IPC-TM-650 EN 2022 试验方法.pdf - 第687页

1.0 Scope This test is conducted for the purpose of deter- mining the resistance of a material such as a laminate or mul- tilayer circuit board, to the shock of repeated exposures to extremes of high and low temperatures…

Scope

This

method is to determine the electrical perfor-

mance of multilayer printed wiring boards by following the

shock with an electrical continuity test as specified.

Applicable Documents

None

Test Specimen

Complete

multilayer printed wiring board

or qualification test board IPC-A-47.

Apparatus

4.1

standard AVCO 150 pneumatic drop shock tester, or

equivalent, capable of attaining at least 150 Gs.

4.2

High-speed

motion picture and oscilloscope photogra-

phy is not normally necessary and is not recommended for the

average ‘‘go no-go’’ testing program.

Procedure

5.1 Preparation

Fixture the test pattern boards so they are

restrained on all four edges. Fabricate the fixtures so that it

can be oriented to test the boards on three principle planes.

5.2

Test

Subject

each specimen to three shock pulses of

100 Gs with a duration of 6.5 milliseconds in each of the three

principle planes—a total of nine blows.

5.3

Evaluation

Subject

each specimen to a continuity test

as specified.

6 Notes

None

2215

Sanders Road

Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.6.5

Subject

Physical

Shock, Multilayer Printed Wiring

Date

05/04

Revision

Originating Task Group

Rigid Printed Board Performance Task Group

(D-33a)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.

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TION CONNECTING

ELECTRONICS INDUSTRIES

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1.0

Scope

This

test is conducted for the purpose of deter-

mining the resistance of a material such as a laminate or mul-

tilayer circuit board, to the shock of repeated exposures to

extremes of high and low temperatures for comparatively

short periods of time.

2.0

Applicable documents

None

3.0

Test specimen

The

test specimen for this test shall be

a sheet of laminate material at least 6 inch x 6 inch by the

thickness of the laminate. In the case of multilayer boards, the

test specimen shall be the entire qualification specimen

detailed in part 5.8.4 of this publication.

4.0

Apparatus

chamber automatic temperature cycling

equipment suitable for the temperature extremes specified

herein. The air temperature shall be maintained by forced air

circulation. The chamber shall have sufficient heating or cool-

ing capacity to maintain the specified air temperature.

5.0

Procedure

5.1 Conditions

During

the exposures, maintain the cham-

ber at the temperatures shown below:

Class

A Class B

Step

emp.

(°C)

Time

(Min.)

Temp.

(°C)

Time

(Min.)

1 125+3/–0 30 85+3/–0 30

2 25+10/–5 10–15 25+10/–5 10–15

3 –65+0/–5 30 –55+0/–5 30

4 25+10/–5 10–15 25+10/–5 10–15

5.2 Preparation

The

test specimen must be cleaned of

dirt, grease, and other contaminants prior to the thermal

exposure. The test specimen should be cleaned by wiping

with a dry, clean lint-free cloth, or wiped with a clean lint-free

cloth dampened with acetone or isopropyl alcohol. The speci-

men must be allowed to air dry prior to thermal exposure.

5.3

Test exposure

The

test specimen must be placed in

the thermal chamber maintained at the temperature specified

in Step 1 for the appropriate test condition. The test specimen

must be maintained at each temperature in the order speci-

fied. Throughout the test, the specimen must be placed in

such a position so that there is essentially no obstruction to

the flow of air around them. The specimen should be sub-

jected to the specified temperatures in the sequence specified

for a total of five cycles performed continuously.

5.4

Upon

copulation of the five temperature cycles, allow

the specimen to return to room temperature. Visually inspect

the specimen in accordance with detailed requirements.

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.6.6

Subject

Temperature

Cycling, Printed Wiring Board

Date

12/87

Revision

Originating Task Group

N/A

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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1.0

Scope

The

purpose of this method is to determine the

physical endurance of printed boards to sudden exposure to

extreme changes in temperature and the effect of alternate

exposures to these extremes. The exposure of the printed

board specimens to the high and low temperature extremes is

designed to cause physical damage, deterioration, or signifi-

cant changes in resistance.

2.0

Applicable Documents

IPC-D-275

Design

Standard for Rigid Printed Boards and

Rigid Printed Board Assemblies.

3.0

Test Specimen

Test

coupon ‘‘D’’ from IPC-D-275 or

other suitable test coupon (see 6.1a).

4.0

Apparatus

4.1

automatically controlled dual temperature environ-

mental test chamber or other dual chamber apparatus

capable of maintaining –65, –55, –40 or 0°C+0–5°C [–85,

–67, –40, +32°F+0–9°F] in the low temperature chamber

and 70, 85, 105, 125, 150 or 170 +5 –0°C [158, 185, 221,

257, 302 or 338° F+9–0°F] in the high temperature chamber.

NOTE: The temperature extremes (high and low) that are

required is dependent on the base material of the specimen

that is to be tested (see 6.1b ). The recovery capacity of the

test chambers shall be such that the internal chamber air tem-

perature shall reach the specified temperature within 2 min-

utes after the specimen(s) have been transferred to the test

chamber.

4.2

electrical resistance meter capable of accuracies of

0.5 milliohm or better with Kelvin (4 terminal) type leads. A

Kelvin type double bridge or potentiometer of the specified

accuracy may also be used (see 6.2).

5.1

Preparation

Wire

up test specimen with Kelvin-type

leads at the points where measurements will be made.

5.1.1

Operate

chamber (or chambers) and allow to stabilize

at the high and low temperature required. Clamp or suspend

specimen in the approximate center of the high temperature

chamber. First specimens shall be placed approximately 13

mm [0.5 in] apart and aligned in a manner to permit maximum

heat transfer to the test specimen(s).

5.2

Test

5.2.1 Thermal Shock Cycle

5.2.1.1

The

specimens shall be subjected to 100 tempera-

ture cycles in accordance with the applicable test condition of

Table 1.

5.2.1.2

Transfer

time between chambers shall be less than

2 minutes. The thermal capacity of the test chamber used

shall be such that the ambient temperature shall reach the

specified temperature within 2 minutes after the specimen has

been transferred to the appropriate chamber.

5.2.1.3

Interconnection

resistance measurements shall be

taken before the test, during the first cycle at high tempera-

ture, and during the last cycle at high temperature. In-cham-

ber resistance measurements should be taken during the last

few minutes of chamber exposure. Care should also be taken

to measure samples after approximately the same duration at

chamber temperature.

5.3

Evaluation

The

maximum change in resistance

between the first and 100th cycle shall be evaluated for

acceptability to the requirements of the applicable specifica-

tion.

6.0 Notes

6.1

The

following details are to be specified in the applicable

performance specification:

a. Test specimen, if other than specified in 3.0.

b. Test condition, if other than specified in 4.1.

c. Maximum change in resistance.

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.6.7

Subject

Thermal

Shock & Continuity, Printed Board

Date

8/97

Revision

Originating Task Group

Rigid Board T.M. Task Group, 7-11d

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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