IPC-TM-650 EN 2022 试验方法.pdf - 第699页
5.7.1 After cleaning, microsection the specimen as defined in IPC-TM-650, Method 2.1.1 or Method 2.1.1.2. 5.7.2 Examine the microsection for compliance of the plated-through holes to the applicable performance specifica-…
1
Scope
This
test is performed for the purpose of determin-
ing whether plated-through holes can withstand the thermo-
dynamic effects of the extreme heat to which they may be
exposed during the assembly, rework, or repair process.
2
Applicable Documents
J-STD-001
Requirements
for Soldered Electrical and Elec-
tronic Assemblies
J-STD-004
Requirements
for Soldering Fluxes
IPC-2221
Generic
standard on Printed Board Design
IPC-TM-650
Test Methods Manual
2.1.1
Microsectioning
2.1.1.2 Microsectioning – Semi or Automatic Technique
Microsection Equipment (Alternate)
3
Test Specimen
3.1
The
test specimen shall be a printed board, a portion of
a printed board or a test coupon as described in IPC-2221,
which allows for microsection evaluation of both the largest
component holes and the smallest holes on the board.
3.2
The
test specimen shall be removed from a printed
board or test coupon as specified in IPC-TM-650, Method
2.1.1 or Method 2.1.1.2, prior to precondition bake.
4
Apparatus or Material
4.1
Drying
oven capable of maintaining a uniform tempera-
ture between 121C to 149 °C [250 °F to 300 °F].
4.2
Solder
pot, electrically heated, thermostatically con-
trolled, of sufficient size, containing at least 0.9 kg of
Sn60Pb40 or Sn63Pb37 solder conforming to the contami-
nant level specified in J-STD-001.
4.3
Thermocouple
indicator or other devices to measure the
solder temperature 19 mm ± 6.4 mm [0.748 in ± 0.252 in]
below the surface.
4.4
Desiccator
with suitable desiccant.
4.5 Microscope
(100X to 200X magnification).
4.6
Stop
Watch or Timer.
4.7
Rosin
Flux, type ROL1 per J-STD-004, or flux agreed
upon between customer and vender.
4.8
Tongs.
4.9
Suitable
solvent for flux removal following the thermal
stress such as isopropyl alcohol.
5
Procedure
5.1
The
test specimen shall be conditioned by drying in an
oven for an appropriate period at 121 °C to 149 °C [250 °F to
300 °F] to remove the moisture in the specimen. For referee
purposes, a dry for a minimum of six hours at 121 °C to
149 °C [250 °F to 300 °F] shall be used. Thicker or more com-
plex specimens may require longer baking times.
5.2
Place
the test specimen in a desiccator on a ceramic
plate to cool to room temperature.
5.3
Remove
the test specimen from the desiccator using
tongs. Flux coat the surface and plated-through holes to
insure solder filling.
5.4
Verify
that the temperature of the solder (at a probe
depth of 19 mm ± 6.4 mm [0.748 in ± 0.252 in] from the sur-
face of the solder) is maintained at one of the following speci-
fied test conditions (see 6.1):
(a)
Test Condition A (default)
288
°C ± 5 °C [550 °F ± 9 °F]
(b)
Test Condition B
260
°C ± 5 °C [500 ° ± 9 °F]
(c)
Test Condition C
232
°C ± 5 °C [450 °F ± 9 °F]
5.5
Remove
the dross from the solder pot surface and lay
the test specimen on the solder for 10 seconds +1, -0 sec-
onds (see 6.2).
5.6 Using
tongs, carefully remove the test specimen from
the solder and place it on a piece of insulator to cool to room
temperature (see 6.3).
5.7
Evaluation
2215
Sanders Road
Northbrook, IL 60062-6135
IPC-TM-650
TEST
METHODS MANUAL
Number
2.6.8
Subject
Thermal
Stress, Plated-Through Holes
Date
05/04
Revision
E
Originating Task Group
Rigid Printed Board Performance Task Group
(D-33a)
Material
in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.
P
age1of2
ASSOCIA
TION CONNECTING
ELECTRONICS INDUSTRIES
®
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
5.7.1
After
cleaning, microsection the specimen as defined
in IPC-TM-650, Method 2.1.1 or Method 2.1.1.2.
5.7.2
Examine the microsection for compliance of the
plated-through holes to the applicable performance specifica-
tion requirements. Any nonconformities shall be noted.
6. Notes
6.1
Performance
specifications should specify the test con-
dition and any deviations to this test method. If no test condi-
tion is specified, use Test Condition A.
6.2
The
test specimen is not to be held against the surface
of the molten solder.
6.3
Do
not physically shock specimen while the solder in the
plated-through holes is still liquid.
IPC-TM-650
Number
2.6.8
Subject
Thermal
Stress, Plated-Through Holes
Date
05/04
Revision
E
P
age2of2
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
1.0
Scope
To
determine the resistance of the laminate to
thermal stress in both the etched and unetched state.
2.0
Applicable Documents
IPC-TM-650
Methods
2.3.6, 2.3.7, 2.3.7.1
3.0
Apparatus
3.1
Solder
pot capable of maintaining the temperature on
the applicable specification sheet for the material ± 2°F and
acceptinga2x2inch test specimen or equivalent.
3.2
Dow
Corning Fluid #704 or equivalent.
4.0
Test Specimens
4.1
One
(1) test specimen2x2inch will be cut from each
sample sheet for the unetched specimen.
4.2
One
(1) test specimen2x2inch from each sample
sheet for the etched specimen.
4.3
The
edges of the2x2inch specimen shall be sanded.
5.0 Procedure
5.1
Etch
specimen required for thermal stress etched
according to IPC-TM-650, Methods 2.3.6, 2.3.7, or 2.3.7.1.
5.2
Apply
silicon fluid to side of specimen that will be in
contact with solder.
5.3
Float
the specimen on the solder for the time and at the
temperature specified on the applicable specification sheet for
the material.
5.4
The
clad or unclad surface should show no evidence of
charring, loss of surface resin, softening delamination, blister-
ing, or weave exposure.
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
IPC-TM-650
TEST
METHODS MANUAL
Number
2.6.8.1
Subject
Thermal
Stress, Laminate
Date
9/91
Revision
—
Originating Task Group
N/A
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
age1of1
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ