IPC-TM-650 EN 2022 试验方法.pdf - 第267页

1 Scope The purpose of this test is to characterize peel adhesion at ambient conditions. 2 Applicable Documents IPC-3408 General Requirements for Anisotropically Con- ductive Adhesive Films. 3 Test Specimens 3.1 1 mm pit…

IPC-249-5

Figure 5 Failure Modes with Adhesiveless

Metal Foil

Polyimide Film

Start

Metal = Polyimide Failure to Metal Foil

PS = Polyimide Shatter

Force

(Chart Record)

Metal

IPC-TM-650

Number

2.4.9

Subject

Peel Strength, Flexible Dielectric Materials

Date

04/14

Revision

Page6of6

Scope

The

purpose of this test is to characterize peel

adhesion at ambient conditions.

Applicable Documents

IPC-3408

General

Requirements for Anisotropically Con-

ductive Adhesive Films.

Test Specimens

3.1

mm pitch (center-to-center) flex test circuits and 1 mm

pitch (center-to-center) test boards

Apparatus

4.1

Soda-lime

glass test slides or printed circuit boards

4.2

All

other test materials listed in IPC-3408

4.3

‘Instron-1122’

tensile tester or equivalent, equipped with

air-powered jaws and 50 kg load cell, adjustable to 10 kg full

scale

4.4

Test

fixture, mountable on lower stage of tensile tester

Procedure

5.1 Sample Preparation

5.1.1

Cut

flex test circuits to the appropriate length (see Fig-

ure 1).

5.1.2

Use

of new PCBs is recommended. If new boards are

being used there should be no need for any special cleaning

procedure. If used boards are to be used, they should be

inspected to ensure that:

a) Protective metalization (Au or Pb-Sn) is intact,

b) FR-4 isn’t significantly discolored from prior high tempera-

ture exposure,

c) The board is free of any residue from previous tests.

5.1.3

Refer

to IPC-3408 for proper bonding procedure.

5.2

Procedure

5.2.1

Prepare at least three, and preferably five, samples for

each test point to be measured.

5.2.2

Confirm

proper calibration of the tensile tester, and

ensure proper full-scale setting.

5.2.3 Mount

sample in test fixture. Secure the flex circuit tail

into the air-powered jaws on the cross-head stage, being

careful to place the jaws as close to and as square to the

bond-line as possible.

5.2.4

Peel

the sample at a rate of 2.5 mm/min., and record

the peak adhesion value.

5.2.5

Repeat

steps 3 and 4 for all additional samples. Com-

pute the average adhesion value and record.

IPC-3408-fig1

Figure

1 Sample Pattern

1 mm Pitch Flex, 17 traces

20 mm x 20 mm

ACF, 0.050 mm, 3.2 mm x 20 mm

a) Flex-Board

b) Flex-Glass

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.9.1

Subject

Peel

Strength of Flexible Circuits

Date

11/98

Revision

Originating Task Group

SMT Mounting Adhesives Task Group (5-24d)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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Scope

order to assess the actual performance of any

given lot of material, it is necessary to apply and thermally

bond the material between the substrates of interest. This

method describes the recommended procedure for both pre-

tacking and bonding anisotropically conductive films (ACF).

This method describes a fully manual procedure.

Applicable Documents

3 Test Specimens

3.1

Appropriate

flex circuit and test substrate(s)

Apparatus

4.1

‘‘Hot-Bar’’

type soldering station: Unitek PM-4 or

equivalent

4.2

Thermode:

1.5 mm width minimum; sufficient length to

span bond-line

4.3

Hot-Plate:

Pace, Inc., ’Hot Spot’ or equivalent (optional

if hot bar bonder is used for tacking or if adhesive can be

tacked without applied heat)

4.4

Razor

blade

4.5

Cotton

swab (optional; see 4.3)

4.6

One

roll or sheet of conductive adhesive

4.7

Appropriate

compliant material (as required)

Procedure

5.1 Sample Preparation

5.1.1

Allow

the roll of adhesive to equilibrate at room tem-

perature before handling.

5.1.2

Cut

the flex circuit sample to the appropriate length

and width for the given performance test.

5.1.3 Cut

an adhesive sample to match the width and

length of the bond area.

5.2

Procedure

5.2.1

Position

the adhesive over the pads on the flex circuit,

liner-side up.

5.2.2

the adhesive requires heat to tack it, tack the adhe-

sive in place on the flex circuit using the hot plate and cotton

swab (alternatively, the adhesive can be tacked using an

appropriately low setting of the hot bar equipment). The adhe-

sive should be easily tackable with a three to five second

exposure at 100°C. A cotton swab should be used to apply

mild pressure in order to facilitate wetting. Allow the flex circuit

to cool before handling further.

5.2.3

Peel

the release liner away from the flex circuit in order

to expose the adhesive. The adhesive may need pre-cutting

(using a razor blade) to separate it from the liner along the

starting edge.

5.2.4

Align

the flex circuit to the test substrate. In instances

requiring extreme accuracy of alignment, it is helpful to affix

the flex circuit relative to the substrate to prevent misregistra-

tion prior to and during bonding. This can be accomplished

with custom fixturing. Alternatively, a soldering iron can be

brushed lightly along the bond-line in order to tackify the

adhesive, thereby temporarily adhering the flex circuit to the

test substrate.

Note: When a soldering iron is used, it should be powered

through a Variac in order to provide temperature control. The

temperature/time of the soldering iron should be just high

enough to tackify the adhesive but not so high as to substan-

tially cross-link the adhesive (i.e., 100°-130°C) and only a few

seconds exposure to these temperatures.

5.2.5

Bond

the flex circuit to the test substrate using the

hot-bar soldering station. Apply a minimum of 20 kg and a

maximum of 40kg/sq. cm of total bond-line area (or as recom-

mended by the adhesive vendor), then ramp the temperature

to the set point. The thermode set point needs to be set to

permit the adhesive layer to reach 180°C within 10 seconds

(or as recommended by the adhesive vendor) of the time at

which the thermode reaches its setpoint. The thermode

should remain at the setpoint for a time sufficient to cure the

adhesive according to vendor’s specification (typically 20 sec-

onds). Some vendors may advise that the bond pressure

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.9.2

Subject

Bonding

Process

Date

11/98

Revision

Originating Task Group

SMT Mounting Adhesives Task Group (5-24d)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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