IPC-TM-650 EN 2022 试验方法.pdf - 第272页
Figure 2 Aid to Evaluation IPC-2412-2a-d IPC-TM-650 Number 2.4.12 Subject Solderability, Edge Dip Method Date 6/91 Revision A P a g e3o f3 电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
IPC-2412-1
Figure
1 Suggested Dipping Device
IPC-TM-650
Number
2.4.12
Subject
Solderability,
Edge Dip Method
Date
6/91
Revision
A
P
age2of3
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Figure
2 Aid to Evaluation
IPC-2412-2a-d
IPC-TM-650
Number
2.4.12
Subject
Solderability,
Edge Dip Method
Date
6/91
Revision
A
P
age3of3
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
1
Scope
This
test method establishes and defines the pro-
cedures for determining the solder float resistance of copper
foil clad and bare flexible dielectric material.
2
Applicable Documents
J-STD-004
Requirements
for Soldering Fluxes
3
Test Specimen
3.1
Two
specimens, approximately 50 mm x 50 mm per
clad side.
3.2
For
double clad laminate, a separate specimen unit shall
be prepared and tested for each side. The copper foil shall be
etched from the reverse or nontest side of each specimen
using standard commercial practices. Bare dielectric material
shall be tested bare.
4
Apparatus
4.1 Test Chamber
A
circulating air chamber capable of
maintaining a uniform temperature of 135°C ± 10°C.
4.2
Solder Pot
An
electrically-heated, thermostatically-
controlled solder pot of adequate dimensions to accommo-
date the specimen and containing no less than 2.25 Kg of
solder.
4.3
Cutter
template and cutter to prepare approximately 50
mm x 50 mm specimens of copper clad dielectric material.
4.4
Solder
float test fixture as per Figure 1.
4.5
Sn60,
Sn62, or Sn63 solder conforming to J-STD-004.
5
Procedure
5.1
Prepare
two specimens, clean the copper foil, then pre-
condition the test specimen in an air circulating oven main-
tained at 135°C ± 10°C for one hour. Specimens may then be
held in a room temperature desiccator.
5.2
Remove
the specimens from the conditioning chamber.
5.3 Attach
the specimens to the solder float test fixture with
a thumb tack or other low mass holding device (Figure 1) prior
to floating the sample. Float the specimen, foil side down, on
the surface of the molten solder, maintained at the tempera-
ture specified in Table 1, for 10 seconds.
T
able 1 Solder Float Temperatures
Method
A 260°C ± 5°C
Method B 288°C ± 5°C
5.4
Float
the specimen on the surface, then remove the
specimens and tap the edges to remove excess solder.
5.5
Evaluation
Thoroughly
clean each specimen and visu-
ally examine for blistering, delamination or wrinkling. For bare
dielectric films, examine for blistering, shrinkage, distortion or
melting.
6 Notes
6.1
For
materials that absorb moisture, the preconditioning
in this method is required to remove absorbed moisture from
the materials. Absorbed moisture can volatilize and cause
delamination and blistering because of the rapid temperature
rise experienced in the solder bath. Drying may not be
required for materials with low moisture absorption character-
istics.
IPC-1412-1
Figure
1 Solder float test fixture
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
IPC-TM-650
TEST
METHODS MANUAL
Number
2.4.13
Subject
Solder
Float Resistance Flexible Printed Wiring
Materials
Date
5/98
Revision
F
Originating Task Group
Flex Peel Strength Test Methods Task
Group (D-13A)
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
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