IPC-TM-650 EN 2022 试验方法.pdf - 第376页

1.0 Scope This procedure establishes the performance and test guidelines for the break-off torque of adhesives used by placement equipment to attach surface mounted devices to printed wiring boards. 2.0 Applicable Docume…

1.0

Scope

This

test method defines the procedure for

determining the Volumetric Thermal Expansion of polymer

coatings on inorganic substrates, such as polyimide on a sili-

con wafer. The expansion is measured using an apparatus

designed for the determination of the Pressure/Volume/

Temperature behavior of solid samples.

2.0

Applicable Documents

None

3.0

Test Specimens

See

Sample Preparation 5.1.

4.0

Apparatus or Material

GNOMIX

PVT or equivalent

capable of providing PVT data over its pressure range 0-200

MPa (2000 bar or 29,000 psi), and from ambient tempera-

tures to 400°C.

5.0

Procedure

5.1 Sample Preparation

Samples

are prepared by form-

ing a 25 mm thick film on a wafer and lifting the specimen free

according to manufacturer’s recommendations. Sample is cut

and folded to fit in the sample chamber of the PVT apparatus.

5.2

Test Procedure

The

film sample (1 to 2 grams mass)

is placed in a rigid stainless steel cell. The cell is surrounded

by a ‘‘sample cup’’ which guarantees a hydrostatic state of

stress in the sample at all times. Follow the testing protocol

according to the PVT Operations Manual for the measurement

of the volumetric expansion.

5.3

Test Analysis

Report

the volumetric expansion of the

material from room temperature to 300°C and the tempera-

ture of any observed transitions.

6.0 Notes

6.1

Pressure/Volume/Temperature

(PVT) Apparatus: One

source is Gnomix, 3809 Birchwood Drive in Boulder, CO (303)

444-3395.

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.41.4

Subject

Volumetric

Thermal Expansion Polymer Coatings on

Inorganic Substrates

Date

7/95

Revision

Originating Task Group

Deposited Dielectric Task Group (C-13a)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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1.0

Scope

This

procedure establishes the performance

and test guidelines for the break-off torque of adhesives used

by placement equipment to attach surface mounted devices

to printed wiring boards.

2.0

Applicable Documents

None

3.0

Test Specimen

•

Apply a 1.25 mm [0.05 in] diameter circle of adhesive 0.1

mm [0.004 in] thick to a FR-4 substrate.

• Place a type 1206 resistor firmly onto the circle of adhesive.

• Cure adhesive according to manufacturers directions.

4.0

Equipment

4.1 Torque Tester

Waters Manufacturing torque watch

(or equivalent) witha0to140or0to280Nmmscale is to be

used. The torque gauge must have a separate indicator

needle to register maximum torque.

4.1.1

Torque Fixture

Use

torque fixture modified per

sample being tested.

5.0

Procedure

5.1 Sample Placement

Place

the samples board in the

test fixture.

5.1.1

Zeroing the Gauge

Rotate

the face knob of the

tester per until the maximum torque indicator needle is

zeroed.

5.1.2

Testing Sample

Using

the thumb and forefinger, and

middle finger of the right hand slowly rotate the torque gauge

in a clockwise direction until the component breaks off.

5.1.3

Torquing Techniques

Components

to be torqued

should be centered inside the probe. The component should

not protrude from the probe when testing is begun.

5.1.4

Taking Reading

After

the component has been

torqued off, a reading of break-off torque shall be taken from

the face of the torque tester. This reading is shown by the

maximum torque indicator needle.

5.1.5

Completion of Torquing

Repeat

until 5 components

of the same type have been torqued off.

6.0 Notes

not raise or lower the gauge while turning. If

the gauge is lowered the increased friction against the board

will yield inaccurate readings. If the gauge is lifted it will lose

contact with the component and yield an inaccurate reading

as well.

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.42

Subject

Torsional

Strength of Chip Adhesives

Date

2/88

Revision

Originating Task Group

N/A

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

age1of1

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1.0

Scope

The

object of this test is to determine the com-

ponent hold-down capability of the adhesive material at wave

soldering temperatures due to material softening or degrada-

tion. Test coupons are assembled using the adhesive material

and 1206 size chip resistors. The test coupons are preheated

then floated on a solder pot, after which the loss of any com-

ponents is noted.

2.0

Applicable Documents

MIL-F-14256

Flux,

Soldering, Liquid (Rosin based)

QQ-S-571

Solder,

Tin Alloy, Tin-lead Alloy, and Lead Alloy

3.0

Test Specimens

Bare FR-4 Test Coupon-approximately 50.8 mm [2.0 in ]

square

2. 1206 sized surface mount chip resistors

4.0

Apparatus

Solder

pot Sn 60 Sn 62 Sn 63 per QQ-S-

571—temperature controlled to provide 260 ± 5°C.

5.0

Procedures

5.1 Test Coupon Fabrication

single test coupon is

made by applying 20 adhesive dots or rectangles on to a bare

FR-4 coupon. The thermal cure adhesive dots shall be sten-

ciled providing a dot 0.1 mm [0.004 in] thick and 1.27 mm

[0.050 in] in diameter. The ultraviolet cured adhesive deposits

shall be stenciled into a 2.0 x 0.76 mm [0.080 x 0.030 in]

rectangular slit of 0.1 mm [0.004 in] thickness.

The chip resistors are first centered over then securely

pressed into the adhesive deposits. The resistors are aligned

over the UV adhesive rectangles such that equal adhesive

volumes are observed at both component sides.

The assembly is then cured per manufacturers recommended

conditions.

5.2

Solder Float

The

test coupon is fluxed with a type R

per MIL-F-l4256 flux and excess drained off. The coupon is

then held approximately 12.7 mm [0.5 in] above the dross-free

solder pot surface for 60 ±5 seconds with the component side

facing the solder surface. The coupon is then brought into

contact with the clean solder surface and allowed to float for

10 + 1-0 seconds while being lightly but continuously agi-

tated.

After cooling, the remaining flux residue is cleaned from the

surface and the coupon examined for severely displaced

components. A component is severely displaced if:

1. No longer on the test coupon.

2. It is rotated more than 30 degrees from its original posi-

tion.

3. It is lifted or tilted away from the board’s surface leaving

a gap between either component termination and the

board of more than 1 mm [0.040 in]. A suitable thickness

shim may be used in this determination.

5.3

Evacuation

Any

evidence of severely displaced com-

ponents on the processed test coupons shall be noted.

6.0 Notes

None

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.42.1

Subject

High

Temperature Mechanical Strength Retention

of Adhesives

Date

3/88

Revision

Originating Task Group

N/A

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

age1of1

电子技术应用　　　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ