IPC-TM-650 EN 2022 试验方法.pdf - 第393页

1.0 Purpose To determine dispersion of glass microbeads in Self Shimming Thermally Conductive Adhesives, thus ensuring the proper self-induced gap. It is important for the beads to be well dispersed throughout the batch,…

1.0

Scope

This

test method defines the procedure for

determining the Thermal Conductivity of polymer coatings on

inorganic substrates, such as polyimide on a silicon wafer.

2.0

Applicable Documents

ASTM D 2766

Standard

Test Method for Specific Heat of

Liquid and Solids

3.0

Test Specimen

See

Sample Preparation 5.1.

4.0

Apparatus

4.1

Laser

capable of 5 Joules per pulse.

4.2

Mercury/Cadmium/Tellurium

(MCT) Infrared Detector or

equivalent.

5.0

Procedure

5.1 Sample Preparation

Samples

are prepared by form-

ing a structure on a silicon wafer consisting of 2 µm of sput-

tered carbon, 2 µm of sputtered Al metal, 25 µm of polymer

dielectric, and 2 µm of sputtered Al on wafer according to

manufacturer’s recommendations.

5.2

Test Procedure

Sample

is placed between the laser

and the detector according to Figure 1.

5.3

Test Analysis

Heat

rise is fit to the equation:

T = 1 −

n = 0

(−1)

2n+1

−{(2n+1)

Lt/4}

where

T is the normalized temperature rise and t is the time in

seconds and L is the fitting parameter. The thermal divusivity

k is given by:

k = (L)(l)

where

l is the sample thickness. The thermal condutivity, K, is

given by the equation:

K=kC

where

the heat capacity (as determined by ASTM D

2766) and p is the density.

2.4.50-01

Figure

1 Laser is ﬂashed and the heat rise is measured

on the back Al by the detector

Sputtered Al

Sputtered Carbon

Polymer

Dielectri

Silicon

DetectorLaser

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.50

Subject

Thermal

Conductivity, Polymer Films

Date

7/95

Revision

Originating Task Group

Deposited Dielectric Task Group (C-13a)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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1.0

Purpose

determine dispersion of glass microbeads

in Self Shimming Thermally Conductive Adhesives, thus

ensuring the proper self-induced gap.

It is important for the beads to be well dispersed throughout

the batch, since this adhesive is designed for bonding of elec-

trical components to printed circuit boards where electrical

isolation, provided by a consistent gap, is required. The test-

ing is performed by measuring the gap induced by the adhe-

sive placed between two flat metal surfaces.

2.0

Applicable Documents

None

3.0

Test Specimen

Two

steel blocks; one with dimensions 1″x1″x

⁄

″,

the sec-

ond must be machined to equal the area of a TO-220 transis-

tor (.605″x.405″x0.060″) on the center top of the block

4.0

Apparatus and Reagents

4.1 Apparatus

4.1.1

Two

steel blocks; one with dimensions 1″x1″x

⁄

″,

the

second must be machined to equal the area of a TO-220

transistor (.605″x.405″x0.060″) on the center top of the block.

Both surfaces contacting the adhesive during the test must be

highly polished. (See Figure 1).

4.1.2

Micrometer,

accurate to the nearest 0.001″

4.1.3

Spatula

4.1.4

Clamp,

Hargrave #1

5.0

Test Procedure

5.1 Preparation

5.1.1

Accurately

measure to the nearest 0.001″ the thick-

ness of the two sandwiched steel blocks. Record.

5.1.2

Apply

sufficient adhesive to ensure coverage of the

T0-220 machines area.

5.1.3

Assemble

blocks without twisting.

5.2 Test

5.2.1

Clamp

blocks to induce vertical force.

5.2.2 Wipe

off excess adhesive, if any.

5.2.3 Remove

clamp.

5.2.4

Measure

thickness of the sandwiched blocks with the

adhesive in between. Record.

5.3

Evaluation

5.3.1

Gap

Induced = Thickness measured in 5.2.4 − thick-

ness measured in 5.1.1.

5.3.2

Report

the average of three determinations.

Note: A hargrave #1 clamp produces approximately 20 lbs of

clamping force.

IPC-2.4.51-001

Figure

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.51

Subject

Self

Shimming Thermally Conductive Adhesives

Date

1/95

Revision

Originating Task Group

SMT Mounting Adhesives Task Group (5-11c)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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1 Scope This test method establishes a procedure for

characterizing the toughness of the resin system materials

used in making laminates for the fabrication of printed wiring

boards. The single-edge-notch bending (SENB) geometry is

used to determine the critical-stress-intensity factor, K

, and

the energy per unit area of crack surface or critical strain

energy release rate, G

, at fracture initiation. This method

assumes linear elastic behavior of the cracked specimen, so

there are corresponding restrictions on the linearity of the

load-displacement diagram. Use of this test method for

printed wiring board laminate materials or other composites

may not yield comparative results.

2 Applicable Documents

2.1 ASTM Standards

D638

Test Method for Tensile Properties of Plastics

D4000 Classification Systems for Specifying Plastic Materials

D5045 Standard Test Methods for Plane-Strain Fracture

Toughness and Strain Energy Release Rate of Plastic

Materials

E399 Test Method for Linear-Elastic Plane-Strain Fracture

Toughness K

of Metallic Materials

E691 Practice for Conducting an Inter-Laboratory Study to

Determine the Precision of a Test Method

3 Terminology

3.1 Terms and Definitions (reference ASTM E399)

3.1.1 Compact Tension

Specimen geometry consisting of

single-edge notched plate loaded in tension.

3.1.2 Critical Strain Energy Release Rate (G

) Tough-

ness parameter based on energy required to fracture.

3.1.3 Plane-Strain Fracture Toughness (K

) Toughness

parameter indicative of material fracture resistance.

3.1.4 Single-Edge Notched Bend Specimen geometry

consisting of center-notched beam.

3.1.5 Yield Stress The stress at fracture (slope of stress-

strain curve is not required to be zero).

4 Test Samples

4.1 Sample Construction

The preferred finished sample is

a block of pure resin, free of contaminants and fully cured (not

partially cured, not over-cured). Note: DSC may be used to

evaluate a received sample’s degree of cure. TGA may be

used to check for the presence of residual solvents or other

contaminants.

A heated hydraulic press may be required to prepare the

sample. Attachment A is a method for making compression

molded thermoset neat resin castings. Size and occurrence of

voids within the sample should be kept to an absolute

minimum (maximum void dimension 25 µm [0.001 in]; maxi-

mum 5 voids/cc). Specimen block may be ground down to

the desired dimensions, and a mold shall not be used.

Default specimen dimensions should be 3.50 mm ± 0.05 mm

thick, 12.7 mm wide (in general, the nominal width can be

between 2X to 4X the thickness, but should be consistent)

and 55.88 mm long (length should be 4.4 times the width).

However the absolute minimum thickness is 2.5 times the

square of the conditional or trial K

) divided by the yield

stress (σ

) of the material for the temperature and loading rate

of the test.

The above should ensure that the sample is wide enough to

ensure plane strain and sufficiently thick to avoid excessive

plasticity in the ligament. If non-linearity in loading still occurs,

the width can be increased up to 4 times the thickness of the

specimen. Polishing the sample (minimum 600 grit) is recom-

mended to promote yielding in the tensile test, rather than

brittle fracture. Each of the thickness and width dimensions of

the specimen should be measured in at least 3 locations to an

accuracy of 0.1% and both dimensions shall be accurate to

within 1% of nominal. The average of these measurements will

be used in the calculations. At least 10 samples of each mate-

rial are recommended for testing, allowing up to 5 samples for

developing sufficient skill in initiating consistent cracks and

subsequently at least 5 samples meeting Section 4.2 criteria

for acceptable fracture toughness measurements.

3000 Lakeside Drive, Suite 309S

Bannockburn, IL 60015-1249

IPC-TM-650

TEST METHODS MANUAL

Number

2.4.52

Subject

Fracture Toughness of Resin Systems for Base

Materials

Date

07/13

Revision

Originating Task Group

IPC 3-11

Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.

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