IPC-TM-650 EN 2022 试验方法.pdf - 第337页

1.0 Scope This method is designed to evaluate the resis- tance of solder mask or conformally coated surfaces to rub- bing abrasion. 2.0 Applicable Documents None 3.0 Test Specimen An IPC Multipurpose Test Board, Number I…

5.1.4

Process Sequence

For

a breakdown of time and

temperature requirements of this test, see Table 1.

5.1.5

Apply

tape to both the treated and non-treated sur-

faces of the board using a wooden roller and fixed uniform

pressure (approximately 4.5 kg.). Peel tape on Instron or other

peel tester at 900 angle and a 5 cm/min. peel rate. Report the

peel force as kg/cm on both treated and non-treated portions

board.

5.1.6 Use

two boards per test. Put tape on each side of the

board and obtain tape results for one tape strip per side per

board.

5.2

Evaluation

5.2.1

Report

the tape peel strength in kg/cm width.

5.2.2

Report

the locus of failure of peeled tape (see Note 1.).

Note 1: The requirement of specifying the locus of mode of

failure of the tape is very important and a critical aspect of the

test. In order to be consistent with descriptions of failure

modes, a common set of criteria is used, as defined in Table

2. Figure 3 shows, in schematic, the various failure modes one

could obtain during performing this test. The three layers, from

bottom to top, are (1) the epoxy/glass substrate, (2) the adhe-

sive component of the tape, and (3) the tape backing (see top

left drawing in Figure 3).

5.2.3 Report the average of the two tape peel strengths (in

kg/cm width) for the same side of both boards.

able 1 Process Sequence

emp (°C) Time (Min)

Conditioner

32 4

Rinse 16-27 2-3

Etch 66 6.5

Air Dry – 0.75

Triple Rinse 16-27 3-5

Neutralizer 52 2.5

Rinse 25 5

Air Dry 25 Overnight

Table 2 Modes of Failure Shown in Figure 3

Notation

Meaning of Failure Mode

A/-TB

Interfacial

failure, between adhesive

and tape backing

C Cohesive failure within tape adhesive

M Mixed failure mode, a combination of

the other types

B/A

Interfacial

failure, between the board

and the adhesive of the tape.

IPC-2-4-26-3

Figure

3 Modes of Failure

IPC-TM-650

Number

2.4.26

Subject

Tape

Test for Additive Printed Boards

Date

3/79

Revision

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1.0

Scope

This

method is designed to evaluate the resis-

tance of solder mask or conformally coated surfaces to rub-

bing abrasion.

2.0

Applicable Documents

None

3.0

Test Specimen

IPC Multipurpose Test Board,

Number IPC-B-25 or any preproduction or production board

10.8 cm x 10.8 cm [4

⁄

n.x4

⁄

in.]

in size and coated with

solder mask or conformal coating.

4.0

Apparatus

4.1

Taber

Abraser Model 5130

4.2

1000

gram load for each wheel

4.3

CS-10

Calibrase wheels

5.0

Procedure

5.1 Preparation

5.1.1

Drill

or punch hole in middle of specimen for mounting

specimen on Taber Abraser.

5.1.2

Mount

calibrase wheels and pressure load (1000

grams) on equipment.

5.1.3

Clean

calibrase wheels (CS-10) according to recom-

mended procedures in Taber Abraser Manual.

5.2

Test

Place

sample on abraser and test specimen to the

required number of cycles of abrasion.

5.3

Evaluation

Examine

the coated board for break-

through to the conductive pattern or base material.

6.0

Notes

Taber

Abraser Model 5130, available from Tele-

dyne Taber, 455 Bryant St., N. Tonawanda, NY 14120 or

Pacific Scientific, Gardner Neotech Division, 2431 Linden

Lane, Silver Springs, MD 20910 or equivalent.

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.27.1

Subject

Abrasion

(Taber Method) Solder Mask and

Conformal Coating

Date

1/95

Revision

Originating Task Group

Conformal Coating Task Group (5-33a)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

age1of1

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1 Scope This test method defines the procedure for deter-

mining the adhesion of solder resists (masks) used over melt-

ing metals, (such as solder plated and reflowed solder printed

boards both prior to and after soldering), nonmelting metals,

and printed board substrates.

2 Applicable Documents

J-STD-003

Solderability Test Methods for Printed Boards.

IPC-2221 Design Standard for Rigid Printed Boards.

3 Test Specimens The test specimen used shall be the

test coupon shown in Figure 1, which has the plated metal

surface that is applicable, and coated with solder resist.

4 Apparatus or Material

4.1 Tape

A roll of pressure sensitive self-adhesive film tape

1.3 cm [0.5 in] wide exhibiting an adhesive strength of at least

44 N/100 mm [40 oz-force/in] but no more than 66 N/100 mm

[60 oz-force/in] as tested per ASTM D3330, as amended. If

the tape has an advertised expiration date or shelf life it shall

not be used after the expiration date. If no such date exists,

the product may be used up to one year from date of pur-

chase. A noncomprehensive list of tapes meeting this require-

ment can be found at ‘‘Pull Test Tapes’’ under ‘‘Technical

Resources’’ at the IPC web site: www.ipc.org.

5 Procedure

5.1 Preparation

5.1.1

For qualification testing, test specimens are to be pre-

pared by processing 34.0 µm [1,339 µin], double clad epoxy

glass laminate through the standard plating process for the

metal coatings that are applicable. For production testing, the

coupons shall be representative of the board.

IPC-24281-1

Figure 1 Test Coupon G of IPC-2221, mm [in]

3000 Lakeside Drive, Suite 309S

Bannockburn, IL 60015-1249

IPC-TM-650

TEST METHODS MANUAL

Number

2.4.28.1

Subject

Solder Mask Adhesion - Tape Test Method

Date

3/07

Revision

Originating Task Group

Solder Mask Performance Task Group (5-33B)

Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.

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