IPC-TM-650 EN 2022 试验方法.pdf - 第384页
5.2.5 Remove the coupon in a horizontal position and place on a flat surface, allowing the melted solder to solidify undis- turbed. 5.2.6 Repeat steps 5.2.2 through 5.2.5 to test four addi- tional specimens. 5.2.7 Use a …
1
Scope
This
test method will give an indication of activity
of wave solder fluxes, core solder fluxes, and solder paste.
2
Applicable Documents
ASTM B-36
Brass
Plate, Sheet, Strip, and Rolled Bar
IPC
J-STD-004
Requirements
for Soldering Fluxes
IPC/EIA
J-STD-006
Requirements
for Electronic Grade sol-
der Alloys and Fluxed and Non-Fluxed Solid Solders for Elec-
tronic Soldering Applications
3
Test Specimen
3.1
A
minimum of 10 ml of first article or production speci-
men of liquid flux.
3.2
For
solid or paste flux, 10 ml of a 35% by weight solu-
tion of the flux in reagent grade 2-propanol (or other solvent
recommended by the manufacturer) (see J-STD-004).
3.3 For
solder paste, 10 ml of a 25% by weight solution
of the reflowed solder paste flux in reagent grade 2-propanol
(or other solvent recommended by the manufacturer) (see
J-STD-004).
3.4
For
cored wire, 10 ml of a 10% by weight solution of
reflowed cored solder flux in reagent grade 2-propanol (or
other solvent recommended by the manufacturer). For low
solids, no clean fluxes a 5% solution shall be used (see
J-STD-004).
3.5
For
preform, 10 ml of a 10% by weight solution of
reflowed preform flux in reagent grade 2-propanol (or other
solvent recommended by the manufacturer). For low solids,
no clean fluxes a 5% solution shall be used (see J-STD-004).
4
Apparatus and Reagents
4.1
Five
(5) replicates, approximately 40 x 75 mm [1.575 x
2.953 in], of 0.25 mm [0.00984 in] thick 70/30 brass, per
ASTM-B-36 C2600 HO2.
4.2 Degreased
steel wool #00.
4.3
Sn60
1.5 mm [0.0591 in] diameter Type S solid wire
solder per J-STD-006.
4.4
Solder
pot containing at least 2 kg of solder and no less
than 25 mm [0.984 in] in depth.
4.5
Reagent
grade isopropyl alcohol (IPA).
4.6
3.0
mm [0.118 in] diameter mandrel.
5
Test
5.1 Specimen Preparation
5.1.1
Clean
the five (5) brass coupons with steel wool.
5.1.2
Using
a flat strip of brass as a guide, put a 90° bend
in opposite ends of each test coupon to stiffen and flatten the
coupon.
5.1.3
Cut
a 30 ± 0.5 mm [1.181 ± 0.020 in] length of solid
wire solder.
5.1.4
Wrap
the cut length of solder around a 3.0 mm [0.118
in] mandrel.
5.1.5
Slide
the perform (coil) off of the mandrel. Make a total
of five solder performs in this manner.
5.2
Procedures
5.2.1
Maintain
solder pot at 260 ± 10 °C [500 ± 18 °F].
5.2.2
Place
a preformed solder circle in the center of a test
coupon (on the surface which faces up when the bent ends
point up).
5.2.3
Place
one drop (0.05 ml) of flux in the center of the
perform and allow to dry to minimize spattering.
5.2.4
Carefully
place the coupon on the surface of the sol-
der bath for 15 seconds. If the solder has not melted in 15
seconds, leave the coupon on the solder bath until the per-
form melts.
2215
Sanders Road
Northbrook, IL 60062-6135
IPC-TM-650
TEST
METHODS MANUAL
Number
2.4.46
Subject
Spread
Test, Liquid, Paste or Solid Flux,
or Flux Extracted from Solder Paste, Cored
Wires or Preforms
Date
06/04
Revision
A
Originating Task Group
Flux Specifications Task Group, (5-24a)
Material
in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.
P
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TION CONNECTING
ELECTRONICS INDUSTRIES
®
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
5.2.5
Remove
the coupon in a horizontal position and place
on a flat surface, allowing the melted solder to solidify undis-
turbed.
5.2.6
Repeat
steps 5.2.2 through 5.2.5 to test four addi-
tional specimens.
5.2.7
Use
a suitable solvent to remove all flux residue from
the test coupons.
5.3
Evaluation
5.3.1
Measure
each solder spread area by comparing to
circles (predrawn) with areas similar to those listed in Table 1.
Report the mean of the spread (area in mm
2
)
of the five tested
specimens.
Table 1 is intended as an aid in defining areas in mm
2
.
T
able 1 Typical Spread Areas Defined in mm
2
Diameter
in mm Area in mm
2
10.00
78.54
10.70 90.00
11.28 100.00
6 Notes
6.1 Safety
Observe
all appropriate precautions on MSDS
for chemicals involved in this test method.
IPC-TM-650
Number
2.4.46
Subject
Spread
Test, Liquid, Paste or Solid Flux,
or Flux Extracted from Solder Paste, Cored
Wires or Preforms
Date
06/04
Revision
A
P
age2of2
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
1.0
Scope
This
test method specifies a qualitative method
for assessment of the tackiness of soft soldering flux residues.
The method is applicable to fluxes of types L and M. the
method is particularly appropriate for applications where flux
residues are left in place on soldered electronic and electrical
equipment.
2.0
Applicable Documents
ISO 1634
Wrought-Copper
and Copper Alloy Plate; Sheet
and Strip
ISO
9453
Soft
Solder Alloys
ISO
9455
Parts
1 and 2 Soft Soldering Fluxes
3.0
Test Specimen
A
minimum of 0.035 grams by weight
is required per test for fluxes in solid or paste form. For liquid
fluxes, a volume sufficient to contain a minimum of 0.035
grams of non-volatile matter is required per test. For samples
of flux cored solder, a minimum 1 gram is required per test
and for solder paste, a minimum of 0.5 grams is required per
test.
4.0
Apparatus and Reagents
4.1 General
In
the test use only reagents of recognized
analytical quality and only distilled, or deionized, water.
4.2
Acid Cleaning Solution
Add
cautiously, with stirring,
75 ml of sulfuric acid (density 1.84 g/ml) to 210 ml of water
and mix. Cool, add 15 ml of nitric acid (density 1.42 g/ml) and
mix the solution thoroughly.
4.3
Degreasing
solvent, such as 2-propanol, acetone, tolu-
ene or petroleum ether.
4.4 Powdered
chalk.
4.5
0.5
mm thick copper sheet complying with ISO 1634:
Part 1, grad Cu - ETP, condition HA.
4.6
Acetone
4.7
Solder
wire, or pellets, complying with QQ-S-ALLOY
XXX or ISO 9453 grade S-Sn60Pb40.
4.8
Solder
bath, either circular with diameter not less than
120 mm, or rectangular with dimensions not less than 100
mm X 75 mm, containing tin-lead solder having a liquidus less
than 200°C. The depth of the solder in the bath shall not be
less than 40 mm. The bath shall be capable of being main-
tained at a temperature of 235 +/-5°C.
4.9
Cupping
Device. This shall be fitted with a 27 mm diam-
eter die and a 20 mm diameter ball.
4.10
Drying
oven, suitable for use at 110 +-2°C.
4.11
Tongs,
or other suitable mechanical device, to lift the
test piece from the surface of the molten solder bath.
4.12
Soft
brush, of diameter approximately 7 mm.
4.13
Ordinary
laboratory apparatus.
5.0
Procedure
5.1 Preparation of Copper Test Pieces
5.1.1
From
the sheet of half hard copper, approximately 0.5
mm thick (4.5), cut test pieces each 50 mm X 50 mm.
5.1.2
Clamp each of the test pieces, in turn, centrally onto
the 27 mm die of the cupping device (4.9). Using the 20 mm
diameter ball, make a depression in the center of each test
piece 3 mm deep, by forcing the ball into the die. One corner
of the test piece may be bent up to facilitate handling with the
tongs.
5.1.3
Immediately
before the test, use the solvent (4.3) to
degrease each test piece, and immerse the test pieces for 20
seconds in the acid cleaning solution (4.2). Remove the test
pieces from the cleaning solution, wash well under running
water, rinse in acetone (4.6) and dry by air blowing at room
temperature.
5.1.4
Test
For solid, paste and liquid flux samples:
5.1.4.1
Weigh
1.00 +/-0.05g of the solder wire or pellets
(4.7), previously degreased in the solvent (4.3), and transfer it
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
IPC-TM-650
TEST
METHODS MANUAL
Number
2.4.47
Subject
Flux
Residue Dryness
Date
1/95
Revision
Originating Task Group
Flux Specifications Task Group (5-24a)
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
age1of2
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ