IPC-TM-650 EN 2022 试验方法.pdf - 第345页

T able 1 T est Report on Solder Paste Enter appropriate information in top portion of report and complete report by entering the test results or checkmarks in the appropriate spaces. Inspection Purpose: QPL I.D. Number: …

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1.0
Scope
This
test specifies a standard procedure for
determining the viscosity of solder paste in the range of
50,000 to 300,000 centipoise.
2.0
Applicable Documents
None
3.0
Test Specimen
Paste
to be tested shall stabilize at
25°C ± 1°C for a minimum of 24 hours prior to testing. The
paste volume shall be sufficient to fill a test container having a
minimum diameter of 5 cm and a minimum depth of 5 cm.
4.0
Equipment/Apparatus
Equipment
used shall be a
spindle type viscometer (Brookfield RVTD or equivalent) with a
helipath stand and pen recorder. A TC spindle shall be used
for tests. Spindle speed is 5 rpm. Other equipment may be
used provided the results can be empirically correlated as
mutually agreed upon with the following test. Additional shear
rates may be specified by the user or supplier provided one
data point is based as specified below.
5.0
Procedure
5.1 Preparation
5.1.1
Open
the supply container(s); remove any internal cov-
er(s); scrape off paste adhering to the lid(s), internal covers,
and the container walls; and add this material to the paste in
the supply container(s).
5.1.2
Using
a spatula, stir the paste gently for 1 to 2 minutes
to homogenize it; taking care to avoid the introduction of air.
5.1.3
If
necessary, gently transfer the paste to the test con-
tainer having the specified volume—without introducing air.
Note: If the supply container meets the volume and size
requirements, a separate test container is not needed.
5.1.4
The
test container shall be placed in a constant tem-
perature environment at 25°C ± 0.25°C.
5.1.5
After
reaching 25°C ± 0.25°C, the solder paste shall
be stirred and then tested within 20 minutes to minimize set-
tling of the metal powder; while remaining at 25°C.
5.2
Test
5.2.1
Set
the solder paste container below the spindle.
Record data as the spindle penetrates the solder paste.
5.3
Evaluation
The
viscosity is calculated from the value
recorded after the bar of the spindle comes in contact with the
surface of the paste. Record the data in Table 1 ‘‘Test Report
on Solder Paste.’’
6.0 Notes
6.1
Test Equipment Sources
The
equipment sources
described below represent those currently known to the
industry. Users of this test method are urged to submit addi-
tional source names as they become available, so that this list
can be kept as current as possible.
6.1.1
Spindle Type Viscometer Equipment
Brookfield
Engineering Laboratories, Inc.
240 Cushing Street
Stoughton, MA 02072
(617) 344-4310
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
IPC-TM-650
TEST
METHODS MANUAL
Number
2.4.34.1
Subject
Solder
Paste Viscosity—T-Bar Spindle Method
(Applicable at less than 300,000 Centipoise)
Date
1/95
Revision
Originating Task Group
Solder Paste Task Group (5-24b)
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
age1of2
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T
able 1 Test Report on Solder Paste
Enter appropriate information in top portion of report and complete report by entering the test results or checkmarks in the appropriate spaces.
Inspection Purpose: QPL I.D. Number:
__
Qualification Manufacturer’s Identification:
__ Quality Conformance A Manufacturer’s Batch Number:
__
Quality Conformance B Date of Manufacture:
__
Shelf-Life Extension Original Use-By Date:
__
Performance Revised Use-By Date:
Date
Inspection Completed:
Overall
Results: __ Pass __ Fail
Inspection Performed by:
W
itnessed by:
Inspections
User’s
Actual
Requirement Test Result P/F (*) Tested by & Date
Material
Visual
Metal Content
Viscosity
Solder Ball
Slump
Alloy
Flux
Powder Size
% In Top Screen
% In Next Screen
% In Bottom Screen
% In Receiver Bottom
Max. Powder Size
Powder Shape
Tack
Wetting
* P/F = PASS/FAIL; enter P if test results are within tolerance of actual requirement; otherwise, enter F
IPC-TM-650
Number
2.4.34.1
Subject
Solder
Paste Viscosity—T-Bar Spindle Method (Applicable at less
than 300,000 Centipoise)
Date
1/95
Revision
P
age2of2
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1.0
Scope
The
test specifies a standard procedure for
determining the viscosity of solder paste in the range of
300,000 to 1,600,000 centipoise.
2.0
Applicable Documents
None
3.0
Test Specimen
Paste
to be tested shall be stabilized
at 25°C ± 1°C for a minimum of 24 hours prior to testing. The
paste volume shall be sufficient to fill the viscometer recep-
tacle to about 60% of its depth.
4.0
Equipment/Apparatus
The
equipment used shall be a
spiral pump viscometer (Malcom, Brookfield Viscometer or
Rheometer with Spiral Adaptor accessory, or equivalent). Set
the instrument rotational speed for 10 rpm. Other equipment
may be used provided the results can be empirically corre-
lated as mutually agreed upon. Additional shear rates may be
specified by the user or supplier.
5.0
Procedure
5.1 Preparation
5.1.1
Open
the container(s), remove any internal cover,
scrape off paste adhering to the lids or internal cover(s) and
the container wall(s) and add this to the paste in the contain-
er(s).
5.1.2
Using
a spatula, stir the paste gently for 1 to 2 minutes
to homogenize it, taking care to avoid the introduction of air.
5.1.3
Transfer
sufficient paste to the viscometer receptacle
to fill this to about 60% of its depth. Place the receptacle in
the temperature controlled unit of the viscometer and allow it
to stabilize at 25 ± 0.25°C for 15 minutes minimum.
5.2
Test
5.2.1
Immerse
the instrument sensor into the sample in
accordance with the equipment manufacturer’s instructions.
The solder paste should not cover the pump outlet.
5.2.2
Turn
on chart recorder and set instrument to run at
one specific shear rate. Take reading when output has been
stable for at least 1 minute. If additional shear rates are to be
measured, adjust the speed vernier and repeat above.
5.2.3
Record
the viscosity measured at the single shear rate
value. By mutual agreement between user and supplier mul-
tiple shear rates must be used to develop the solder paste
shear sensitivity factor.
5.3
Evaluation
Enter
data in Table 1 ‘‘Test Report on
Solder Paste.’’
6.0
Notes
6.1 Test Equipment Sources
The
equipment sources
described below represent those currently known to the
industry. Users of this test method are urged to submit addi-
tional source names as they become available, so that this list
can be kept as current as possible.
6.1.1
Spiral Pump Viscometer Equipment
Brookfield
Engineering Laboratories, Inc.
240 Cushing Street
Stoughton, MA 02072
(617) 344-4310
Malcom Instruments Corp.
26226 Industrial Blvd.
Hayward, CA 94545
(510) 293-0580
(510) 293-0584 - fax
6.2
Shear
sensitivity factor is defined as the absolute value
of the slope of a graph of the log viscosity versus log rpm.
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
IPC-TM-650
TEST
METHODS MANUAL
Number
2.4.34.2
Subject
Solder
Paste Viscosity—Spiral Pump Method
(Applicable for 300,000 to 1,600,000 Centipoise)
Date
1/95
Revision
Originating Task Group
Solder Paste Task Group (5-24b)
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
age1of2
电子技术应用　　　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ