IPC-TM-650 EN 2022 试验方法.pdf - 第83页

1.0 Scope This method of test covers the procedure for determining the weight and/or thickness of releasable carrier copper foils for printed circuits. 2.0 Applicable Documents None. 3.0 Test Specimen Use template descri…

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5.2
Calculation
5.2.1
Calculate
the effective thickness of the foil in mils by
multiplying the weight of the 324 x 25.4 mm [12 x 1 inch]
specimen by 0.572 mil/g.
Te (mil)=0.572
mil
g
xW(g)
Te
= Thickness Equivalent
Sample calculation:
W = 2.16 g
Te = 0.572 mil/g x 2.16 g = 0.0031 [1.236 mil]
5.2.2
Calculate
the average mechanical thickness microme-
ter of each 10 ply specimen from the four values taken on
each sample.
5.2.3
Calculate
the average overall thickness (Tm) for each
sample by dividing the average thickness of the specimen by
the number of plies.
5.2.4
Calculate
the average profile factor of the foil for each
specimen by subtracting the effective thickness from the aver-
age mechanical thickness.
PF=TmTe
5.2.5
Average
the three values of profile factor.
5.3
Report
5.3.1
Report
the average profile factor for the three speci-
mens tested.
5.3.2
Report
the average mechanical thickness for the three
specimens tested.
6.0 Notes
Thickness
of Specimen: The thickness of the specimen used
must be at least 100 times the precision of the thickness
measuring device. More plies may be required for lighter foil,
e.g. 0.5 ounce per square foot foil if the micrometer precision
is 0.0025 mm [0.0001 inch] since a minimum of 0.25 mm [10
mils] is required to fulfill the 1% requirement. If a precision
25.4 mm [1 inch] cutter is not available a paper cutter or
punch and die set may be used for sample preparation, how-
ever, the areas of the sample used for weight determination
must be known to 1% or better and the thickness sample
must be free from wrinkles or creases.
Precision: A study of various 1 oz./ft copper foils resulted in
reproducibility between testers using a hand micrometer with
0.0013 mm [0.00005 inch] resolution.
Comparison to Other Methods: The profile factor determined
by this test may vary slightly from the actual profile height as
estimated from other methods, such as microsectioning or
profilometery. The denser the treatment structure the more
this technique will underestimate the true profile height. The
precision of this method between testers was about 50% bet-
ter than microsectioning in determining the amount of profile
on low profile treated ED copper using the same number of
determinations using a single microsection as the test vehicle.
The time required by this method is under 5 minutes.
Thickness
Mean
(mils)
Microns
Standard
Deviation
(mils) Microns
Profile
Factor
Mean
(mils) Microns
Standard
Deviation
(mils) Microns
Treated ED Foil Class 1
1 oz.ft
2
1.61
40.9 0.015 0.38 0.350 8.89 0.015 0.38
Treated ED Foil Class 3
1 oz./ft
2
1.62 41.2 0.013 0.33 0.251 6.38 0.013 0.33
Untreated RA Foil Class 7
3/4 oz./ft
2
1.06
26.4 0.010 0.25 0.061 1.55 0.011 0.28
IPC-TM-650
Number
2.2.12.1
Subject
Overall
Thickness and Profile Factor of Copper Foils Treated and
Untreated
Date
9/87
Revision
P
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1.0
Scope
This
method of test covers the procedure for
determining the weight and/or thickness of releasable carrier
copper foils for printed circuits.
2.0
Applicable Documents
None.
3.0
Test Specimen
Use
template described below to cut
three samples of carrier copper foil. Samples should be taken
from near the left and right edges and center across the width
of the roll.
4.0
Apparatus
4.1
Balance
capable of weighing accuracy to ±0.001 grams.
4.2
Knife
suitable for cutting copper.
4.3
Template
pre-cut to 0.026 sq. meters [40 sq. in] 100
±0.1 mm by 250 ±0.1 mm [4 ±1/32 in by 10 ±1/32 in].
4.4
B-Stage
(prepreg) material and sufficient laboratory
equipment for lamination.
5.0
Procedure
5.1 Test
5.1.1
Cut
three specimens 100 x 250 mm [4 by 10 inches]
in size across the web of the roll.
5.1.2
Using
a balance, weigh three separate specimens to
the nearest 0.001 grams. Record the weights for each speci-
men.
5.1.3 Laminate
the three specimens to a B stage (prepreg)
material to a total thickness of 1 mm [0.062 in] thick (suggest
8 piles of No. 7628 glass style 0.17 mm [0.0068 in] nominal
thickness or equal).
5.1.4
After
lamination, remove the carrier substrate. Weigh
the carrier on a balance to the nearest 0.001 gram. Record
the weights, Subtract the weights recorded from the corre-
sponding weights in 5.1.2.
5.2
Evaluation
5.2.1
To
calculate the approximate thickness of the thin
copper foil in microns, multiply the weight difference obtained
in 5.1.4, by the factor 4.349.
5.2.2
To
calculate the area weight in grams per 6451 square
mm [254 square inches] of the carrier copper foil, multiply the
weight difference obtained in 5.1.4 by the factor 6.35.
5.2.3
To
calculate the area weight in ounces per 3657
square mm [square foot] of the carrier copper foil, multiply the
weight difference by the factor 0.127.
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road Northbrook, IL 60062
IPC-TM-650
TEST
METHODS MANUAL
Number
2.2.12.2
Subject
Weight
and Thickness of Copper Foils with
Releasable Carriers
Date
7/89
Revision
Originating Task Group
N/A
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
age1of1
电子技术应用       www.ChinaAET.com
1.0
Scope
This
method of test covers the procedure for
determining the weights and/or thickness of etchable carrier
copper foils for printed circuits.
2.0
Applicable Documents
None.
3.0
Test Specimen
Use
template described below to cut
three samples of carrier copper foil. Samples should be taken
from near the left and right edges and center across the width
of the roll.
4.0
Apparatus
4.1
Balance
capable of weighing accuracy to ±0.001 grams.
4.2
Knife
suitable for cutting copper.
4.3
Template
pre-cut to 0.026 sq. meters [40 sq. in] 100
+0.1 mm by 250 ±0.1 mm [4 ±1/32 in by 10 ±1/32 in].
5.0
Procedure
5.1 Test
5.1.1
Cut
three specimens 100 x 250 mm [4 by 10 inches]
in size across the web of the roll.
5.1.2
Using
a balance, weigh three separate specimens to
the nearest 0.001 grams. Record the weights for each speci-
men.
5.1.3
Remove
the copper from the carrier substrate by
etching the samples in a 50% nitric acid solution for 30 sec-
onds or a suitable time to remove the copper foil. Rinse and
dry.
5.1.4
Reweigh
carrier substrate on the balance to the near-
est 0.001 gram. Record the weight of each sample. Subtract
the weights recorded from the corresponding weights in
5.1.2.
5.2
Calculation
5.2.1
To
calculate the approximate thickness of the etch-
able carrier copper foil in microns, multiply the weight differ-
ence obtained in 5.1.4, by the factor 4.349.
5.2.2
To
calculate the area weight in grams per 6451 square
mm [254 square inches], multiply the weight difference
obtained in 5.1.4 by the factor 6.35.
5.2.3
To
calculate the area weight of the etchable carrier in
ounces per 3657 square mm [square foot], multiply the weight
obtained in 5.1.4 by the factor 0.127.
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road Northbrook, IL 60062
IPC-TM-650
TEST
METHODS MANUAL
Number
2.2.12.3
Subject
Weight
and Thickness Determination of Copper
Foils with Etchable Carriers
Date
7/89
Revision
Originating Task Group
N/A
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
age1of1
电子技术应用       www.ChinaAET.com