IPC-TM-650 EN 2022 试验方法.pdf - 第335页

1 Scope This test method shall establish and define the methods for predicting the bond strength, on a go-no-go basis, of additive rigid epoxy glass boards of the swell- etchable type. 2 Applicable Documents ASTM-D1000 S…

6.3 The glass transition for a given material will be signifi-

cantly different if measured by DSC versus TMA. The test

equipment used should be noted beside the glass transition

valve, i.e., 136.4 °C (DSC) or 132.6 °C (TMA).

6.4 Cure Factor is also described as Delta T

6.5 Testing of single-sided or unclad laminates manufac-

tured without metallic cladding on either side.

6.5.1 Single-sided or unclad laminates exhibit unreliable

Cure Factor data, due to effects of moisture and other factors.

It is recommended that Cure Factor requirements not be

applied to these laminate configurations.

6.5.2 Single-sided or unclad laminates typically exhibit T

approximately 8 °C to 15 °C lower than equivalent laminates

that are clad on both sides. Accordingly, the specification

requirements should take this into consideration. Reasons for

the T

‘‘loss’’ include presence of moisture in the release films

used in place of metallic cladding.

IPC-TM-650

Number

2.4.25

Subject

Glass Transition Temperature and Cure Factor by DSC

Date

11/17

Revision

Page4of4

Scope

This

test method shall establish and define the

methods for predicting the bond strength, on a go-no-go

basis, of additive rigid epoxy glass boards of the swell-

etchable type.

Applicable Documents

ASTM-D1000 Standard Test Method for Pressure-Sensitive

Adhesive-Coated Tapes Used for Electrical and Electronic

Applications

3 Test Specimen

minimum of two boards per test, each

board having the dimensions of 76 mm x 152 mm

Apparatus

4.1

Liter

beakers with slotted lids

4.2

wooden wallpaper seam roller (see Figure 1 and Fig-

ure 2). The type in Figure 1 can be purchased in most hard-

ware shops, while the second roller is described in ASTM-

D100.

4.3

Instron or some other suitable peel tester, capable of

peeling at a 90° angle with a uniform, constant peel rate

4.4

Brand Filament tape, No. 898, or equal. A 6.4 mm

width size is convenient.

4.5

Chemicals

additive chemical pre-treatment

sequence from any of the major electronic chemical suppliers

may be used. While the IPC does not endorse any specific

chemical supplier, the chemical sequence should consist of

several items.

• Conditioner

• Etchant

• Neutralizer

Procedure

5.1 Test

5.1.1

Prepare

the processing chemistry in one liter beakers

in accordance with the chemical suppliers’ recommendations.

5.1.2

In order to ensure that vapors from the processing

solution do not attack the resin, some precaution should be

taken to maintain minimum exposure of the untreated board

area to vapors (e.g., use of a slotted lid over beaker). Also, no

more than 10 sample boards/liter of any of the process

chemicals shall be processed.

5.1.3

Partially

submerge a board (76 mm x 152 mm) in liter

beakers following the process below. That portion of the

board, not in the liquid, provides an ‘‘as is’’ surface as a con-

trol and base comparison.

IPC-2-4-26-1

Figure

1 Paper Roller

IPC-2-4-26-2

Figure

2 Uniform Pressure Roller

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.26

Subject

Tape

Test for Additive Printed Boards

Date

3/79

Revision

Originating Task Group

N/A

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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5.1.4

Process Sequence

For

a breakdown of time and

temperature requirements of this test, see Table 1.

5.1.5

Apply

tape to both the treated and non-treated sur-

faces of the board using a wooden roller and fixed uniform

pressure (approximately 4.5 kg.). Peel tape on Instron or other

peel tester at 900 angle and a 5 cm/min. peel rate. Report the

peel force as kg/cm on both treated and non-treated portions

board.

5.1.6 Use

two boards per test. Put tape on each side of the

board and obtain tape results for one tape strip per side per

board.

5.2

Evaluation

5.2.1

Report

the tape peel strength in kg/cm width.

5.2.2

Report

the locus of failure of peeled tape (see Note 1.).

Note 1: The requirement of specifying the locus of mode of

failure of the tape is very important and a critical aspect of the

test. In order to be consistent with descriptions of failure

modes, a common set of criteria is used, as defined in Table

2. Figure 3 shows, in schematic, the various failure modes one

could obtain during performing this test. The three layers, from

bottom to top, are (1) the epoxy/glass substrate, (2) the adhe-

sive component of the tape, and (3) the tape backing (see top

left drawing in Figure 3).

5.2.3 Report the average of the two tape peel strengths (in

kg/cm width) for the same side of both boards.

able 1 Process Sequence

emp (°C) Time (Min)

Conditioner

32 4

Rinse 16-27 2-3

Etch 66 6.5

Air Dry – 0.75

Triple Rinse 16-27 3-5

Neutralizer 52 2.5

Rinse 25 5

Air Dry 25 Overnight

Table 2 Modes of Failure Shown in Figure 3

Notation

Meaning of Failure Mode

A/-TB

Interfacial

failure, between adhesive

and tape backing

C Cohesive failure within tape adhesive

M Mixed failure mode, a combination of

the other types

B/A

Interfacial

failure, between the board

and the adhesive of the tape.

IPC-2-4-26-3

Figure

3 Modes of Failure

IPC-TM-650

Number

2.4.26

Subject

Tape

Test for Additive Printed Boards

Date

3/79

Revision

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