IPC-TM-650 EN 2022 试验方法.pdf - 第113页

1 Scope This test method covers acceptance of incoming copper clad epoxy-glass laminates ranging in thickness from 0.8 mm to 6.5 mm, clad on one or both sides. It provides for a standard method of inspection and establis…

Main image (Height) S-L surface Material ratio curve

Angular spectrum

Autocorrelation function

2.66um

IPC-TM-650

Number

2.2.22

Subject

Noncontact Metallic Foil Surface Topography/Texture

Date

5/20

Revision

Page5of5

Scope

This

test method covers acceptance of incoming

copper clad epoxy-glass laminates ranging in thickness from

0.8 mm to 6.5 mm, clad on one or both sides. It provides for

a standard method of inspection and establishes operations

that simulate the manufacture of PWBs. Specific values for the

acceptability are based on copper foil adhesion and visual

surface condition of the base laminate.

Applicable Documents

MIL-STD-105

Sampling

Procedures and Tables for Inspec-

tion by Attributes

MIL-P-13949 Plastic

Sheet, Laminated, Copper-Clad (For

Printed Wiring)

Test Specimen

3.1 Specimen

One

specimen shall be tested for each

sample, except in the case where material is clad on both

sides, in which case two specimens shall be processed for

each sample (one for each surface). Each specimen will have

four readings.

3.2

Sampling

The

sampling procedure will be to MIL-STD-

105. The inspection level shall be S-2 at 6.5 A.Q.L.

Apparatus

4.1

Complete

photo processing facilities

4.2

Etching

facilities

Procedures

5.1 Print and Etch

For

print and etch testing use 5.3.1,

5.3.2, 5.3.4, 5.3.5, 5.3.7, 5.3.8, 5.3.9, 5.3.10, and 5.3.11

only.

5.2

Print, Etch, and Plate

For

print, etch, and plate test-

ing, use 5.3.1 through 5.3.11 inclusively.

5.3

Steps

5.3.1 Preparation

5.3.1.1

Sand

the edges of the test specimens to remove

burrs, allowing close contact between the specimen, nega-

tive, and frame glass, resulting in a better defined etched pat-

tern.

5.3.1.2

Scrub

the copper surface(s) with FFF pumice and

brush to remove any contamination on the surface of the

specimen until it passes a water break test.

5.3.1.3

Dry

using compressed filtered air.

5.3.2

Apply Resist

5.3.2.1

Dip

the specimens in the following photo-resist solu-

tion:

• One part KPR III

• One part Toluene

• One part Acetone

All parts are by volume and should be used at room tempera-

ture. Specific gravity of the solution is 0.920.

5.3.2.2

Hold the specimen by one corner when dipping.

Allow excess solution to drain until dripping stops.

5.3.2.3

Put

the specimens on the rack (after draining) into

80°C oven for three to five minutes to dry and harden KPR.

5.3.2.4

Remove

the rack from the oven and allow the speci-

mens to cool to room temperature.

5.3.2.5

Place

the specimens upon the negative in the print-

ing frame with the copper side against the negative.

5.3.2.6

Expose

the mounted specimen for seven minutes,

75 mm from the fluorescent black light.

5.3.2.7

Develop

in trichlorethylene vapor for 15 seconds. It

may require two to six cycles until the pattern is clear. Air dry

the specimen after developing.

5.3.2.8

Use

artwork from MIL-P-13949.

5.3.3 Etch

per MIL-P-13949, Method A or B

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.3.1

Subject

Chemical

Processing, Suitable Processing Material

Date

4/73

Revision

Originating Task Group

N/A

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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5.3.4

Drill

1.5 mm holes in the pads of the 3 mm lines with

good fabricating practice.

5.3.5

Remove the developed KPR by rubbing the pattern

lightly with cold trichlorethylene liquid. Rinse in water. Scrub

the specimens with FFF pumice and water with a strong

bristle brush.

5.3.6 Plate

(this is simulated plating) per MIL-P-13949.

5.3.7 Deoxidize

by dipping in 10% hydrochloric acid for two

minutes and wash in running water for five minutes. Dry 30

minutes, minimum, at 105°C to110°C.

5.3.8

Coat

the etched copper surface with white petrola-

tum. Specimens shall be immersed horizontally in solder 6.5

mm below the surface for 20 ± 1 seconds at 260°C +5/-0°C

measured 25 mm below the surface.

5.3.9

Remove

the petrolatum from the surface of the speci-

men with a two minute scrub in cold trichlorethylene, followed

by a one minute rinse in hot trichlorethylene.

5.3.10

Inspect

the surface for weave exposure, measling,

crazing, resin loss, delamination, and blistering.

5.3.11

Test

four 1 mm lines on the specimen for peel

strength per MIL-P-13949, reporting the average value for the

four lines.

IPC-TM-650

Number

2.3.1

Subject

Chemical

Processing, Suitable Processing Material

Date

4/73

Revision

age2of2

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