IPC-TM-650 EN 2022 试验方法.pdf - 第354页

1 Scope This test method is used to simulate the proce- dures for plated-through hole (PTH) component removal and replacement, in order to determine the effects of rework on the quality and integrity of the PTH barrel an…

J-003061

Figure

2 Slump test stencil, IPC-A-20

▼

Spacing

▼

0.06 mm

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0.10 mm

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0.15 mm

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0.20 mm

▼

0.25 mm

▼

0.30 mm

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0.35 mm

▼

0.40 mm

▼

0.45 mm

▼

0.40 mm

▼

0.35 mm

▼

0.30 mm

▼

0.25 mm

▼

0.20 mm

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0.15 mm

▼

0.10 mm

▼

0.06 mm

Spacing

Vertical

Rows

▼

Pad Size:

0.33 x 2.03

—18 identical pads per row

—Same spacings each row

Spacing

Pad Size: 0.20 x 2.03

—16 identical pads per row

—Same spacings each row

▼

▼▼▼▼▼▼▼▼▼▼▼▼▼▼▼

0.075 mm

0.10 mm

0.125 mm

0.15 mm

0.175 mm

0.20 mm

0.25 mm

0.30 mm

0.25 mm

0.20 mm

0.175 mm

0.15 mm

0.125 mm

0.10 mm

0.075 mm

IPC-TM-650

Number

2.4.35

Subject

Solder

Paste—Slump Test

Date

1/95

Revision

age3of3

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Scope

This

test method is used to simulate the proce-

dures for plated-through hole (PTH) component removal and

replacement, in order to determine the effects of rework on

the quality and integrity of the PTH barrel and conductor foil

on bare rigid or flexible printed boards. The five steps are

designed to simulate initial soldering after a preconditioning

bake and two subsequent replacements.

Applicable Documents

IPC-TM-650

Test

Methods Manual

2.1.1 Microsectioning

2.1.1.2 Microsectioning - Semi or Automatic Technique

Microsection Equipment

J-STD-004

Requirements

for Soldering Fluxes

J-STD-006

Requirements

for Electronic Grade Solder Alloys

and Fluxed and Non-Fluxed Solid Solders for Electronic Sol-

dering Applications

Commercial

Item Description (CID) A-A-59551

Wire,

Elec-

trical, Copper (Uninsulated)

Test Specimen

3.1

The

standard test sample shall be as specified in the

governing specification or standard. In certain situations, it

may be necessary to perform this test on a production printed

board. In this case, a minimum of three PTHs shall be

selected. For military printed board(s), the selected holes shall

contain the maximum number of internal layer connections, so

that a complete quality evaluation can be made.

Note: This is a destructive test.

Equipment/Apparatus

4.1

soldering and/or desoldering iron with temperature

control accurate within ± 6 °C [11 °F] of the preselected idle

temperature of 260 °C [500 °F], 315 °C [599 °F], or 371 °C

[700 °F] (see 6.2).

4.2

Tin

coated solid copper wire, conforming to (CID) A-A-

59551.

4.3

Liquid

soldering flux conforming to J-STD-004, Flux

Designator ROL1.

4.4

Rosin

fluxed solder Sn60Pb40A or Sn63Pb37A with

Flux Designator ROL1 (Rosin, Flux activity Type L1) conform-

ing to J-STD-006.

4.5 Metallographic

laboratory facilities, conforming with IPC-

TM-650, Methods 2.1.1 or 2.1.1.2.

4.6

Metallograph

capable of up to 200X magnification.

4.7

Forced

air convection oven capable of maintaining

121 °C to 149 °C [250 °F to 300 °F].

4.8

Shear

type wire cutters.

4.9

System

for solder removal (desoldering braid or vacuum

assisted desoldering tool).

Procedure

5.1

Condition

specimens in a forced air convection oven at

121 °C to 149 °C [250 °F to 300 °F] for a minimum of six

hours to remove moisture. After conditioning, allow the speci-

mens to cool to room temperature.

5.2

aid in the addition or removal of solder, flux may be

applied to both sides of the test specimen.

5.3

The

hand soldering and desoldering operation of the

wire shall be performed as follows:

Step 1: Solder wire into PTH

Step 2: Remove (desolder) wire from PTH

Step 3: Resolder wire into PTH

Step 4: Remove (desolder) wire from PTH

Step 5: Resolder wire into PTH

During the desolder and solder steps, solder every other PTH

in the row and allow the specimen to cool to room tempera-

ture. Then solder the remaining PTHs.

5.4

During

the solder and desoldering steps, the soldering

and/or desoldering iron shall have a tip temperature as follows

(see 6.1):

Method A: 260 °C [500 °F] - Default method

Method B: 315 °C [599 °F]

Method C: 371 °C [700 °F]

2215

Sanders Road

Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.36

Subject

Rework

Simulation, Plated-Through Holes for

Leaded Components

Date

05/04

Revision

Originating Task Group

Rework Simulation Task Group, 7-11c

Material

in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.

age1of2

ASSOCIA

TION CONNECTING

ELECTRONICS INDUSTRIES

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Create

a solder bridge between the soldering iron tip, land

area, and wire, avoiding direct pressure on the land area. The

solder is to melt and form the connection within two to five

seconds. Permit the wire and specimen to cool to room tem-

perature.

If the solder connection cannot be formed within five seconds

using the specified method the test shall be repeated using

the subsequent method. This deviation shall be noted in the

test report.

5.5 Position

test wires in the PTHs and solder by hand. The

test wires that are to be hand soldered in the PTHs shall have

a diameter between 0.25 mm [0.00984 in] and 0.71 mm

[0.028 in] less than the diameter of the PTH.

5.6

During

the desoldering step, form a solder bridge and

remove the solder from the PTH within two to five seconds.

Allow the specimen to cool to room temperature. Resolder the

wire in the PTH using fresh solder.

5.5

Prepare

a microsection specimen for metallographic

evaluation per IPC-TM-650, Method 2.1.1 or 2.1.1.2. Evaluate

the microsection in accordance with the requested standard

or specification.

6 Notes

6.1

Those

who require the use this test method will need to

specify either Methods A, B, or C which affect the soldering

iron tip temperatures that are to be used when performing the

soldering and desoldering operations. If no method is speci-

fied then Method A (260 °C) [500 °F] is to be used.

6.2

Users

of direct power soldering irons with fixed tempera-

ture tip cartridges may substitute the appropriate series tip

cartridge for the specified temperatures in Methods A, B, and

C as follows:

260 °C [500 °F] ≈ 500 series cartridges

315 °C [599 °F] ≈ 600 series cartridges

371 °C [700 °F] ≈ 700 series cartridges

The type of soldering iron technology used (direct power or

stored heat) will affect the test results and therefore the

repeatability of this method. The type of soldering iron tech-

nology used shall be specified in the test report.

6.3

Users

of this method are cautioned to use good indus-

try assembly soldering techniques when performing the

operations specified herein. This includes, but is not limited to

the handling of the specimens, lead cutting, and soldering/

desoldering operations.

IPC-TM-650

Number

2.4.36

Subject

Rework

Simulation, Plated-Through Holes for Leaded

Components

Date

05/04

Revision

age2of2

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