IPC-TM-650 EN 2022 试验方法.pdf - 第343页

T able 1 T est Report on Solder Paste Enter appropriate information in top portion of report and complete report by entering the test results or checkmarks in the appropriate spaces. Inspection Purpose: QPL I.D. Number: …

1.0

Scope

The

test specifies a standard procedure for

determining the viscosity of solder paste in the range of

300,000 to 1,600,000 centipoise.

2.0

Applicable Documents

None

3.0

Test Specimen

Paste

to be tested shall be stabilized

at 25° ± 1°C for a minimum of 24 hr. prior to testing. The

paste volume shall be sufficient to fill a test container having a

minimum diameter of 5 cm and a minimum depth of 5 cm.

4.0

Equipment/Apparatus

The

equipment used shall be a

spindle type viscometer (Brookfield RVTD or equivalent) with a

reversible helipath stand and pen recorder. A TF spindle shall

be used for tests and operated at 5 rpm. Other equipment

may be used provided the results can be empirically corre-

lated as mutually agreed upon with the following test. Addi-

tional shear rates may be specified by the user or supplier

provided one data point is based as specified below.

5.0

Procedure

5.1 Preparation

5.1.1

Open

the supply container(s); remove any internal cov-

er(s), scrape off paste adhering to the lid(s), internal covers,

and the container walls; and add this material to the paste in

the supply container(s).

5.1.2

Using

a spatula, stir the paste gently for 1 to 2 minutes

to homogenize it; taking care to avoid the introduction of air.

5.1.3

necessary, gently transfer the paste to the test con-

tainer having the specified volume; without introducing air.

Note:

the supply container meets the volume and size

requirements a separate test container is not needed.

5.1.4

The

test container shall be placed in a constant tem-

perature environment at 25 ± 0.25°C. The solder paste shall

remain stationary for a minimum of two hours to reach tem-

perature and rheological equilibrium. For freshly manufactured

products, products which require significant adjustment with

thinner (greater than 1/2% by weight), or products having

rheological characteristics requiring longer time to stabilize,

the stabilization time shall be increased to four hours or as

mutually agreed upon by user and supplier.

5.1.5 Set

the bottom stop for helipath travel to position the

T spindle at 2.8 cm below the surface of the solder paste in

the test container. The bottom stop of the spindle shall be a

minimum of 1 cm above the bottom of the container. Set the

upper stop to position the spindle at 0.3 cm below the surface

of the solder paste.

5.2

Test

5.2.1

Immerse

the spindle in the solder paste and record

data for 10 minutes (5 cycles). The temperature of the solder

paste during the test shall be maintained at 25 ± 0.25°C.

5.3

Evaluation

Viscosity

is to be expressed at the value

calculated from the average of the peak and valley of the last

two cycles. If the average for the first two cycles is more than

10% higher than the last two cycles, the test is invalid and

additional equilibrium time is required. Record data and enter

in Table 1, ‘‘Test Report on Solder Paste.’’

6.0 Notes

6.1

Test Equipment Sources

The

equipment sources

described below represent those currently known to the

industry. Users of this test method are urged to submit addi-

tional source names as they become available, so that this list

can be kept as current as possible.

6.1.1

Spindle Type Viscometer Equipment

Brookfield

Engineering Laboratories, Inc.

240 Cushing Street

Stoughton, MA 02072

(617) 344-4310

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.34

Subject

Solder

Paste Viscosity—T-Bar Spin Spindle Method

(Applicable for 300,000 to 1,600,000 Centipoise)

Date

1/95

Revision

Originating Task Group

Solder Paste Task Group (5-24b)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

age1of2

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able 1 Test Report on Solder Paste

Enter appropriate information in top portion of report and complete report by entering the test results or checkmarks in the appropriate spaces.

Inspection Purpose: QPL I.D. Number:

Qualiﬁcation Manufacturer’s Identiﬁcation:

__ Quality Conformance A Manufacturer’s Batch Number:

Quality Conformance B Date of Manufacture:

Shelf-Life Extension Original Use-By Date:

Performance Revised Use-By Date:

Date

Inspection Completed:

Overall

Results: __ Pass __ Fail

Inspection Performed by:

itnessed by:

Inspections

User’s

Actual

Requirement Test Result P/F (*) Tested by & Date

Material

Visual

Metal Content

Viscosity

Solder Ball

Slump

Alloy

Flux

Powder Size

% In Top Screen

% In Next Screen

% In Bottom Screen

% In Receiver Bottom

Max. Powder Size

Powder Shape

Tack

Wetting

* P/F = PASS/FAIL; enter P if test results are within tolerance of actual requirement; otherwise, enter F

IPC-TM-650

Number

2.4.34

Subject

Solder

Paste Viscosity—T-Bar Spin Spindle Method (Applicable

for 300,000 to 1,600,000 Centipoise)

Date

1/95

Revision

age2of2

电子技术应用　　　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ

1.0

Scope

This

test specifies a standard procedure for

determining the viscosity of solder paste in the range of

50,000 to 300,000 centipoise.

2.0

Applicable Documents

None

3.0

Test Specimen

Paste

to be tested shall stabilize at

25°C ± 1°C for a minimum of 24 hours prior to testing. The

paste volume shall be sufficient to fill a test container having a

minimum diameter of 5 cm and a minimum depth of 5 cm.

4.0

Equipment/Apparatus

Equipment

used shall be a

spindle type viscometer (Brookfield RVTD or equivalent) with a

helipath stand and pen recorder. A TC spindle shall be used

for tests. Spindle speed is 5 rpm. Other equipment may be

used provided the results can be empirically correlated as

mutually agreed upon with the following test. Additional shear

rates may be specified by the user or supplier provided one

data point is based as specified below.

5.0

Procedure

5.1 Preparation

5.1.1

Open

the supply container(s); remove any internal cov-

er(s); scrape off paste adhering to the lid(s), internal covers,

and the container walls; and add this material to the paste in

the supply container(s).

5.1.2

Using

a spatula, stir the paste gently for 1 to 2 minutes

to homogenize it; taking care to avoid the introduction of air.

5.1.3

necessary, gently transfer the paste to the test con-

tainer having the specified volume—without introducing air.

Note: If the supply container meets the volume and size

requirements, a separate test container is not needed.

5.1.4

The

test container shall be placed in a constant tem-

perature environment at 25°C ± 0.25°C.

5.1.5

After

reaching 25°C ± 0.25°C, the solder paste shall

be stirred and then tested within 20 minutes to minimize set-

tling of the metal powder; while remaining at 25°C.

5.2

Test

5.2.1

Set

the solder paste container below the spindle.

Record data as the spindle penetrates the solder paste.

5.3

Evaluation

The

viscosity is calculated from the value

recorded after the bar of the spindle comes in contact with the

surface of the paste. Record the data in Table 1 ‘‘Test Report

on Solder Paste.’’

6.0 Notes

6.1

Test Equipment Sources

The

equipment sources

described below represent those currently known to the

industry. Users of this test method are urged to submit addi-

tional source names as they become available, so that this list

can be kept as current as possible.

6.1.1

Spindle Type Viscometer Equipment

Brookfield

Engineering Laboratories, Inc.

240 Cushing Street

Stoughton, MA 02072

(617) 344-4310

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.34.1

Subject

Solder

Paste Viscosity—T-Bar Spindle Method

(Applicable at less than 300,000 Centipoise)

Date

1/95

Revision

Originating Task Group

Solder Paste Task Group (5-24b)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

age1of2

电子技术应用　　　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ