IPC-TM-650 EN 2022 试验方法.pdf - 第78页
1.0 Scope To measure the inside diameter of drilled through-holes in printed wiring boards, either in process or end product. 2.0 Applicable Documents IPC-D-300 Dimensions and Tolerances, Printed Wiring Boards, Single an…
1.0
Scope
This
test method is to describe the procedures
to be used for performing dimensional inspections on micro-
sections of printed boards. This method does not apply to
measurements less than 1.25 µm (0.00005 in). This method is
intended to supersede IPC-TM-650, Methods 2.2.9 and
2.2.11.
2.0
Applicable Documents
IPC-TM-650
Method
2.1.1
IPC-TM-650
Method
2.1.1.2
IPC-A-600
Acceptability
of Printed Boards
3.0
Test Specimens
The
test specimens are to be micro-
sections of printed boards or the associated quality conform-
ance test circuitry prepared in accordance with IPC-TM-650,
Methods 2.1.1 or 2.1.1.2.
4.0
Apparatus or Material
4.1
Metallographic
equipment and consumables as
described in IPC-TM-650, Methods 2.1.1 or 2.1.1.2.
4.2 In
addition, the microscope or metalllograph described
in Methods 2.1.1 or 2.1.1.2 shall be equipped with a measur-
ing reticle or filar eyepiece.
4.2.1 Reticle
or Filar Micrometer attachment to Optical
Inspection Aid that contains gradiations or a scale, which will
provide a minimum measurement resolution of 50% of the last
significant digit of the referenced dimensional requirement.
The Reticle or Filar Micrometer should be calibrated at the
given magnification to ascertain the distance in µm (inches)
between each division.
5.0
Procedure
5.1
The
dimensional inspections are to be performed on
freshly prepared and etched microsections. When oxidation
and/or staining are present that would inhibit the clear viewing
of the areas to be measured the microsections(s) shall be pre-
pared again beginning with the finest grinding step in the met-
allographic preparation sequence.
5.2 The
microscope’s or metallograph’s measuring reticle or
filar eyepiece shall be calibrated in accordance with the manu-
facturer’s instructions using a stage micrometer. The calibra-
tion frequency shall be at a minimum of one (1) year intervals
or more frequently, if required, to maintain accuracy of the
dimensional inspections.
5.3
Attributes
that can be measured using microsections of
printed boards include but are not limited to: plating , coating,
or solder resist thickness, the size of laminate voids or cracks,
the amount of positive or negative etchback, conductor thick-
ness, dielectric spacing, either laterally or vertically, annular
ring width, layer-to-layer registration, or the extent of wicking.
5.4
Select
a magnification that allows clear viewing of the
areas containing the attributes to be measured. For instance,
when viewing multilayer printed boards with plated-through
holes or vias for layer-to-layer registration, magnifications of
50X to 100X would be used. When measuring plating thick-
nesses of electrodeposited copper or nickel, a magnification
of 200X would be used.
5.5
Read
and record the dimensions for the attributes(s) to
be measured using the same number of significant digits
specified by the drawing, standard, or specification as a mini-
mum or maximum limiting value.
6.0 Notes
6.1
Measurements
less than 1.25 µm (0.00005 in) cannot
accurately be made using optical techniques. Electronic mea-
surement techniques should be considered for these mea-
surements.
6.2
IPC-A-600
contains figures and diagrams which depict
microsectional attributes and measurements.
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062
IPC-TM-650
TEST
METHODS MANUAL
Number
2.2.5
Subject
Dimensional
Inspections Using Microsections
Date
8/97
Revision
A
Originating Task Group
Rigid Board T.M. Task Group, 7-11d
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
age1of1
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1.0
Scope
To
measure the inside diameter of drilled
through-holes in printed wiring boards, either in process or
end product.
2.0
Applicable Documents
IPC-D-300
Dimensions
and Tolerances, Printed Wiring
Boards, Single and Two-Sided Rigid Boards.
IPC-A-600 Acceptability
of Printed Wiring Boards.
3.0
Test Specimen
Sample
board or production printed
wiring board; in either case, the specimen shall have identical
drilling or punching characteristics without through-hole
punching.
4.0
Apparatus
Stereoscopic
Microscope with 10x magnifi-
cation, micrometer scale eye piece, and illuminator or equal.
5.0
Procedure
5.1 Measurement
Set
the microscope on 10x magnifica-
tion and measure the inside diameter of the hole from one
side of the hole to the other side at the widest part of the hole.
5.2
Evaluation of Test
Record
measurements of drilling
and punching characteristics.
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062
IPC-TM-650
TEST
METHODS MANUAL
Number
2.2.6
Subject
Hole
Size Measurement, Drilled
Date
8/97
Revision
A
Originating Task Group
N/A
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
age1of1
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
1.0
Scope
To
measure the inside diameter of plated
through holes in printed wiring boards.
2.0
Applicable documents
None.
3.0
Test Specimen
Production
board or test pattern,
number and design of holes shall be determined by agree-
ment between vendor and customer or applicable drawings.
4.0
Apparatus
4.1 Stereoscopic microscope
With
20x magnification
micrometer scale eye piece and illuminator.
5.0
Procedure
5.1 Measurement
Set
the microscope on 20x magnifica-
tion and measure the inside diameter of the hole from one
side to the other side at the largest point.
5.2
Evaluation of test
Record
measurements and note if
voids and nodules were present.
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062
IPC-TM-650
TEST
METHODS MANUAL
Number
2.2.7
Subject
Hole
Size Measurement, Plated
Date
5/86
Revision
A
Originating Task Group
Printed Board Test Methods Task Group (7-11d)
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
age1of1
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ