IPC-TM-650 EN 2022 试验方法.pdf - 第733页

1.0 Scope This test method defines the procedure for determining the low temperature flexibility of flexible printed wiring materials by flexing while immersed in a solution mixed from dry ice (solid carbon dioxide) and …

Procedure

5.1

Prepare

specimens as required, depending on the con-

figuration of the material under test (see 3.1).

5.2

Preconditioning

The

samples and controls shall be

dried by baking at 105°C ± 2°C for a minimum of two hours

to remove moisture.

5.3

Expose to Moisture Under Pressure

5.3.1

Place

three pieces of each type of material to be

tested in the pressure vessel, such that they are vertical by

use of a rack or grooved block, which does not cover more

than 5% of the surface area of the specimen. If samples have

been prepared as per 3.1.2.2 and 3.1.3, place one piece of

the base laminate in the vessel along with the specimens.

5.3.2

Fill

the pressure vessel with water such that the speci-

mens are not sitting in the water.

5.3.3

the lid of the pressure vessel and seal the

chamber.

5.3.4

Apply

heat to the pressure vessel until the temperature

and pressure specified are attained and held constant.

5.3.5

Water

must be replenished during the pressure vessel

test to maintain the prescribed pressure level. The interval of

replenishment should not be less than six hours.

5.3.6

After

the required time, which shall be 96 hours unless

otherwise specified, remove the pressure cooker from the

heat source and open the chamber. Remove the specimens

and lay on a countertop to stabilize at room temperature.

5.4

Evaluation

5.4.1

Inspect

the surface area of the specimens using 20/20

vision. When applicable, refer to IPC-A-600 to assess degra-

dation, such as measling or crazing.

5.4.1.1

Determine

and grade the presence of any degrada-

tion (see 5.5.1.1 through 5.5.1.5) or other defects, such as

measling, dryness, loss of surface resin, etc. Use the uncon-

ditioned specimen from each sample as a control to contrast

with the conditoned specimens. For samples prepared as per

3.1.2.2 or 3.1.3, use the base laminate as control.

5.4.1.2

Record

any defects or degradation of the material.

Note the presence of any defects in the unconditioned con-

trol. Include the approximate number and size of defects and

the total area of the specimen surface that is afflicted with the

defect(s).

5.4.2

When

required by the procurement documentation,

microsectioning shall be conducted as stated in 5.4.2.1

through 5.4.2.3.

5.4.2.1

Cross

section at least one specimen in the center of

the specimen in accordance with Method 2.1.7. Mount a sec-

tion of the control of that material beside the conditioned sec-

tion.

5.4.2.2

After

polishing the sections, examine under 100 -

200X.

5.4.2.3

Determine

the presence of voids, resin-to-

reinforcement separation, or other defects in both the control

and the conditioned specimen.

5.5

Report

the base thickness of the laminate. For

prepregs or coating et al, if a composite sample is fabricated,

include the final thickness of the material in question and the

thickness of the core laminate.

5.5.1

Report

the condition of the specimens according to

the following grade system. If significant differences are noted

between specimens of one material, note the worse condition.

Exclude the outer 7 mm.

5.5.1.1

Grade 5

measling, delamination, dryness, void-

ing or other degradation in excess of that observed on the

unconditioned sample.

5.5.1.2

Grade 4

Very

slight measling; or slight dryness.

5.5.1.3

Grade 3

Slight

measling or dryness; or maximum,

of three voids no greater than 0.25 mm.

5.5.1.4

Grade 2

Moderate

measling or dryness; moderate

dryness; or more than three voids no greater than 0.5 mm.

5.5.1.5

Grade 1

Heavy

measling and dryness; or voids

greater than 0.5 mm; blisters or delamination.

5.5.2

Optional Microsectioning Evaluation

Report

the

presence of defects in both control and conditioned speci-

mens.

IPC-TM-650

Number

2.6.16.1

Subject

Moisture

Resistance of High Density Interconnection (HDI)

Materials Under High Temperature and Pressure (Pressure

Vessel)

Date

8/98

Revision

age2of2

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1.0

Scope

This

test method defines the procedure for

determining the low temperature flexibility of flexible printed

wiring materials by flexing while immersed in a solution mixed

from dry ice (solid carbon dioxide) and isopropyl alcohol.

2.0

Applicable Documents

None

3.0

Test Specimen

The

test specimen shall consist of an

etched conductor pattern in accordance with Figure 1.

4.0

Test Equipment

4.1

Flexing

fixture similar to Photo 1, with 1 inch diameter

mandrel.

4.2

Insulated

container, approximately 20 quart capacity.

4.3 Two lbs. dry ice (solid carbon dioxide).

4.4 Three

gallons reagent grade isopropyl alcohol.

4.5 Thermometer

capable of measuring at least -65°C.

4.6 Safety

gloves.

5.0

Procedure

5.1

Prepared

a minimum of two test specimens per Figure 1

using good commercial practices.

5.2

Prepare

a bath by mixing two lbs. of solid carbon diox-

ide with three gallons of isopropyl alcohol. Caution: use

adequate safety precautions, as bath will produce extreme

cold (approximately -65°C).

5.3

Mount

the test specimen in the test fixture such that it is

wrapped 180° around the 1 inch diameter mandrel.

5.4

Submerge

the test specimen end of the flexing fixture

into the cold bath and flex 5 times.

5.5

Remove

the specimen from the bath and examine for

cracking, delaminations, splits, and/or any other viable defect.

6.0 Notes

6.1

All

safety precautions must be exercised when working

with a mixture of dry ice and alcohol.

6.1.1

Dry

ice has a temperature of -110°F, passes directly

to the gaseous state, and is used as a refrigerant. Therefore,

it is dangerous if not handled carefully.

6.1.2

Isopropyl

alcohol is flammable and toxic; should not

be ingested, and should also be handled properly.

6.2

Detailed

drawings of the suggested flexing fixture are

available from the IPC office.

IPC-2618-1

Figure

1 Low Temperature Flexibility Test Pattern. Note:

Conductors are 0.060 inch wide on 0.100 inch centers.)

IPC-2.6.18_p1

Photo

1 Low Temperature Flexibility Flexing Fixture.

(Note: Fixture Drawing available from IPC.)

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.6.18

Subject

Low

Temperature Flexibility, Flexible Printed Wiring

Materials

Date

7/85

Revision

Originating Task Group

N/A

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

age1of1

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1 Scope This test method describes the procedure for

establishing the service temperature for metal-clad flexible

base material (laminate) as described in IPC-4204 as well as

cover materials and adhesive bonding films (unsupported

adhesive and supported bond plies) as described in IPC-

4203. For purposes of this test method, cover material shall

consist of coverlay and coverfilm but shall not include cover-

coat materials. Properties evaluated after thermal aging in this

test are: visual, peel strength and dielectric strength.

2 Applicable Documents

2.1 IPC

IPC-T-50 Terms and Definitions for Interconnecting and

Packaging Electronic Circuits

IPC-TM-650 Test Methods Manual

2.4.9 Peel Strength, Flexible Dielectric Materials

2.4.13 Solder Float Resistance Flexible Printed Wiring

Materials

IPC-4203 Adhesive Coated Dielectric Films for Use as Cover

Sheets for Flexible Printed Circuitry and Flexible Adhesive

Bonding Films

IPC-4562 Metal Foil for Printed Board Applications

2.2 ASTM International

ASTM D-149 Standard Test Method for Dielectric Break-

down Voltage and Dielectric Strength of Solid Electrical Insu-

lating Materials at Commercial Power Frequencies

3 Bond Strength Test Procedure

3.1 Specimen Preparation for Metal-Clad Flexible Base

Material (Laminate)

3.1.1

Prepare twelve specimens according to the procedure

outlined for method A of IPC TM-650, method 2.4.9, using

appropriate photolithographic processes. Etch four conduc-

tors 3.2 mm [0.126 in] wide, 5.7 mm [0.224 in] pitch, 230 -

250 mm [9 - 10 in] long on a nominal 25 mm [1 in] wide strip

of flexible base dielectric (see Figure 1).

Single-clad or double-clad flexible base material shall be

tested in the format supplied. If the flexible base material

under test is double-clad, prepare a separate set of speci-

mens for each side. It is permissible to leave the unetched

copper on the non-test side (see Notes 6.1 and 6.2).

3.2 Specimen Preparation for Cover Material

3.2.1

Single-clad base material shall be produced from

specimens of the cover materials. Cover material shall be

bonded to the shiny side of 34.3 µm [1.35 mil] copper foil,

type CU-E1-1S or CU-E7-1S per IPC-4562 (CU-E1-1S shall

be the referee material). Copper foil cleaning shall be per the

manufacturer’s normal cleaning procedure. The referee clean-

ing procedure shall be per Table 1.

3.2.2 Prepare twelve specimens according to the procedure

outlined for method A of IPC TM-650, method 2.4.9, using

appropriate photolithographic processes. Etch four conduc-

tors 3.2 mm [0.126 in] wide, 5.7 mm [0.224 in] pitch, 230 -

250 mm [9 - 10 in] long on a nominal 25 mm [1 in] wide strip

of flexible base dielectric (see Figure 1).

3.3 Specimen Preparation for Adhesive Bonding Film

3.3.1

Metal-clad flexible base material shall be produced

from specimens of the adhesive bonding film being evaluated.

Adhesive bonding film shall be bonded to the shiny side of

34.3 µm [1350 µin] ED copper foil, type CU-E1-1S or RA

copper foil, CU-E7-1S per IPC-4562 (CU-E1-1S shall be the

referee material). Adhesive bonding film shall be bonded

between the copper foil and CU-E1-1S as support material as

illustrated in Figure 2. Copper foil cleaning shall be per the

manufacturer’s normal cleaning procedure. The referee clean-

ing procedure shall be per Table 1, the same as detailed in

IPC-4203.

Prepare specimens according to the procedure outlined for

method A of IPC TM-650, method 2.4.9, using appropriate

1. www.ipc.org

2. Current and revised IPC Test Methods are available on the IPC Web site (www.ipc.org/html/testmethods.htm)

3. www.astm.org

3000 Lakeside Drive, Suite 309S

Bannockburn, IL 60015-1249

IPC-TM-650

TEST METHODS MANUAL

Number

2.6.21

Subject

Service Temperature of Metal-Clad Flexible Laminate,

Cover Material and Adhesive Bonding Films

Date

6/11

Revision

Originating Task Group

Flexible Circuits Test Methods Subcommittee

(D-15)

Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.

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