IPC-TM-650 EN 2022 试验方法.pdf - 第124页

1.0 Scope This test method is designed for use in deter- mining the resistance of core (dielectric) materials used in printed wiring boards to methylene chloride at laboratory ambient temperature. 2.0 Applicable document…

100%1 / 824
pan.
If the balance door is closed immediately after sample
entry and exit, 50 ± 5% RH can be maintained.
Verification of conditions in the enclosure during a simulated
test can be made using a rapid response humidity probe;
however, this should be done with unconditioned specimens
since solvents will affect the response of many humidity
probes.
6.2.6
Temperature Considerations
The
effect of the sol-
vent temperature on results is severe. A variation of 5°C[9°F]
can result in an error as high as 50% relative to values deter-
mined at 23°C [73°F].
6.3
Consideration of Other Test Parameters
6.3.1 Using Same Solvent
Shorter
dwell times, e.g., 3
minutes, generally result in better discrimination between
material of varying chemical resistance. However, test variabil-
ity is generally increased. Shorter tests are excellent for side
by side comparisons of materials.
Longer tests, e.g., 30 minutes, often do not differentiate
adequately between materials, and while useful on homoge-
neous material, variability on material with surface coatings
may be excessive.
6.3.2
Other Solvent Blends
Other
solvents and various
methylene chloride based combinations have been commonly
used in the industry. However, results and precision of the test
may vary significantly and the added problem of variability in
solution make-up is introduced.
6.4
Supercession
This
test method supersedes 2.3.4.2,
dated 5/86, and 2.3.4.3, dated 5/86.
6.5
Desiccator Conditions
The
Test Methods Task Group
determined that a great majority of test laboratories are unable
to consistently hold the Relative Humidity in a desiccator to
less than 20%. Based on data from participating company lab
management, the lowest practically feasible RH for use with
the affected IPC Test Methods is 30% maximum.
IPC-TM-650
Number
2.3.4.2
Subject
Chemical
Resistance of Laminates, Prepreg, and Coated Foil
Products, by Solvent Exposure
Date
12/94
Revision
A
P
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1.0
Scope
This
test method is designed for use in deter-
mining the resistance of core (dielectric) materials used in
printed wiring boards to methylene chloride at laboratory
ambient temperature.
2.0
Applicable documents
IPC-TM-650
Method
2.3.6, Etching, Ammonium Persulfate
Method
IPC-TM-650
Method
2.3.7, Etching, Ferric Chloride Method
IPC-TM-650
Method
2.3.7,1, Etching, Cupric Chloride
Method
3.0
Test specimens
3.1 Dimensions
The
test specimens shall be 2.00 in. x
2.00 in. X thickness of material. Tolerance on the 2.00 in.
dimensions shall be ± .03 in.
3.2
Edge finish
The
edges of the specimens shall be
milled or sanded smooth with 400 grit sandpaper.
3.3
Number of specimens
Three
specimens shall be used
for this test.
3.4
Removal of metal cladding
The
metal cladding shall
be removed by etching per IPC-TM-2.3.6, 2.3.7, 2.3.7.1 or
other suitable method which does not affect the surface of the
pressed sample.
4.0
Apparatus
4.1 Oven
Circulating
air oven capable of maintaining a uni-
form temperature of 105° to 110°C (221° to 230°F).
4.2
Desiccator
4.3 Analytical balance
5.0 Procedure
5.1 Conditioning
The
specimens shall be conditioned by
drying in an oven for 1 hour at 105° to 110°C (221° to 230°F),
then cooled to room temperature in a desiccator.
5.2
Fill
a 3000 ml beaker with methylene chloride to a depth
of 3 in. and maintain at 23°±2°C in a well-ventilated fume
hood. Place a rack in the bottom of the beaker to hold the
samples upright and apart.
5.3
Exposure
Remove
each specimen from the desiccator
and immediately weigh to the nearest 0.1 milligram, recording
the initial weight as ‘‘A’’. Immerse each specimen in the meth-
ylene chloride for 30 ± 0.5 minutes. Remove from the beaker,
air dry for 10 minutes ± 30 seconds, weigh immediately and
record the final weight as ‘‘B.’’ Drying time includes weighing
time.
5.4
Evaluation
5.4.1 Calculation
Calculate
and record the percent
change in weight for each specimen to the nearest 0.01 per-
cent as follows:
Change in weight, percent =
|
B A
|
A
x
100
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road Northbrook, IL 60062-6135
IPC-TM-650
TEST
METHODS MANUAL
Number
2.3.4.3
Subject
Chemical
Resistance of Core Materials to
Methylene Chloride
Date
5/86
Revision
Originating Task Group
N/A
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
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1.0
Scope
To
determine the quality of the dielectric mate-
rial after etching with ammonium persulfate.
2.0
Applicable Document
None.
3.0
Test Specimen
Specimen
2 in. x 2 in. X thickness of
one ounce or two ounces copper clad.
4.0
Apparatus
4.1 Heated Electrical Equipment
for
etching the speci-
men.
4.2
Air Circulating Chamber
capable
of maintaining 80°C ±
3°C (176°F).
4.3
Equipment and Chemicals
needed
to perform this test
are as follows: Rubber or polyethylene gloves, lint-free cloth,
grade FFF pumice and plastic scrubbing brushes, distilled
water, 10% solution oxalic acid, ammonium persulfate solu-
tion, methylethyl ketone, toluol, and trichlorethylene.
5.0
Procedure
5.1 Preparation of Specimen
Remove
rough edges from
the specimen by sanding or other suitable means.
5.2
Etching
Etch
specimen with vigorous agitation for the
minimum time in 66° BAUME ammonium persulfate solution
monitored at 43°C ± 3° (109.4°F). After removal of the copper,
immediately wash the specimen with running tap water for 2
to 5 minutes and keep the specimen from drying until the
specimen is placed in the chamber. Immerse the specimens
in a 10% solution of oxalic acid in distilled water 25°C ± 8°
(77°F) for 15 to 20 minutes providing gentle circulation of the
oxalic acid solution during this period. Flush the specimen
with tap water for 2 to 5 minutes, then scrub the specimens
with pumice to remove resist. Wipe the resist off with a lint free
cloth moistened with a suitable solvent. Scrub the specimen
with a plastic bristled brush under running tap water for 2 to 5
minutes. Rinse the specimen again in distilled water.
5.3
Condition
Dry
the specimens for 1 hour in a chamber
maintained at 80°C (176°F). If specimens are for electrical
tests, handle only with rubber or polyethylene gloves.
5.4
Evaluation of Test
Examine
specimens for white
deposits or other surface contaminants, loss of surface resin,
softness, delaminations, blistering or measling. Clad speci-
mens also should be evaluated for blisters or delamination of
the copper foil.
6.0 Notes
6.1
If
the etching time exceeds 15 minutes for 1 ounce cop-
per or 30 minutes for 2 ounces copper, renew the etching
solution.
6.2
Oxalic
acid is very toxic and extreme care should be
exercised.
6.3
The
time to produce a clean pattern with a minimum of
undercutting is approximately 7 minutes for 1 ounce copper
and 15 minutes for 2 ounces copper, using fresh solution.
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road Northbrook, IL 60062-6135
IPC-TM-650
TEST
METHODS MANUAL
Number
2.3.6
Subject
Etching
Ammonium Persulfate Method
Date
7/75
Revision
A
Originating Task Group
N/A
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
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