IPC-TM-650 EN 2022 试验方法.pdf - 第93页
middle button on the mouse swaps between ‘moving’ and ‘growing’ the rectangle. When the rectangle is set, press the right hand button on the mouse to proceed. 5.3.5 On the keyboard that now comes up on the screen, select…
1.0
Scope
This
test method is designed to determine pow-
der particle size distribution in creams by image analysis.
2.0
Applicable Documents
None
3.0
Test Specimen
10
grams of solder paste
4.0
Equipment/Apparatus
Thinner
5.0
Procedure
5.1 Preparation
5.1.1
Stencil
some solder cream onto a glass slide using a
5 or 6 mm diameter, 0.1 mm thick stencil.
5.1.2
Apply
a little thinner to the solder paste and gently
disperse the paste over an area about 20 mm diameter, using
a glass rod. Cover with a 22 mm diameter cover glass and
gently press to give a monolayer dispersion of powder par-
ticles under the cover glass.
It is important to get a good dispersion without a lot of
bubbles or particle agglomerates. If the paste you are exam-
ining has a high metal content, remove some of the stencilled
paste before dispersing it. The standard stencils are suitable
for 85–86% metal paste.
5.1.3
Label
the glass slide with the powder batch number.
5.2
Images for Analysis
The
next step is to put 10 or 15
images from each sample into an image directory.
5.2.1
Start
up the image analyzer.
5.2.2
Set
up the microscope illumination for X10 and select
the X10 objective.
5.2.3
Put
the slide on the microscope, focus, swing the bin-
ocular eyepiece to the left sending the light to the TV camera,
and refocus on the screen.
5.2.4 Ensure
that there are no agglomerations or badly out-
of-focus particles and then capture the image.
5.2.5
Capture
10 images covering the slide in a systematic
way without consciously selecting areas (other than avoiding
agglomerations and areas of very low particle density).
5.2.6
Record
the number of the slide and remove from the
microscope.
5.2.7
Put
the next slide on the microscope and repeat the
process.
5.2.8
When
all the samples have been recovered, swing the
eyepiece back and switch off the microscope.
5.2.9
Comments
–
Do not change the illumination between samples.
– Record a series of samples at the same magnification.
5.3
Image Analysis
5.3.1
When
images from the required number of samples
have been entered, select ‘Multi Sample Size’ on the menu (or
‘One Sample Size’ for a single sample). An image in red and
blue will then come up on the screen.
5.3.2
Using
the left and center buttons on the mouse, adjust
the thresholds until the red areas correspond to the particles
to be measured. Selecting the right hand button allows you to
vary the line on the screen where the intensity plot is mea-
sured. Adjust the top threshold so that it is about halfway
down the intensity minima. Press center and right buttons on
the mouse simultaneously.
5.3.3
You
should now see a green rectangle on a grey
image. If there is no rectangle, press the left hand button until
one appears.
5.3.4
A
particle is measured if the top of the particle lies
within the rectangle, so the size and position of the rectangle
must be adjusted so that the sides are half a particle diameter
from the sides of the screen, and the base of the rectangle a
whole particle diameter from the bottom of the screen. The
top of the rectangle should lie along the top of the screen. The
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062
IPC-TM-650
TEST
METHODS MANUAL
Number
2.2.14.2
Subject
Solder
Powder Particle Size Distribution—Optical
Image Analyzer Method
Date
1/95
Revision
Originating Task Group
Solder Paste Task Group (5-24b)
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
age1of2
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
middle
button on the mouse swaps between ‘moving’ and
‘growing’ the rectangle. When the rectangle is set, press the
right hand button on the mouse to proceed.
5.3.5
On
the keyboard that now comes up on the screen,
select the number of samples being processed.
5.3.6
On
the next keyboard select the number of particles to
be measured (200 for type 1-4 and 400 for type 5-6 is sug-
gested).
5.3
Evaluation
Express
the masses of the powder above,
within, and below the nominal size range as percentages of
the mass of the original sample. Enter data in Table 1.
T
able 1
T
ype 1 +150µm
+75
µm
+20
µm
–20
µm
T
ype 2 + 75 µm
+45
µm
+20
µm
–20
µm
Type 3 + 45 µm +25 µm +20 µm –20 µm
T
ype 4 + 38 µm
+20
µm
–20
µm
T
ype 5 + 30 µm
+15
µm
–15
µm
T
ype 6 + 15 µm
+5
µm
–5
µm
IPC-TM-650
Number
2.2.14.2
Subject
Solder
Powder Particle Size Distribution—Optical Image
Analyzer Method
Date
1/95
Revision
P
age2of2
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
1.0
Scope
This
test method is designed to determine the
maximum (average) solder particle size in a solder paste using
a fineness of grind gauge.
2.0 Applicable Documents
ASTM D-1210-79
Fineness
of Dispersion of Pigment-Vehicle
Systems
3.0
Test Specimen
At
least 100 grams of uniformly mixed
solder paste.
4.0
Equipment/Apparatus
Gauge-Hegman
Type CMA
185*, or equivalent, in accordance with ASTM D1210-79. A
hardened steel, stainless steel, or chrome-plated steel block
approximately 175 mm in length, 65 mm in width, and 13 mm
thick.
The top surface of the block shall be ground smooth and flat
and shall contain one or two grooves 140 mm in calibrated
length and 12.5 mm wide parallel to the longer sides of the
block.
Each groove shall be tapered uniformly in depth lengthwise
from a suitable depth (for example 50 to 100 micrometers) at
10 mm from one end to zero depth at the other with interme-
diate calibrations in accordance with the depth at these
points.
Scraper—A single- or double-edged hardened steel, stainless
steel, or chrome-plated steel blade 90 mm long, 38 mm wide,
and 6.4 mm thick. The edge or edges on the long sides shall
be straight and rounded to a radius of approximately 0.38
mm.
5.1
Test
5.1.1
Using
a fineness of grind gauge (Hegman) Type CMA
185 or equivalent in accordance with ASTM D-1210 deter-
mine the maximum and average particle size of the powder.
5.2
Evaluation
Acceptance
of each type of powder shall
be based on the specifications listed in Table 1. Enter the
results in Table 2 ‘‘Test Report on Solder Paste.’’
*Source:
Precision Gage & Tool Co. 28 Volkenand Ave., Dayton, Ohio
45410 513/254-8404
T
able 1
1st
4th Major
T
ype 1 160µm 150 µm 140 µm
Type 2 80µm 75 µm 65 µm
Type 3 50µm 45 µm 40 µm
Type 4 40µm 38 µm 35 µm
Type 5 30µm 25 µm 23 µm
Type 6 20µm 15 µm 15 µm
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062
IPC-TM-650
TEST
METHODS MANUAL
Number
2.2.14.3
Subject
Determination
of Maximum Solder Powder Particle
Size
Date
1/95
Revision
Originating Task Group
Solder Paste Task Group (5-24b)
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
age1of2
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ