IPC-TM-650 EN 2022 试验方法.pdf - 第731页

1 Scope This test method is designed to determine the capability of HDI materials and other dielectrics to withstand moisture induced stress as applied by extended time in a pressure vessel. For laminated constructions, …

IPC-2616-3

CONDITION

IPC-2616-4

CONDITION

IPC-2616-5

CONDITION

IPC-TM-650

Number

2.6.16

Subject

Pressure

Vessel Method for Glass Epoxy Laminate Integrity

Date

7/85

Revision

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Scope

This

test method is designed to determine the

capability of HDI materials and other dielectrics to withstand

moisture induced stress as applied by extended time in a

pressure vessel. For laminated constructions, the results may

be affected by the process conditions.

Applicable Documents

IPC-A-600

Acceptability

of Printed Boards

IPC-TM-650

Test Methods Manual

2.1.1

Microsectioning

2.1.1.2 Microsectioning—Semi or Automatic Technique

Microsection Equipment (Alternate)

2.3.6 Etching, Ammonium Persulfate Method

2.3.7 Etching, Ferric Chloride Method

2.3.7.1 Cupric Chloride Etching Method

2.3.7.2 Alkaline Etching Method

Test Specimen

3.1

Samples

shall be prepared as appropriate for the type of

material. All samples shall be 10 cm x 10 cm ± 0.5 cm, with

the thickness determined by the type of material (see 3.1.1 to

3.1.3). Three samples shall be prepared. Control samples are

required for all samples where the dielectric layer is applied to

an etched laminate. One control sample of the etched lami-

nate (with no added dielectric) is required for samples pre-

pared according to 3.1.2.2 or 3.1.3.

3.1.1

Copper-Clad Laminate

The

laminate shall have all

copper removed in accordance with IPC-TM-650, Method

2.3.6, 2.3.7, 2.3.7.1 or 2.3.7.2, then cut to dimensions of 10

cm x 10 cm ± 0.65 cm.

3.1.2

Semi-Cured Prepreg

The

prepreg shall be lami-

nated to a cured sheet configuration, with 35 micron copper

foil, using the supplier’s recommended lamination cycle. The

laminate shall be etched of all copper, then cut to dimensions

of 10 cm x 10 cm ± 0.65 cm.

3.1.2.1

Semi-Cured Prepreg or Dielectric Material,

Method A

Sufficient

plies of prepreg shall be used to result

in a composite base thickness of 0.4 mm ± 0.1 mm. If the

prepreg is of a nature that does not allow for lamination of a

single sample of the thickness specified, then a thinner

sample shall be laminated, noting the thickness as part of the

report, see 5.5.

3.1.2.2

Semi-Cured Prepreg or Dielectric Material,

Alternate Method B

The

prepreg or dielectric layer shall be

laminated to both sides of an etched laminate that has a thick-

ness of 0.4 mm ± 0.1 mm. The prepreg or dielectric layer shall

be applied, laminated and cured according to the manufactur-

er’s recommendations. Unless otherwise specified, the result-

ing prepreg or dielectric layer thickness shall be a nominal of

0.05 mm on each side of the core laminate. Optionally, the

actual thickness may be measured by mechanical or cross-

sectional methods and reported, see 5.5. Control samples

shall be the etched laminate core with no prepreg or dielectric

layer.

3.1.3

Coated Dielectrics

The

coated dielectrics (i.e., res-

ins, adhesives, dry films) shall be applied to both sides of an

etched laminate that has a thickness of 0.4 mm ± 0.1 mm.

The coated dielectrics shall be applied and cured according to

the manufacturer’s recommendations. Unless otherwise

specified, the resulting coated dielectric thickness shall be a

nominal of 0.05 mm on each side of the core laminate.

Optionally, the actual thickness may be measured by

mechanical or cross-sectional methods and reported, see 5.5.

Control samples shall be the etched laminate core with no

coated dielectric.

Test Equipment

4.1

Pressure

vessel capable of maintaining a constant pres-

sure of 2 ATM (14 psig), and a temperature of 121°C ± 2°C,

with water content maintained for a minimum of six hours

before needing replenishment.

4.2

Oven,

air circulating, capable of holding a temperature of

105°C ± 2°C

4.3

Microsectioning

equipment, including slug cutter,

mounting, grinding, and polishing equipment (see IPC-TM-

650, Method 2.1.1 or 2.1.1.2)

4.4 Microscope

capable of 200X magnification, with optional

photographic equipment

2215

Sanders Road

Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.6.16.1

Subject

Moisture

Resistance of High Density

Interconnection (HDI) Materials Under High

Temperature and Pressure (Pressure Vessel)

Date

8/98

Revision

Originating Task Group

HDI Test Methods Task Group (D-42A)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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ELECTRONICS INDUSTRIES

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Procedure

5.1

Prepare

specimens as required, depending on the con-

figuration of the material under test (see 3.1).

5.2

Preconditioning

The

samples and controls shall be

dried by baking at 105°C ± 2°C for a minimum of two hours

to remove moisture.

5.3

Expose to Moisture Under Pressure

5.3.1

Place

three pieces of each type of material to be

tested in the pressure vessel, such that they are vertical by

use of a rack or grooved block, which does not cover more

than 5% of the surface area of the specimen. If samples have

been prepared as per 3.1.2.2 and 3.1.3, place one piece of

the base laminate in the vessel along with the specimens.

5.3.2

Fill

the pressure vessel with water such that the speci-

mens are not sitting in the water.

5.3.3

the lid of the pressure vessel and seal the

chamber.

5.3.4

Apply

heat to the pressure vessel until the temperature

and pressure specified are attained and held constant.

5.3.5

Water

must be replenished during the pressure vessel

test to maintain the prescribed pressure level. The interval of

replenishment should not be less than six hours.

5.3.6

After

the required time, which shall be 96 hours unless

otherwise specified, remove the pressure cooker from the

heat source and open the chamber. Remove the specimens

and lay on a countertop to stabilize at room temperature.

5.4

Evaluation

5.4.1

Inspect

the surface area of the specimens using 20/20

vision. When applicable, refer to IPC-A-600 to assess degra-

dation, such as measling or crazing.

5.4.1.1

Determine

and grade the presence of any degrada-

tion (see 5.5.1.1 through 5.5.1.5) or other defects, such as

measling, dryness, loss of surface resin, etc. Use the uncon-

ditioned specimen from each sample as a control to contrast

with the conditoned specimens. For samples prepared as per

3.1.2.2 or 3.1.3, use the base laminate as control.

5.4.1.2

Record

any defects or degradation of the material.

Note the presence of any defects in the unconditioned con-

trol. Include the approximate number and size of defects and

the total area of the specimen surface that is afflicted with the

defect(s).

5.4.2

When

required by the procurement documentation,

microsectioning shall be conducted as stated in 5.4.2.1

through 5.4.2.3.

5.4.2.1

Cross

section at least one specimen in the center of

the specimen in accordance with Method 2.1.7. Mount a sec-

tion of the control of that material beside the conditioned sec-

tion.

5.4.2.2

After

polishing the sections, examine under 100 -

200X.

5.4.2.3

Determine

the presence of voids, resin-to-

reinforcement separation, or other defects in both the control

and the conditioned specimen.

5.5

Report

the base thickness of the laminate. For

prepregs or coating et al, if a composite sample is fabricated,

include the final thickness of the material in question and the

thickness of the core laminate.

5.5.1

Report

the condition of the specimens according to

the following grade system. If significant differences are noted

between specimens of one material, note the worse condition.

Exclude the outer 7 mm.

5.5.1.1

Grade 5

measling, delamination, dryness, void-

ing or other degradation in excess of that observed on the

unconditioned sample.

5.5.1.2

Grade 4

Very

slight measling; or slight dryness.

5.5.1.3

Grade 3

Slight

measling or dryness; or maximum,

of three voids no greater than 0.25 mm.

5.5.1.4

Grade 2

Moderate

measling or dryness; moderate

dryness; or more than three voids no greater than 0.5 mm.

5.5.1.5

Grade 1

Heavy

measling and dryness; or voids

greater than 0.5 mm; blisters or delamination.

5.5.2

Optional Microsectioning Evaluation

Report

the

presence of defects in both control and conditioned speci-

mens.

IPC-TM-650

Number

2.6.16.1

Subject

Moisture

Resistance of High Density Interconnection (HDI)

Materials Under High Temperature and Pressure (Pressure

Vessel)

Date

8/98

Revision

age2of2

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