

4.2

Scalpel

Procedure

5.1 Preparation for Testing

During

layup of the test

specimen panel, place ‘‘TEDLAR’’ (or other suitable material)

release sheets that will disallow lamination at one end of each

specimen, providing a 13 mm x 25 mm non-bonded tab. The

tabs can then be used as gripping areas to perform bond

strength testing. One can then evaluate the laminate-to-

laminate bonds and the laminate-to-copper foil bond through-

out the finished panel thickness.

5.1.1

Place

an equal number of release sheets on the outer

surface of the layup, covering all surfaces, except where inter-

nal release sheets have been placed. This is essential to pro-

vide proper and uniform lamination pressure.

5.1.2

After

lamination and cure, cut the panel into 25 mm

strips, as shown in Figure 1, and remove internal release

sheets.

5.1.3

steps 5.1.1 and 5.1.2 are not used, it will be neces-

sary to chemically or thermally remove resins from the outer

25 mm, in order to provide a tab to initiate testing.

5.2

After

cutting the samples to the designated size and lift-

ing the 25 mm strip for testing, the layer to be tested shall be

fastened into the clamping device of the tensile tester, allow-

ing the wire connecting the clamp to the tensile tester to pull

the specimen vertically within ± 5° angle.

5.3

The

tester is then started. A force is applied in the verti-

cal direction at a rate of 51 mm per minute until delamination

(bond strength) is completed or the inner layer tears.

The minimum load is then recorded using the following for-

mula:

Bond strength of the conductor width =

25mm

sample

width

x total load

IPC-2-4-40-1

Figure

1 Laminate Dielectric

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.40

Subject

Inner

Layer Bond Strength of Multilayer Printed

Circuit Boards

Date

10/87

Revision

Originating Task Group

N/A

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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1.0

Scope

1.1

This

method covers determination of the coefficient of

linear thermal expansion of electrical insulating materials

use

of a thermomechanical analyzer.

1.2

This

method is applicable to materials that are solid over

the entire range of temperature used, and that retain sufficient

hardness and rigidity over the temperature range so that irre-

versible indentation of the specimen by the sensing probe

does not occur.

1.3

Transition

temperatures also may be obtained by this

method.

2.0

Applicable Documents

ASTM D-618

Conditioning

Plastics and Electrical Insulating

Materials for Testing

ASTM-D-696

Test

for Coefficient of Linear Thermal Expan-

sion of Plastics

3.0

Summary of Method

3.1

This

method used a thermomechanical analyzer with an

X-Y recorder to graph the change of dimension as a function

of temperature of a small specimen of a solid electrical insu-

lating material. Coefficients of linear thermal expansion can be

calculated from the graph. Other thermal observations may

also be made.

Note

1—

-Other

rapid thermal analysis methods are being

studied by ASTM Subcommittees D09.17 and D20.30.

4.0

Significance

4.1

Measurements

of coefficient of linear thermal expansion

are useful in evaluating the suitability of solid insulating mate-

rials for use in combination with other materials where

mechanical stresses may develop as a result of differences in

coefficients.

4.2

This

method may be compared with Method D-696, but

tests made with this method use much smaller specimens.

This eliminates the need for large liquid baths and greatly

reduces the time required to reach temperature equilibrium.

As a result, the time required for making a test is less than for

Method D-696, and the method can conveniently be used

over a wider temperature range than for Method D-696.

5.0

Apparatus

5.1

The

thermomechanical analyzer shall include:

5.1.1

specimen holder and probe, into which the speci-

men can be placed. Changes in height of the specimen are

sensed by movement of the probe. The shape and size of the

probe shall be such that for the material tested the load

applied to the specimen by the probe shall not cause inden-

tation of the specimen within the range of temperatures of

interest.

5.1.2

Means

for sensing movement of the probe resulting

from changes in height of the specimen and for translating

these movements into a signal suitable for input to the

recorder. The sensing element should be capable of produc-

ing a movement of the recorder pen of at least 1000 times the

change in height of the test specimen, with provisions for less

sensitive ranges when needed.

5.1.3

Means

for uniformly heating the specimen holder at a

predetermined rate over the range of temperatures of interest.

This will consist of a furnace and temperature controller with

provisions for precooking the furnace and specimen holder

when measurements at subambient temperatures are to be

made.

5.1.4 Means

for measuring temperature in immediate prox-

imity to the test specimen.

5.1.5

X-Y recorder for recording changes in specimen

height as a function of specimen temperature.

1. This method is under the jurisdiction of ASTM Committee D-9 on Electrical Insulating Materials and is the direct responsibility of Subcommittee D09.01 on Electri-

cal Insulating Varnishes, Powders, and Encapsulating Compounds.

2. Annual Book of ASTM Standards, Part 39.

3. Annual Book of ASTM Standards, Part 35.

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.41

Subject

Coefficient

of Linear Thermal Expansion of

Electrical Insulating Materials

Date

3/86

Revision

Originating

Task Group

N/A

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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